Split barrier layer including nitrogen-containing portion and oxygen-containing portion

• US 6,879,046 B2
• Filed: 01/02/2002
• Issued: 04/12/2005
• Est. Priority Date: 06/28/2001
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Gibson, Gerald W Jr., Vitkavage, Susan Clay, Steiner, Kurt George, Lytle, Steven Alan, Jessen, Scott
• Primary Examiner(s): Eckert, George
• Assistant Examiner(s): Chu, Chris C.
• Application Number:
  US10/038,371
• Publication Number:
  US 20030003765A1
• Time in Patent Office: 1,196 Days
• Field of Search: 257750-760, 257/762, 438/760, 174/258, 174/256, 428/428, 428/446, 428/447, 428/448, 428/209, 428/210, 428/901
• US Class Current: 257/760
• CPC Class Codes: H01L 21/02126 the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• CPC Class Codes: H01L 21/02203 the layer being porous
• CPC Class Codes: H01L 21/02216 the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
• CPC Class Codes: H01L 21/02274 in the presence of a plasma [PECVD]
• CPC Class Codes: H01L 21/02315 treatment by exposure to a plasma
• CPC Class Codes: H01L 21/02362 formation of intermediate layers, e.g. capping layers or diffusion barriers
• CPC Class Codes: H01L 21/312 Organic layers, e.g. photoresist H01L21/3105, H01L21/32 take precedence; photoresists per se G03C
• CPC Class Codes: H01L 21/3146 Carbon layers, e.g. diamond-like layers
• CPC Class Codes: H01L 21/31633 Deposition of carbon doped silicon oxide, e.g. SiOC
• CPC Class Codes: H01L 21/31695 Deposition of porous oxides or porous glassy oxides or oxide based porous glass
• CPC Class Codes: H01L 21/76801 characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
• CPC Class Codes: H01L 21/76808 involving intermediate temporary filling with material
• CPC Class Codes: H01L 21/76829 characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
• CPC Class Codes: H01L 21/76832 Multiple layers
• CPC Class Codes: H01L 21/76834 formation of thin insulating films on the sidewalls or on top of conductors H01L21/76831 takes precedence
• CPC Class Codes: H01L 21/76835 Combinations of two or more different dielectric layers having a low dielectric constant H01L21/76832 takes precedence
• CPC Class Codes: H01L 23/53238 Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 23/5329 Insulating materials
• CPC Class Codes: H01L 23/53295 Stacked insulating layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/31663 : As siloxane, silicone or silane

Abstract

A split barrier layer enables copper interconnect wires to be used in conjunction with low-k dielectric films by preventing the diffusion of N—H base groups into photoresists where they can render the photoresist insoluble. The split barrier layer is disposed between the copper and the low-k dielectric and includes a nitrogen-containing, oxygen-free film which contacts the copper, and an oxygen-containing, nitrogen-free film which contacts the low-k dielectric film. The nitrogen-containing film prevents the formation of undesirable copper oxides, and the oxygen-containing film prevents the diffusion of N—H base groups into the low-k dielectric films. The oxygen-containing film may be an oxygen-doped silicon carbide film in an exemplary embodiment. In another embodiment, a film stack of low-k dielectric films includes an etch-stop layer and hardmask each formed of oxygen-doped silicon carbide. The hardmask and etch-stop layer enable the formation of a dual-damascene opening in the film stack, and the film structure of the present invention precludes N—H base groups from diffusing from the low-k dielectric films and neutralizing acid catalysts in the photoresist used to define the dual damascene opening.

Claims

1. A semiconductor product comprising a barrier layer disposed between a copper-containing structure and a low-k dielectric film, said barrier layer comprising a composite film structure including a nitrogen-containing, substantially oxygen-free first film forming a boundary with said copper-containing structure and an oxygen-containing, substantially nitrogen-free second film forming a boundary with said low-k dielectric film in which said first film comprises nitrogen-doped silicon carbide and said second film comprises oxygen-doped silicon carbide.

2. The semiconductor product as in claim 1, in which said copper-containing structure comprises a surface including a copper wire formed within an insulating material.

3. The semiconductor product as in claim 1, in which said barrier layer is formed on said copper-containing structure and said low-k dielectric film is formed on said barrier layer.

4. The semiconductor product as in claim 3, further comprising an oxygen doped silicon carbide film formed over said low-k dielectric film, a further low k dielectric film formed over said oxygen-doped silicon carbide film and an oxygen-doped silicon carbide hardmask formed over said further low-k dielectric film.

5. The semiconductor product as in claim 4, in which said semiconductor product includes a two-tiered opening extending down from a top surface of said oxygen-doped silicon carbide hardmask, said two-tiered opening including a wider upper portion extending through said oxygen-doped silicon carbide hardmask, said further low-k dielectric film, and said oxygen doped silicon carbide film, and a lower, narrower portion extending through said low-k dielectric film, said second film, and said first film.

6. The semiconductor product as in claim 1, wherein said low-k dielectric film is formed of SiOC—

H.

7. The semiconductor product as in claim 1, wherein said low-k dielectric film has a dielectric constant less than 3.5.

8. A semiconductor product comprising a barrier layer disposed between a readily-oxidizable conductive material and a low-k dielectric film, said barrier layer comprising a composite film structure including a nitrogen-containing, substantially oxygen-free first film forming a boundary with said conductive material and an oxygen-containing, substantially nitrogen-free second film forming a boundary with said low-k dielectric film, each of said first film and said second film formed of silicon carbide.

9. A semiconductor product comprising a film stack including:

a lower low-k dielectric film;

an etch-stop layer formed over said low-k dielectric film;

an upper low-k dielectric film formed over said etch-stop layer; and

a hardmask layer formed over said upper low-k dielectric film, each of said etch-stop layer and said hardmask layer formed of oxygen-doped silicon carbide.

10. The semiconductor product as in claim 9, in which said film stack includes a two-tiered opening formed therein, said two-tiered opening including a wider upper portion disposed over a narrower lower portion,

said narrower lower portion extending through said lower low-k dielectric film,

said wider upper portion extending through said etch-stop layer, said upper low-k dielectric film and said hardmask layer, and

said two-tiered opening filled with a conductive material.

11. The semiconductor product as in claim 10, further comprising a composite film structure formed beneath said lower low-k dielectric film and including a nitrogen-doped silicon carbide film formed beneath an oxygen-doped silicon carbide film, and wherein said narrower lower portion further extends through said composite film structure and said two-tiered opening extends to a bottom surface formed of a further conductive material.

12. The semiconductor product as in claim 11, wherein said further conductive material comprises copper.

13. A semiconductor product comprising a film stack including:

a copper-containing surface;

a nitrogen-containing first barrier layer disposed over said copper-containing surface;

an oxygen-doped, substantially nitrogen-free second barrier layer disposed over said first barrier layer;

a first low-k dielectric film disposed on said second barrier layer;

an oxygen-doped silicon carbide etch-stop layer disposed over said first low-k dielectric film;

a second low-k dielectric film disposed over said etch-stop layer; and

an oxygen-doped silicon carbide hardmask film disposed over said second low-k dielectric film.