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Methods and system for processing a microelectronic topography

  • US 6,881,437 B2
  • Filed: 06/16/2003
  • Issued: 04/19/2005
  • Est. Priority Date: 06/16/2003
  • Status: Expired due to Fees
First Claim
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1. A method of minimizing the accumulation of bubbles upon a wafer during an electroless deposition process, comprising:

  • loading the wafer into an electroless deposition chamber;

    scaling the electroless deposition chamber to form an enclosed area about the wafer;

    supplying a deposition solution to the enclosed area; and

    agitating tho deposition solution to create an amount of motion sufficient to form a layer having substantially uniform thickness, wherein the step of agitating comprises pulsing the deposition solution from a spray bar.

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