Electromagnetically coupled interconnect system

• US 6,882,239 B2
• Filed: 05/08/2001
• Issued: 04/19/2005
• Est. Priority Date: 05/08/2001
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Miller, Charles A.
• Primary Examiner(s): LEE, BENNY T
• Application Number:
  US09/851,566
• Publication Number:
  US 20020186106A1
• Time in Patent Office: 1,442 Days
• Field of Search: 333/247, 333/24.R, 333/116, 333/109, 257/728, 257/664
• US Class Current: 333/24.00R
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04B 5/22 Capacitive coupling
• CPC Class Codes: H04B 5/24 Inductive coupling
• CPC Class Codes: H04B 5/48 Transceivers
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium.

Claims

1. An electronics system comprising:

a transmission line;

an electronic component comprising an electromagnetic coupler electromagnetically coupled to said transmission line; and

first shielding material disposed to at least partially shield said transmission line,

wherein said electronic component is an integrated circuit, and

wherein the electromagnetic coupler of said integrated circuit is integrated with a packaging of said integrated circuit.

2. An electronics system comprising:

a transmission line; and

an electronic component comprising an electromagnetic coupler electromagnetically coupled to said transmission line;

wherein said electromagnetic coupler is loosely coupled to said transmission line such that a signal in said electromagnetic coupler induces a corresponding signal in said transmission line that is attenuated by at least about 10 decibels.

3. The electronics system of claim 2, wherein said electromagnetic coupler is loosely coupled to said transmission line such that a signal in said electromagnetic coupler induces a corresponding signal in said transmission line that is attenuated by at least about 20 decibels.

4. The electronics system of claim 2, wherein said electromagnetic coupler is loosely coupled to said transmission line such that a signal in said electromagnetic coupler induces a corresponding signal in said transmission line that is attenuated by between about 10 decibels and about 40 decibels.

5. The electronics system of claim 2 further comprising first shielding material disposed between circuitry on said electronic component and said electromagnetic coupler.

6. The electronics system of claim 5 further comprising second shielding material disposed to at least partially shield said transmission line.

7. The electronics system of claim 6, wherein said second shielding material comprises a gap through which said electromagnetic coupler of said electronic component electromagnetically couples to said transmission line.

8. The electronics system of claim 5, wherein said first shielding material comprises a gap disposed adjacent the electromagnetic coupler of said electronic component.

9. The electronics system of claim 2 further comprising a plurality of said electronic components, each said electronic component comprising a respective electromagnetic coupler electromagnetically coupling said corresponding electronic component to said transmission line.

10. The electronics system of claim 9, wherein said plurality of electronic components are disposed along said transmission line such that the electromagnetic couplers of each of said electronic components are spaced no more than about ten millimeters from said transmission line.

11. The electronics system of claim 9, wherein each of said electromagnetic couplers is grounded at one end.

12. The electronics system of claim 9, wherein at least two of said plurality of electronic components are integrated circuits.

13. The electronics system of claim 12 further comprising a substrate, wherein said transmission line comprises a conductive material disposed on said substrate and each of said integrated circuits is attached to said substrate.

14. The electronics system of claim 2, wherein said electronic component is a first circuit board.

15. The electronics system of claim 14, wherein said transmission line is disposed on a second circuit board.

16. The electronics system of claim 2, wherein said transmission line does not physically contact an active electronic device.

17. The electronics system of claim 2, wherein said transmission line is driven only by electronic devices that are electromagnetically coupled to said transmission line.

18. The electronics system of claim 2 further comprising a plurality of said transmission lines.

19. The electronics system of claim 18, wherein said electronic component comprises a plurality of said electromagnetic couplers.

20. The electronics system of claim 19, wherein each said electromagnetic coupler is electromagnetically coupled to a corresponding one of said plurality of transmission lines.

21. The electronics system of claim 18 further comprising shielding material disposed between each of said plurality of transmission lines.

22. The electronic system of claim 2 further comprising an integrated circuit to which said electromagnetic coupler is connected, and wherein said electromagnetic coupler is smaller than said integrated circuit.

23. The electronics system of claim 2, wherein said transmission line is passive.

24. An electronics system comprising:

a transmission line; and

a plurality of integrated circuits, each integrated circuit comprising a respective electromagnetic coupler electromagnetically coupled to said transmission line,

wherein each said electromagnetic coupler is loosely coupled to said transmission line such that a signal in each said electromagnetic coupler induces a corresponding signal in said transmission line that is attenuated by at least about 10 decibels, and

wherein each said electromagnetic coupler of each said integrated circuit is smaller than each said integrated circuit.

25. An electronics system comprising:

a transmission line;

shielding means for shielding said transmission line;

a plurality of electronic components; and

a plurality of coupling means, each coupling means for electromagnetically coupling at least one of said electronic components with said transmission line,

wherein each of said plurality of coupling means couples one of said electronic components with said transmission line loosely with at least a 10 decibel attenuation.

26. The electronics system of claim 25, wherein said transmission line is disposed on a substrate, and said plurality of electronic components comprise respective integrated circuits disposed on said substrate.

27. An electronics system comprising:

a transmission line; and

an electronic component comprising an electromagnetic coupler electromagnetically coupled to said transmission line;

wherein said electromagnetic coupler is smaller than said electronic component and loosely coupled to said transmission line such that a signal in said transmission line induces a corresponding signal in said electromagnetic coupler that is attenuated by at least about 10 decibels.

28. The electronics system of claim 27 further comprising first shielding material disposed to at least partially shield said transmission line.

29. The electronics system of claim 28, wherein said first shielding material is disposed between said transmission line and said electronic component and comprises a gap through which said electromagnetic coupler of said electronic component electromagnetically couples to said transmission line.

30. The electronics system of claim 27 further comprising a plurality of said transmission lines.

31. The electronics system of claim 30, wherein said electronic component comprises a plurality of electromagnetic couplers.

32. The electronics system of claim 31, wherein each said electromagnetic coupler is electromagnetically coupled to a corresponding one of said plurality of transmission lines.

33. The electronics system of claim 32 further comprising shielding material disposed between each of said plurality of transmission lines.

34. The electronics system of claim 27 further comprising a plurality of said electronic components, each said electronic component comprising a respective electromagnetic coupler electromagnetically coupling said corresponding electronic component to said transmission line.

35. The electronics system of claim 27, wherein said electronic component is an integrated circuit.

36. The electronics system of claim 27, wherein said electromagnetic coupler is loosely coupled to said transmission line such that a signal in said r transmission line induces a corresponding signal in said electromagnet coupler that is attenuated by at least about 20 decibels.

37. The electronics system of claim 27, wherein said electromagnetic coupler is loosely coupled to said transmission line such that a signal in said transmission line induces a corresponding signal in said electromagnetic coupler that is attenuated by between about 10 decibels and about 40 decibels.

38. An electronics system comprising:

a transmission line;

a plurality of electronic components;

shielding means associated with each of said electronics components for shielding each said electronic component; and

a plurality of coupling means, each coupling means for electromagnetically coupling at least one of said electronic components with said transmission line,

wherein a respective one of said plurality of coupling means couples a corresponding one of said electronic components with said transmission line loosely with at least a 10 decibel attenuation.

39. The electronics system of claim 38, wherein said transmission line is disposed on a substrate, and said plurality of electronic components comprise respective integrated circuits disposed on said substrate.

40. An electronics system comprising:

a transmission line;

an electronic component comprising an electromagnetic coupler electromagnetically coupled to said transmission line; and

first shielding material disposed between circuitry on said electronic component and said electromagnetic coupler,

wherein said electronic component is an integrated circuit, and

wherein the electromagnetic coupler of said integrated circuit is integrated with a packaging of said integrated circuit.

41. An electronics system comprising:

a transmission line;

an electronic component comprising an electromagnetic coupler electromagnetically coupled to said transmission line; and

first shielding material disposed between circuitry on said electronic component and said electromagnetic coupler,

wherein said electromagnetic coupler is grounded at one end.