Single package containing multiple integrated circuit devices

• US 6,882,046 B2
• Filed: 12/18/2001
• Issued: 04/19/2005
• Est. Priority Date: 07/09/2001
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Davenport, Joel Wayne, Parker, Robert R., Conder, Jeff E.
• Primary Examiner(s): Zarneke, David A.
• Application Number:
  US10/024,936
• Publication Number:
  US 20030006491A1
• Time in Patent Office: 1,218 Days
• Field of Search: 257723-725, 257/690, 257/693, 257/773, 257/786
• US Class Current: 257/725
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

The present invention allows multiple IC devices to be placed on the same substrate within a single BGA package. The invention requires minimum distances to be kept between electrical connections of the IC devices to maintain the electrical isolation, so that the devices can be operated at different voltage differentials. Signals between the devices can be connected externally from the package to each other utilizing galvanic isolation techniques. The invention provides the flexibility of choice for the customers to use isolation or not between the devices and takes up less PC board space because only a single package is used on the board.

Claims

1. A ball grid array (BGA) package assembly having a plurality of external connection contacts, comprising:

a first device, disposed on the BGA package, and having a plurality of electrical connections connected to a first set of the external electrical connection contacts; and

a second device, disposed on the BGA package, and having a plurality of electrical connections connected to a second set of the external electrical connection contacts;

wherein the first and second sets of the external electrical connections are segregated in two sections which are electrically isolated from each other, and the two sections are separated by at least a first distance wherein the first distance is based upon an expected difference in operating voltage between the first device and the second device.

2. The package of claim 1, wherein the first distance is in accordance with a predetermined standard.

3. The package of claim 2, wherein the standard specifies a physical separation distance between conductors based at least upon a voltage between the conductors.

4. The package of claim 1, further comprising:

a plurality of layers, including a signal layer, a power layer, a ground layer and a bottom layer;

wherein each of the layers includes two sets of electrical connections that are segregated in two sections which are electrically isolated from each other, and the two sets of electrical connections are respectively connected to the first and second devices.

5. The package of claim 4, wherein the standard specifies a physical separation distance between conductors based at least upon a voltage between the conductors.

6. The package of claim 1, wherein the first and second devices are semiconductor integrated circuit (IC) devices.

7. The package of claim 6, wherein the IC devices are communications devices.

8. A ball grid array package, comprising:

a plurality of layers, including a signal layer, a power layer, a ground layer and a bottom layer;

wherein each of the layers includes a plurality of sets of electrical conductors that are segregated into a corresponding plurality of sections which are electrically isolated from one another by a minimum distance based upon an expected voltage difference between the sets of electrical conductors, each of the plurality of sets of electrical conductors being adapted for connection to a corresponding integrated circuit.

9. The package of claim 8, wherein the plurality of sections are segregated in accordance with a predetermined standard.

10. The package of claim 9, wherein the predetermined standard specifies a physical separation distance between conductors of the package based at least upon a voltage between the conductors.

11. The package of claim 8, wherein the first and second devices are semiconductor integrated circuit (IC) devices.

12. The package of claim 11, wherein the IC devices are communications devices.