Method for producing liquid crystal display apparatus

• US 6,881,535 B2
• Filed: 06/19/2002
• Issued: 04/19/2005
• Est. Priority Date: 07/03/2001
• Status: Expired due to Term

• Current Assignee: NLT Technologies, Ltd. (Tianma Microelectronics Company Limited)
• Original Assignee: NEC LCD Technologies Limited (Tianma Microelectronics Company Limited)
• Inventors: Yamaguchi, Hirotaka
• Primary Examiner(s): McPherson, John A.
• Application Number:
  US10/173,923
• Publication Number:
  US 20030017422A1
• Time in Patent Office: 1,035 Days
• Field of Search: 430/316, 430/319, 430/321, 430/330, 349/113, 349/114
• US Class Current: 430/321
• CPC Class Codes: G02F 1/133553 Reflecting elements associated to illuminating devices G02F1/133605
• CPC Class Codes: G02F 1/133555 Transflectors
• CPC Class Codes: G02F 1/1362 Active matrix addressed cells G02F1/134336, G02F1/134363 take precedence
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence

Abstract

To provide a liquid crystal display apparatus exhibiting optimum display performance despite reduction in the number of PR(photolithography) processes, and a method for producing the apparatus. A method for producing a liquid crystal display apparatus having a first substrate including a thin film transistor and a reflector on an insulating substrate. An etching mask is formed on a metal layer formed on the insulating substrate and, using this etching mask, the metal layer is etched to form a constituent portion of the thin film transistor and protrusions. Only the etching mask is caused to reflow to cover exposed surface portions of the constituent portion of the thin film transistor and protrusions and near-by surface portions of the insulating substrate with the etching mask as the insulating substrate is partially exposed. Using the etching mask, recesses are formed in an exposed area of the insulating substrate. A reflector is formed on the protrusions and recesses.

Claims

1. A method for producing a liquid crystal display apparatus having a first substrate including a thin film transistor and a reflector on an insulating substrate, a second substrate having a transparent electrode and mounted facing said first substrate, and a liquid crystal layer placed between said first substrate and said second substrate;

said method comprising;

a first step of forming an etching mask, patterned to a predetermined shape, on at least one of a metal layer, an insulating layer and a semiconductor layer, formed on said insulating substrate;

a second step of etching at least one of said metal layer, insulating layer and the semiconductor layer, using said etching mask, to expose portions of said insulating substrate and to form on said insulating substrate at least a constituent portion of said thin film transistor and a plurality of protrusions separated from said constituent portion;

a third step of causing only said etching mask to reflow to cover an exposed part of said constituent portion of said thin film transistor and near-by surface portions of said insulating substrate with said etching mask and to cover exposed surfaces of said protrusions and near-by surface portions of said insulating substrate, the reflow of the etching mask leaving exposed the surface portions of said insulating substrate located between neighboring protrusions;

a fourth step of etching said insulating substrate, following said third step, using said etching mask to form one or more recesses in the exposed areas of said insulating substrate, the protrusions and recesses forming a rough surface; and

a fifth step of selectively forming a reflector having a rough surface on the rough surface formed at least by said protrusions and recesses.

2. The method as defined in claim 1 in which a metal layer and an insulation layer are formed in this order on said insulating substrate, said method comprising:

etching said insulating layer in said second step, using said etching mask, to expose portions of said metal layer through a contact hole; and

said contact hole being stopped up with said etching mask by reflow of said etching mask in said third step.

3. The method as defined in claim 1 further comprising:

a sixth step following said fourth step and previous to said fifth step, said sixth step forming another insulating layer having a rough surface on a rough surface at least formed by said protrusions and recesses.

4. The method as defined in claim 1 wherein said etching mask is a photo resist.

5. The method as defined in claim 1 wherein there is arranged an aperture at a preset area on the rough surface of said reflector.

6. A method for producing a liquid crystal display apparatus having a first substrate including a thin film transistor and a reflector on an insulating substrate, a second substrate having a transparent electrode and mounted facing said first substrate, and a liquid crystal layer placed between said first substrate and said second substrate;

said method comprising;

a first step of etching a metal layer, using a first etching mask, following the formation of said metal layer on said insulating substrate, to expose a portion of said insulating substrate and to form a gate electrode;

a second step of forming an insulating layer on said insulating substrate including said gate electrode and subsequently etching said insulating layer, using a second etching mask, to expose portions of said insulating substrate and to form a gate insulating film and a plurality of protrusions separated from said gate insulating film;

a third step of causing only said second etching mask to reflow to cover exposed portions of said gate insulating film and near-by surface portions of said insulating substrate with said etching mask and to cover exposed surfaces of said protrusions and near-by surface portions of said insulating substrate, while leaving exposed the surface portions of said insulating substrate between neighboring protrusions;

a fourth step of etching said insulating substrate, following said third step, using said second etching mask, to form one or more recesses in exposed areas of said insulating substrate; and

a fifth step of selectively forming a reflector having a rough surface on a rough surface formed at least by said protrusions and recesses.

7. The method as defined in claim 6 further comprising

a sixth step of forming a semiconductor layer on said insulating layer following formation of said insulating layer and prior to using said second etching mask in said second step, and of subsequently etching said semiconductor layer, using a third etching mask, to form an island above said gate electrode.

8. The method as defined in claim 7 wherein,

said reflector is of a laminated structure comprised of a lower Cr layer and an upper Al/Nd layer;

a source electrode and a drain electrode of said laminated structure are selectively formed when said reflector is formed in said fifth step;

a contact hole for partially exposing said Cr layer of said source electrode is formed in an other insulation layer formed on said insulating layer comprised of said reflector, source electrode and the drain electrode, and in said Al/Nd layer, after forming said other insulating layer; and

wherein

a transparent electrode layer electrically connecting to said source electrode through said contact hole is selectively formed on said other insulating layer.

9. The method as defined in claim 6 wherein the reflector formed in said fifth step is directly arranged on said rough surface formed by said protrusions and recesses.

10. The method as defined in claim 6 wherein there is arranged an aperture at a preset area on the rough surface of said reflector.

11. A method for producing a liquid crystal display apparatus having a first substrate including a thin film transistor and a reflector on an insulating substrate, a second substrate having a transparent electrode and mounted facing said first substrate, and a liquid crystal layer placed between said first substrate and said second substrate;

said method comprising;

a first step of forming a first metal layer on said insulating substrate and subsequently etching said first metal layer, using a first etching mask, to expose a portion of said insulating substrate and to form a gate electrode;

a second step of forming a first insulating layer and a semiconductor layer in this order on said insulating substrate including said gate electrode and of subsequently etching said semiconductor layer using a second etching mask to form an island above said gate electrode;

a third step of forming a second metal layer on said first insulating layer including said island and of subsequently etching said second metal layer using a third etching mask to form a source electrode and a drain electrode;

a fourth step of forming a second insulating layer on said first insulating layer including said source electrode and the drain electrode and of subsequently etching said second insulating layer and the first insulating layer, using a fourth etching mask, to expose a portion of said insulating substrate and to form a plurality of protrusions;

a fifth step of causing only said fourth etching mask to reflow following said fourth step to cover exposed surface portions of said first and second insulating layers and near-by surface portions of said insulating substrate with said fourth etching mask and to cover exposed surface portions of said protrusions and near-by surface portions of said insulating substrate with said fourth etching mask while leaving exposed surface portions of said insulating substrate located between neighboring protrusions;

a sixth step of etching said insulating substrate, using said fourth etching mask, following said fifth step, to selectively form one or more recesses in an exposed area of said insulating substrate; and

a seventh step of selectively forming a reflector, having a rough surface on a rough surface formed at least by said protrusions and recesses.

12. The method as defined in claim 11 wherein there is arranged an aperture at a preset area on the rough surface of said reflector.

13. A method for producing a liquid crystal display apparatus having a first substrate including a thin film transistor and a reflector on an insulating substrate, a second substrate having a transparent electrode and mounted facing said first substrate, and a liquid crystal layer placed between said first substrate and said second substrate;

said method comprising;

a first step of forming a first metal layer on said insulating substrate and subsequently etching said first metal layer using a first etching mask, to expose a portion of said insulating substrate, and to form a gate electrode, a plurality of protrusions being separated therefrom, and a wiring isolated from said gate electrode and said protrusions;

a second step of causing only said first etching mask to reflow to cover exposed surfaces of said gate electrode and said wiring and near-by surface portions of said insulating substrate with said first etching mask and to cover exposed surfaces of said protrusions and near-by surface portions of said insulating substrate with said first etching mask;

a third step of etching said insulating substrate, using said first etching mask, after said second step, to form one or more recesses in the exposed area of said insulating substrate;

after forming a first insulating film and a semiconductor layer on said insulating substrate, a fourth step of etching said semiconductor layer, using a second etching mask, including said gate electrode, said protrusions and said wiring, to form an island above said gate electrode;

a fifth step of etching said first insulating layer, using a third etching mask, to expose a portion of said wiring to form a first contact hole;

a sixth step of etching a second metal layer, using a fourth etching mask, after forming said second metal layer on said first insulating layer, including said island, to form a source electrode, a drain electrode and a reflector, to electrically connect said source electrode through said first contact hole with said wiring;

a seventh step of forming, after forming a second insulating layer on said first insulating layer including said source electrode, drain electrode and the reflector, a second contact hole in said second insulating layer and in said first insulating layer, using a fifth etching mask, for exposing a portion of said wiring; and

an eighth step of selectively forming a transparent electrode layer on said second insulating layer for electrically connecting to said wiring through said second contact hole.

14. The method as defined in claim 13 wherein there is arranged an aperture at a preset area on the rough surface of said reflector.

15. A method for producing a liquid crystal display apparatus having a first substrate including a thin film transistor and a reflector on an insulating substrate, a second substrate having a transparent electrode and mounted facing said first substrate, and a liquid crystal layer placed between said first substrate and said second substrate;

said method comprising;

a first step of forming a first metal layer on said insulating substrate and subsequently etching said first metal layer, using a first etching mask, to expose a portion of said insulating substrate, and to form a gate electrode and a wiring separated from said gate electrode;

a second step of forming a first insulating layer and a semiconductor layer in this order on said insulating substrate including said gate electrode and said wiring, and subsequently etching said semiconductor layer, using a second etching mask, to form an island above said gate electrode;

a third step of etching said first insulating layer, using a third etching mask, to form a first contact hole which exposes a portion of said wiring, of exposing a portion of said insulating substrate and of forming a plurality of protrusions;

a fourth step of causing only said third etching mask to reflow to cover the exposed surface portions of said first insulating layer and near-by surface portions of said insulating substrate with said third etching mask, to stop up said first contact hole with said third etching mask and to cover the exposed surface portions of said protrusions and near-by surface portions of said insulating substrate with said third etching mask, while leaving exposed a part of the surface of said insulating substrate between neighboring protrusions and near-by surface portions of said insulating substrate;

a fifth step of etching said insulating substrate, after said fourth step, using said third etching mask, to form one or more recesses in an exposed area of said insulating substrate;

a sixth step of forming a second metal layer on said first insulating layer including said island, on said protrusions and on said recesses, and subsequently etching said second metal layer, using a fourth etching mask, to form a source electrode, a drain electrode and a reflector, to connect said source electrode electrically to said wiring through said first contact hole;

a seventh step of forming a second insulating layer on said first insulating layer including said source electrode, drain electrode and the reflector, and subsequently forming a second contact hole, which exposes a portion of said wiring to said second insulating layer and the first insulating layer, using a fifth etching mask; and

an eighth step of selectively forming a transparent electrode layer on said second insulating layer for electrically connecting to said wiring through said second contact hole.

16. The method as defined in claim 15 wherein there is arranged an aperture at a preset area on the rough surface of said reflector.