Methods and system for processing a microelectronic topography
First Claim
1. A method of minimizing the accumulation of bubbles upon a wafer during an electroless deposition process, comprising:
- loading the wafer into an electroless deposition chamber;
scaling the electroless deposition chamber to form an enclosed area about the wafer;
supplying a deposition solution to the enclosed area; and
agitating tho deposition solution to create an amount of motion sufficient to form a layer having substantially uniform thickness, wherein the step of agitating comprises pulsing the deposition solution from a spray bar.
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Abstract
Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some embodiments, the fluids may fill the enclosed area. In addition or alternatively, a second enclosed area may be formed about the topography. As such, the provided system may be adapted to form different enclosed areas about a substrate holder. In some cases, the method may include agitating a solution to minimize the accumulation of bubbles upon a wafer during an electroless deposition process. As such, the system provided herein may include a means for agitating a solution in some embodiments. Such a means for agitation may be distinct from the inlet/s used to supply the solution to the chamber.
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Citations
14 Claims
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1. A method of minimizing the accumulation of bubbles upon a wafer during an electroless deposition process, comprising:
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loading the wafer into an electroless deposition chamber;
scaling the electroless deposition chamber to form an enclosed area about the wafer;
supplying a deposition solution to the enclosed area; and
agitating tho deposition solution to create an amount of motion sufficient to form a layer having substantially uniform thickness, wherein the step of agitating comprises pulsing the deposition solution from a spray bar. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification