Packaged integrated antenna for circular and linear polarizations

• US 6,879,287 B2
• Filed: 05/24/2003
• Issued: 04/12/2005
• Est. Priority Date: 05/24/2003
• Status: Expired due to Fees

• Current Assignee: Agency For Science Technology and Research
• Original Assignee: Agency For Science Technology and Research
• Inventors: Popov, Alexander Pavlovich, Iyer, Mahadevan Krishna, Rotaru, Mihai Dragos
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): MANCUSO, HUEDUNG XUAN CAO
• Application Number:
  US10/445,091
• Publication Number:
  US 20040233107A1
• Time in Patent Office: 689 Days
• Field of Search: 343/700.MS, 343/785, 343/702, 343/829, 343/873, 343/846, 343/848
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/0485 Dielectric resonator antennas
• CPC Class Codes: H01Q 9/0492 circularly polarised

Abstract

A high radiation efficiency antenna system in a package is achieved by the provision of a Dielectric Resonator Package. A Dielectric resonator package comprises a dielectric body of the package forming a dielectric resonator that resonates at radio frequency and a feed substrate having an upper and a lower surface, a feed structure formed on the upper surface of the feed substrate, and RF circuitry mounted on the lower surface of the feed substrate. The feed substrate is attached to the dielectric body of the package from the side of the feed structure.

Claims

1. A dielectric resonator package comprising:

a dielectric resonator formed by a dielectric body of said dielectric resonator package and resonating at a radio frequency;

a feed substrate having an upper and a lower surface;

a first ground plane formed on said upper surface of said feed substrate and a second ground plane formed on said lower surface of said feed substrate;

a feed structure formed on said upper surface of said feed substrate wherein said feed substrate is attached inside of said dielectric body of said package from a side of said feed structure; and

radio frequency circuitry mounted on said lower surface of said feed substrate.

2. The package according to claim 1 wherein said dielectric resonator antenna has a high dielectric constant.

3. The package according to claim 1 wherein said dielectric resonator antenna has a symmetrical or asymmetrical shape.

4. The package according to claim 1 wherein said package is a stand alone package and wherein leads provide an electrical interface of operating at frequencies lower than said radio frequency.

5. The package according to claim 1 wherein said package is mounted on a printed circuit board.

6. The package according to claim 1 wherein said radio frequency circuitry is mounted on said lower surface of said feed substrate by wire bonding.

7. The package according to claim 1 wherein said radio frequency circuitry is mounted on said lower surface of said feed substrate by a flip-chip type connection.

8. A dielectric resonator antenna comprising:

a feed substrate having an upper and a lower surface;

a first ground plane formed on said upper surface of said feed substrate and a second ground plane formed on said lower surface of said feed substrate;

a dielectric resonator formed on said first ground plane;

an asymmetrical feed structure formed on said first ground plane wherein said asymmetrical feed structure excites modes in said dielectric resonator in orthogonal directions to provide circular polarized radiation; and

radio frequency circuitry mounted on said lower surface of said feed substrate and coupled to said feed structure.

9. The antenna according to claim 8 wherein said asymmetrical feed comprises:

a coplanar waveguide; and

a slot dipole having a bent folder.

10. The antenna according to claim 8 wherein said radio frequency circuitry is coupled to said feed structure by a via through said feed substrate.

11. The antenna according to claim 8 wherein said radio frequency circuitry is coupled to said feed structure by a microstrip line placed on said lower surface of said feed substrate.

12. The antenna according to claim 8 wherein said dielectric resonator comprises a dielectric body of a package for said radio frequency circuitry.

13. The antenna according to claim 12 wherein said feed substrate is mechanically attached to said dielectric body of said package from a side of said feed structure.

14. A dielectric resonator antenna comprising:

a feed substrate having an upper and a lower surface;

a first ground plane formed on said upper surface of said feed substrate and a second ground plane formed on said lower surface of said feed substrate;

a dielectric resonator formed on said first ground plane;

a feed structure formed on said first ground plane wherein said feed structure comprises both magnetic and electric dipoles to provide linear polarized radiation; and

radio frequency circuitry mounted on said lower surface of said feed substrate and connected to said feed structure by a via through said feed substrate.

15. The antenna according to claim 14 wherein said feed structure comprises:

a coplanar waveguide;

a slotted ring forming an equivalent electric dipole; and

a slotted dipole forming an equivalent magnetic dipole.

16. The antenna according to claim 14 wherein said radio frequency circuitry is coupled to said feed structure by a via through said feed substrate.

17. The antenna according to claim 14 wherein said radio frequency circuitry is coupled to said feed structure by a microstrip line placed on said lower surface of said feed substrate.

18. The antenna according to claim 14 wherein said dielectric resonator comprises a dielectric body of a package for said radio frequency circuitry.

19. The antenna according to claim 18 wherein said feed substrate is mechanically attached to said dielectric body of said package from a side of said feed structure.

20. A dielectric resonator package comprising:

a radio frequency micromodule assembled in a lower part of said package made of a dielectric material having a low dielectric constant;

a feed substrate comprising a portion of said lower part of said package;

a first ground plane formed on an upper surface of said feed substrate and a second ground plane formed on a lower surface of said feed substrate;

radio frequency circuitry mounted on said lower surface of said feed substrate in said radio frequency micromodule;

a feed structure formed on said first ground plane on top of said lower part of said package and connected to said radio frequency circuitry through a via; and

an upper part of said package comprising a dielectric resonator made of dielectric material having a high dielectric constant mounted on a side of said feed structure.

21. A dielectric resonator package comprising:

a feed ground plane having an upper and lower surface;

a first ground plane formed on said upper surface of said feed substrate and a second ground plane formed on said lower surface of said feed substrate;

radio frequency circuitry mounted on said lower surface of said feed ground plane;

a feed structure form on an upper surface of said feed ground plane; and

a dielectric resonator contacting said feed structure on said upper surface of said feed ground plane.

22. The package according to claim 21 wherein said dielectric resonator comprises a dielectric body of said package.

23. The package according to claim 21 wherein said radio frequency circuitry is connected to said feed structure by wire bonding.

24. The package according to claim 21 wherein said radio frequency circuitry is connected to said feed structure by flip chip.

25. The package according to claim 21 wherein ground pads of said radio frequency circuitry are connected to said feed ground plane.