Semiconductor switching device

• US 6,882,210 B2
• Filed: 12/17/2001
• Issued: 04/19/2005
• Est. Priority Date: 04/19/2001
• Status: Expired due to Term

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Tsuchiya, Hitoshi, Hirai, Toshikazu, Asano, Tetsuro
• Primary Examiner(s): Tran, Minhloan
• Assistant Examiner(s): TRAN, TAN N
• Application Number:
  US10/016,143
• Publication Number:
  US 20020153585A1
• Time in Patent Office: 1,219 Days
• Field of Search: 327/403, 327/407, 327/404, 327/408, 327/113, 326/113, 257/192, 257/368, 257/369, 257/194, 257/195, 257/280, 257/281, 257/282, 257/288, 257/289, 257/379, 257/380, 257/472, 257/275, 257/364
• US Class Current: 327/403
• CPC Class Codes: H01L 21/4832 Etching a temporary substrate after encapsulation process to form leads
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68377 with parts of the auxiliary support remaining in the finished device
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/92 Specific sequence of method steps
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/0207 : Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 27/0605 : integrated circuits made of compound material, e.g. AIIIBV
• CPC Class Codes: H01L 27/0629 : in combination with diodes, or resistors, or capacitors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01059 : Praseodymium [Pr]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13063 : Metal-Semiconductor Field-Effect Transistor [MESFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A switching device receives two pairs of balanced signals and outputs one of the two pairs of the signals. The device is composed of two SPDT switches which share two control signals provided to the gates of the FET of the SPDT switches. The package of the device has eight external electrodes on the back side of the package. The eight external electrodes are configured so that they are aligned symmetrically with respect to the center line of the package. The device requires only a small package space and is suitable for mobile communication application such as cell phone accommodating CDMA and GPS signals.

Claims

1. A semiconductor switching circuit device formed on a substrate, comprising:

a first, a second, a third and a fourth field-effect transistor, each of said transistors having

a source electrode, a gate electrode and a drain electrode which are formed on a channel layer of the substrate;

a first, a second, a third and a fourth input terminal pad corresponding to the first, second, third and fourth transistors, respectively, the source electrode or the drain electrode of each of the four transistors being connected to the corresponding input terminal pad thereof;

a first common output terminal pad being electrically in direct contact with the source electrode or the drain electrode of the first transistor and being electrically in direct contact with the source electrode or the drain electrode of the second transistor, the two electrodes of the first and second transistors which are electrically in direct contact with the first common output terminal pad not being connected to any of the input terminal pads;

a second common output terminal pad being electrically in direct contact with the source electrode or the drain electrode of the third transistor and being electrically in direct contact with the source electrode or the drain electrode of the fourth transistor, the two electrodes of the third and fourth transistors which are electrically in direct contact with the second common output terminal pad not being connected to any of the input terminal pads;

a first control terminal pad connected to the gate electrodes of the first and third transistors; and

a second control terminal pad connected to the gate electrodes of the second and fourth transistors.

2. The semiconductor switching circuit device of claim 1, wherein each of the gate electrodes forms a Schottky contact with the channel layer and each of the source electrodes and the drain electrodes forms an ohmic contact with the channel layer.

3. The semiconductor switching circuit device of claim 1, wherein the substrate is made of a compound semiconductor and each of the transistors is a metal-semiconductor field-effect transistor.

4. The semiconductor switching circuit device of claim 1, further comprising a first connection connecting the first control terminal pad and the gate electrode of the third transistor, wherein the four transistors are aligned in a direction forming a row of the first, second, third and fourth transistors in this order, and wherein the connection is disposed along the row of the transistors.

5. The semiconductor switching circuit device of claim 4, wherein the connection comprises a resistor formed between the first control terminal pad and the gate electrode of the third transistor.

6. The semiconductor switching circuit device of claim 5, wherein the substrate is made of a compound semiconductor and the resistor comprises a high dopant concentration region.

7. The semiconductor switching circuit device of claim 4, further comprising a second connection connecting the second control terminal pad and the gate electrode of the second transistor, wherein the two connections intersect each other.

8. The semiconductor switching circuit device of claim 7, wherein the first, second, third and fourth input terminal pads are disposed on one side of the device so that each of the pads is placed next to the corresponding transistor, wherein the first and second common output terminal pads and the first and second control terminal pads are disposed on a side of the device opposite the side of the device of the four input terminal pads so that the two control terminal pads are placed at both ends of said opposite side of the device and the two common output terminal pads are placed between the two control terminal pads, and wherein the first and second connections are disposed between the row of the four transistors and a row of the control terminal pads and the common output terminal pads.

9. The semiconductor switching circuit device of claim 4, wherein the first, second, third and fourth input terminal pads are disposed on one side of the device so that each of the pads is placed next to the corresponding transistor and wherein the first and second common output terminal pads and the first and second control terminal pads are disposed on a side of the device opposite the side of the device of the four input terminal pads so that the two control terminal pads are placed at both ends of said opposite side of the device and the two common output terminal pads are placed between the two control terminal pads.

10. The semiconductor switching circuit device of claim 8, wherein a portion of the first transistor and a portion of the second transistor are disposed between the first and second input terminal pads, and wherein a portion of the third transistor and a portion of the fourth transistor are disposed between the third and fourth input terminal pads.

11. The semiconductor switching circuit device of claim 4, wherein each of the gate electrodes forms a Schottky contact with the channel layer and each of the source electrodes and the drain electrodes forms an ohmic contact with the channel layer.

12. The semiconductor switching circuit device of claim 4, wherein the substrate is made of a compound semiconductor and each of the transistors is a metal-semiconductor field-effect transistor.

13. A semiconductor switching circuit device comprising:

a first switch comprising two field-effect transistors each having a source electrode, a gate electrode, a drain electrode and an input terminal pad, and a common output terminal pad for the two transistors of the first switch, the source electrode or the drain electrode of each of the two transistors of the first switch being electrically in direct contact with the common output terminal pad of the first switch, and the source electrode or the drain electrode of each of the two transistors of the first switch which is not electrically in direct contact with the common output terminal pad of the first switch being connected to the input terminal pad thereof;

a second switch comprising two field-effect transistors each having a source electrode, a gate electrode, a drain electrode and an input terminal pad, and a common output terminal pad for the two transistors of the second switch, the source electrode or the drain electrode of each of the two transistors of the second switch being electrically in direct contact with the common output terminal pad of the second switch, and the source electrode or the drain electrode of each of the two transistors of the second switch which is not electrically in direct contact with the common output terminal pad of the second switch being connected to the input terminal pad thereof; and

two control terminal pads, one of the two control terminal pads being connected to a gate electrode of one of the two transistors of the first switch and a gate electrode of one of the two transistors of the second switch, and another of said two control terminal pads being connected to a gate electrode of another of the two transistors of the first switch and a gate electrode of another of the two transistors of the second switch.

14. The semiconductor switching circuit device of claim 13, wherein each of the first and second switch comprises a single pole double throw switch.

15. A semiconductor switching circuit device comprising:

a first switch comprising two field-effect transistors each having a source electrode, a gate electrode, a drain electrode and an input terminal pad, and a common output terminal pad for the two transistors of the first switch, the source electrode or the drain electrode of each of the two transistors of the first switch being electrically in contact with the common output terminal pad of the first switch, and the source electrode or the drain electrode of each of the two transistors of the first switch which is not electrically in contact with the common output terminal pad of the first switch being connected to the input terminal pad thereof;

a second switch comprising two field-effect transistors each having a source electrode, a gate electrode, a drain electrode and an input terminal pad, and a common output terminal pad for the two transistors of the second switch, the source electrode or the drain electrode of each of the two transistors of the second switch being electrically in contact with the common output terminal pad of the second switch, and the source electrode or the dram electrode of each of the two transistors of the second switch which is not electrically in contact with the common output terminal pad of the second switch being connected to the input terminal pad thereof; and

two control terminal pads, one of the two control terminal pads being connected to a gate electrode of one of the two transistors of the first switch and a gate electrode of one of the two transistors of the second switch, and another of said two control terminal pads being connected to a gate electrode of another of the two transistors of the first switch and a gate electrode of another of the two transistors of the second switch,

wherein the four input terminal pads are configured to receive two pairs of balanced analog signals and the two common output terminal pads are configured to output one of the two pairs of balanced analog signals received by the four input terminal pads.