Electronic unit integrated into a flexible polymer body

• US 6,878,643 B2
• Filed: 12/18/2002
• Issued: 04/12/2005
• Est. Priority Date: 12/18/2002
• Status: Active Grant

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Rose, Klint A., Krulevitch, Peter A., Hamilton, Julie K., Benett, William J., Maghribi, Mariam N., Davidson, James Courtney, Strauch, Mark S.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): HOANG, QUOC DINH
• Application Number:
  US10/323,219
• Publication Number:
  US 20040121528A1
• Time in Patent Office: 846 Days
• Field of Search: 438/780, 438/6, 438/7, 438/29, 438/107
• US Class Current: 438/780
• CPC Class Codes: A61B 2560/0412 Low-profile patch shaped housings
• CPC Class Codes: A61N 1/0452 Specially adapted for transcutaneous muscle stimulation [TMS]
• CPC Class Codes: A61N 1/0456 Specially adapted for transcutaneous electrical nerve stimulation [TENS]
• CPC Class Codes: A61N 1/0476 Array electrodes (including any electrode arrangement with more than one electrode for at least one of the polarities)
• CPC Class Codes: A61N 1/0492 Patch electrodes A61N1/0412, A61N1/0428 take precedence
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/065 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/09118 Moulded substrate

Abstract

A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.

Claims

1. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicone on said silicone layer,

providing at least one electronic unit connected to said metal layer, and

removing said electronic apparatus from said matrix wherein said silicone layer and said second layer of a silicone provide a spherical silicone body.

2. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicone on said silicone layer,

providing at least one electronic unit connected to said metal layer, and

removing said electronic apparatus from said matrix wherein said silicone layer and said second layer of a silicone provide a transparent spherical silicone body containing a solar cell and a MEMS sensor.

3. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicon on said silicone layer,

providing at least one electronic unit connected to said metal layer, and

removing said electronic apparatus from said matrix wherein said at least one electronic unit comprises a MEMS sensor.

4. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicon on said silicone layer,

providing at least one electronic unit connected to said metal layer, and

removing said electronic apparatus from matrix wherein said step of removing said electronic apparatus from said matrix provides a tacky surface on said electronic apparatus.

5. The method of fabricating an electronic apparatus of claim 4 including the step of using said tacky surface to attach said electronic apparatus to an external surface.

6. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicon on said silicone layer,

providing at least one electronic unit connected to said metal layer,

removing said electronic apparatus from said matrix, and

attaching said electronic apparatus to an external surface.

7. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicon on said silicone layer,

providing at least one electronic unit connected to said metal layer,

removing said electronic apparatus from said matrix, and

attaching said electronic apparatus to eyeglasses.

8. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicon on said silicone layer,

providing at least one electronic unit connected to said metal layer,

removing said electronic apparatus from said matrix, and

implanting said electronic apparatus.

9. A method of fabricating an electronic apparatus, comprising the steps of:

providing a silicone layer on a matrix,

providing a metal layer on said silicone layer,

providing a second layer of silicon on said silicone layer,

providing at least one electronic unit connected to said metal layer,

removing said electronic apparatus from said matrix, and

distributing said electronic apparatus.

10. The method of fabricating an electronic apparatus of claim 9 wherein said step of distributing said electronic apparatus comprises distributing said electronic apparatus from an aircraft.

11. The method of fabricating an electronic apparatus of claim 9 wherein said step of distributing said electronic apparatus comprises distributing said electronic apparatus from a vehicle.