Method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit

• US 6,881,294 B2
• Filed: 01/10/2000
• Issued: 04/19/2005
• Est. Priority Date: 02/12/1998
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Lake, Rickie C.
• Primary Examiner(s): Haran, John T.
• Application Number:
  US09/480,076
• Publication Number:
  US 20020179239A1
• Time in Patent Office: 1,926 Days
• Field of Search: 156/330, 156/305, 156/306.6, 156/306.9, 296/234, 298/32, 297/39, 297/40
• US Class Current: 156/330
• CPC Class Codes: H01M 50/216 adapted for button or coin cells
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/49114 including adhesively bonding
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.3 ohm-cm². In another aspect, a battery powerable apparatus includes a conductive adhesive mass comprising an epoxy terminated silane between a battery and substrate. A radio frequency communication device is one example. In another aspect, the invention includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass comprising an epoxy terminated silane.

Claims

1. A method of conductively interconnecting electronic components comprising:

providing a curable adhesive composition comprising an epoxy terminated glycidoxy methoxy silane;

providing first and second electronic components to be conductively connected with one another;

interposing the curable adhesive composition between the first and second electronic components, wherein at least one of the components comprises a nickel containing metal surface over which the curable adhesive composition is received;

curing the adhesive into an electrically conductive bond electrically interconnecting the first and second components; and

wherein the glycidoxy methoxy silane is present in the curable adhesive composition at less than or equal to about 2% by weight.

2. The method of claim 1 wherein the epoxy terminated silane comprises a glycidoxyproplytrimethoxysilane.

3. The method of claim 1 wherein the epoxy terminated silane is present in the curable adhesive composition at less than or equal to about 1% by weight.

4. The method of claim 1 wherein the first electronic component comprises a first conductive node and the second electronic component comprises a second conductive node, wherein the first and second nodes comprise interfaces for the electrically interconnecting the first and second components, and wherein the interposing provides the curable adhesive composition interposed between the interfaces.

5. The method of claim 4 wherein the curable adhesive composition contacts the interfaces.

6. The method of claim 4 wherein the interfaces of the first and second nodes comprise opposing surface areas, and wherein an entirety of the curable adhesive composition is interposed within the respective opposing surface areas.

7. The method of claim 1 wherein the curable adhesive composition comprises 0.5 to 2.0 weight parts of glycidoxy methoxy silane combined with 100 weight parts of silver epoxy resin.

8. The method of claim 1, wherein the curable adhesive composition comprises 1 weight part of glycidoxy methoxy silane combined with 100 weight parts of silver epoxy resin.

9. The method of claim 1 wherein the nickel containing metal surface comprises nickel clad stainless steel.

10. The method of claim 1, wherein the at least one component comprises a battery.

11. The method of claim 1 wherein the at least one component comprises a button-type battery.

12. The method of claim 1 wherein the at least one component comprises a thin-profile battery.

13. The method of claim 1 wherein the component other than the at least one component comprises a flexible circuit substrate.

14. The method of claim 1 wherein the electrically conductive bond comprises the sole physical support and connection interconnecting the first and second components.

15. A method of conductively interconnecting electronic components comprising:

interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected, at least one of the components comprising a battery having a metal surface with which the curable epoxy is to electrically connect; and

curing the epoxy into an electrically conductive bond electrically interconnecting the first and second components, the epoxy having an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a contact resistance through said metal surface of less than or equal to about 0.3 ohm-cm².

16. The method of claim 15 wherein the epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.16 ohm-cm².

17. The method of claim 15 wherein the epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.032 ohm-cm².

18. The method of claim 15 wherein the metal surface wetting concentration of silane in the curable adhesive composition is less than or equal to about 2% by weight.

19. The method of claim 15 wherein the metal surface wetting concentration of silane in the curable adhesive composition is less than or equal to about 1% by weight.

20. The method of claim 15 wherein the metal surface comprises nickel over which the curable adhesive composition is received.

21. The method of claim 15 wherein the metal surface comprises a first conductive node of the first electronic component and the second electronic component comprises a second conductive node, wherein the first and second nodes comprise interfaces for the electrically interconnecting the first and second components, and wherein the interposing provides the curable epoxy composition interposed between the interfaces.

22. The method of claim 21 wherein the curable epoxy composition contacts the metal surface and the second conductive node.

23. The method of claim 21 wherein the curable epoxy composition comprises 0.5 to 2.0 weight parts of silane combined with 100 weight parts of silver epoxy resin.

24. The method of claim 23 wherein the curable epoxy composition comprises 1 weight part of silane.

25. The method of claim 24 wherein the curable epoxy composition comprises 3 weight parts of hardener.

26. The method of claim 21 wherein the interfaces of the first and second nodes comprise opposing surface areas, and wherein an entirety of the curable epoxy composition is interposed within the respective opposing surface areas.

27. The method of claim 15 wherein the silane comprises epoxy terminated silane.

28. The method of claim 15 wherein the silane comprises glycidoxy methoxy silane.

29. The method of claim 15 wherein the silane comprises glycidoxyproplytrimethoxysilane.

30. The method of claim 15 wherein the metal surfaces comprises nickel clad stainless steel over which the curable adhesive composition is received.