Detecting the endpoint of a chamber cleaning

• US 6,881,276 B2
• Filed: 03/18/2003
• Issued: 04/19/2005
• Est. Priority Date: 08/01/1997
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Blonigan, Wendell T., Gardner, James T.
• Primary Examiner(s): Markoff, Alexander
• Application Number:
  US10/393,311
• Publication Number:
  US 20030159711A1
• Time in Patent Office: 763 Days
• Field of Search: 134/18, 134/22.1, 134/1, 134/1.1, 134/1.2, 134/1.3, 134/902, 422/62, 438/905, 156/345.25, 250/578.1
• US Class Current: 134/18
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases
• CPC Class Codes: H01J 37/32862 In situ cleaning of vessels and/or internal parts
• CPC Class Codes: H01J 37/32963 End-point detection
• CPC Class Codes: Y10S 438/905 Cleaning of reaction chamber

Abstract

A method and apparatus for cleaning a CVD chamber including optoelectronic detection of the completion or endpoint of the cleaning procedure once a ratio of emission lines reaches a threshold value. The method comprises the steps of: providing a plasma of a cleaning gas into the chamber and creating a plasma from the cleaning gas. The intensity of emission lines of the cleaning gas and of at least one background gas in the chamber are monitored. A ratio of the intensity of the cleaning gas emission line to the intensity of the background gas emission line is determined and monitored as a function of time. The determined ratio is compared to a preset threshold calibration value. The flow of gas is controlled based on the comparing step. The apparatus includes a cleaning gas supply with a valved inlet providing an entrance to the interior of the chamber for passing cleaning gas to the interior of the chamber. A detector having an optical input is disposed for sensing the electromagnetic radiation. The detector has a first channel for detecting a relative intensity of an emission line corresponding to the cleaning gas and a second channel for detecting a relative intensity of the emission line corresponding to the background gases. Software or circuitry is employed to determine a normalized signal using a signal from the first channel and a signal from the second channel. The value of the normalized signal is substantially invariant with respect to simultaneous corresponding changes in the intensity of the signal measured by the first channel and the intensity of the signal measured by the second channel.

Claims

1. A method for cleaning a residue accumulated from a prior deposition from a wall within a deposition chamber, comprising the steps of:

(a) flowing a cleaning gas into the deposition chamber;

(b) forming a plasma of a cleaning gas within the deposition chamber so that at least a portion of the molecules of the cleaning gas are dissociated, wherein the plasma includes one or more reactive species that react with said residue on the wall;

(c) monitoring the intensity of an emission line of a constituent of the partially dissociated cleaning gas;

(d) monitoring the intensity of a background light emission in the chamber;

(e) determining a ratio of the intensity of the cleaning gas emission line to the background emission;

(f) monitoring the determined ratio over time;

(g) comparing the determined ratio to a threshold value; and

(h) controlling the flow of the cleaning gas based on the comparing step.

2. A method for cleaning a residue accumulated from a prior deposition from a wall within a deposition chamber, comprising the steps of:

(a) flowing a cleaning gas into a plasma chamber;

(b) forming a plasma of a cleaning gas within the plasma chamber so that at least a portion of the molecules of the cleaning gas are dissociated, wherein the plasma includes one or more reactive species that react with said residue on the wall;

(c) providing said plasma of the cleaning gas within the deposition chamber;

(d) monitoring the intensity of an emission line of a constituent of the partially dissociated cleaning gas in the deposition chamber;

(e) monitoring the intensity of a background light emission in the deposition chamber,

(f) determining a ratio of the intensity of the cleaning gas emission line to the background emission;

(g) monitoring the determined ratio over time;

(h) comparing the determined ratio to a threshold value; and

(i) controlling the flow of the cleaning gas based on the comparing step.

3. A method according to claim 2, wherein the plasma chamber and the deposition chamber are the same chamber, so that the plasma is formed in-situ in the deposition chamber.

4. A method for cleaning a residue accumulated from a prior deposition from a wall within a deposition chamber, comprising the steps of:

(a) providing a plasma of a cleaning gas within the deposition chamber so that at least a portion of the molecules of the cleaning gas are dissociated, wherein the plasma includes one or more reactive species that react with said residue on the wall;

(b) monitoring the intensity of an emission line of a constituent of the partially dissociated cleaning gas;

(c) monitoring the intensity of a background light emission in the chamber;

(d) determining a ratio of the intensity of the cleaning gas emission line to the background emission;

(e) monitoring the determined ratio over time;

(f) comparing the determined ratio to a threshold value; and

(g) determining that the cleaning has reached an endpoint after the determined ratio exceeds the threshold value.

5. The method of claim 4, further comprising the step of:

before said providing step, performing within the deposition chamber a chemical vapor deposition process that deposits a film on an interior wall of the chamber;

wherein said providing step is effective to remove said film.

6. The method of claim 4, wherein the step of monitoring the intensity of a background light emission comprises detecting the intensity of the emission line of at least one background gas.

7. The method of claim 4, wherein the step of monitoring the intensity of a background light emission comprises detecting the intensity of the emission lines of a plurality of background gases.

8. The method of claim 4, wherein the step of monitoring the intensity of a background light emission comprises detecting the intensity of the total background light emission.

9. The method of claim 4, wherein the step of monitoring the intensity of a background light emission comprises detecting the intensity of many different wavelengths.

10. The method of claim 4, wherein the step of monitoring the intensity of a background light emission comprises detecting the intensity of a range of wavelengths.

11. The method of claim 4, wherein the step of monitoring the intensity of a background light emission comprises coupling light from the interior of the chamber to a photodetector through a neutral density filter.

12. The method of claim 4, wherein:

the step of monitoring the intensity of an emission line of a constituent of the cleaning gas comprises coupling light from the interior of the chamber to a first photodetector through a first optical filter that transmits light only at the wavelength of said emission line of the cleaning gas; and

the step of monitoring the intensity of a background light emission comprises coupling light from the interior of the chamber to a second photodetector through a broad band optical filter that transmits light at a wider band of wavelengths than the first optical filter.

13. The method of claim 4, further comprising the step of:

signalling that the cleaning process has completed after the determined ratio has exceeded the threshold value.

14. The method of claim 13, wherein the signalling step further comprises the step of:

after the determined ratio has exceeded the threshold value, monitoring the determined ratio during a waiting period before signalling that the cleaning process has completed.

15. The method of claim 4, wherein the providing step comprises the steps of:

forming a plasma of a cleaning gas in a remote plasma chamber distinct from the deposition chamber; and

supplying plasma from the remote plasma chamber to the deposition chamber.

16. The method of claim 14, wherein the providing step comprises the step of forming the plasma of the cleaning gas in-situ within the deposition chamber.

17. A method for cleaning a residue accumulated from a prior deposition from a wall within a deposition chamber, comprising the steps of:

(a) providing a plasma of a cleaning gas within the deposition chamber so that at least a portion of the molecules of the cleaning gas are dissociated, wherein the plasma includes one or more reactive species that react with said residue on the wall;

(b) monitoring a first intensity of an emission line of a constituent of the partially dissociated cleaning gas;

(c) monitoring a second intensity of light transmitted from the interior of the chamber through a neutral density optical filter;

(d) determining a ratio of the first intensity to the second intensity;

(e) monitoring the determined ratio over time;

(f) comparing the determined ratio to a threshold value; and

(g) determining that the cleaning has reached an endpoint after the determined ratio exceeds the threshold value.

18. A method for cleaning a residue accumulated from a prior deposition from a wall within a deposition chamber, comprising the steps of:

(a) providing a plasma of a cleaning gas within the deposition chamber so that at least a portion of the molecules of the cleaning gas are dissociated, wherein the plasma includes one or more reactive species that react with said residue on the wall;

(b) monitoring a first intensity of light transmitted from the interior of the deposition chamber through a first optical filter, wherein the first optical filter transmits light only at a characteristic wavelength of a constituent of said partially dissociated cleaning gas;

(c) monitoring a second intensity of light transmitted from the interior of the deposition chamber through a second optical filter, wherein the second optical filter transmits light over a wider range of wavelengths than the first optical filter;

(d) determining a ratio of the first intensity to the second intensity;

(e) monitoring the determined ratio over time;

(f) comparing the determined ratio to a threshold value; and

(g) determining that the cleaning has reached an endpoint after the determined ratio exceeds the threshold value.

19. The method of claim 18, further comprising the step of:

before said providing step, performing within the deposition chamber a chemical vapor deposition process that deposits a film on an interior wall of the chamber;

wherein said providing step is effective to remove said film.

20. The method of claim 18, further comprising the step of:

signalling that the cleaning process has completed after the determined ratio has exceeded the threshold value.

21. The method of claim 20, wherein the signalling step further comprises the step of:

after the determined ratio has exceeded the threshold value, monitoring the determined ratio during a waiting period before signalling that the cleaning process has completed.

22. The method of claim 18, wherein the providing step comprises the steps of:

forming a plasma of a cleaning gas in a remote plasma chamber distinct from the deposition chamber; and

supplying plasma from the remote plasma chamber to the deposition chamber.

23. The method of claim 18, wherein the providing step comprises the step of forming the plasma of the cleaning gas in-situ within the deposition chamber.

24. The method of claim 18, wherein the second optical filter is a neutral density filter.