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Segmented sputtering target and method/apparatus for using same

  • US 6,878,242 B2
  • Filed: 04/08/2003
  • Issued: 04/12/2005
  • Est. Priority Date: 04/08/2003
  • Status: Expired due to Term
First Claim
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1. A rotating sputtering target for depositing layers of different material, the rotating sputtering target comprising:

  • a continuous outer periphery to be sputtered, the continuous outer periphery being circular in shape when viewed cross sectionally, the continuous outer periphery of the rotating sputtering target comprising, around its circumference, a plurality of immediately adjacent segments of different materials to be sputtered for forming respective different layers on a substrate, and wherein the segments of different materials are located at different radial locations around the circumference of the rotating sputtering target.

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