On-chip transformer balun

• US 6,882,263 B2
• Filed: 05/13/2004
• Issued: 04/19/2005
• Est. Priority Date: 01/23/2002
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Castaneda, Jesse A, Rofougaran, Reza, Yang, Hung Yu
• Primary Examiner(s): MAI, ANH T
• Application Number:
  US10/844,930
• Publication Number:
  US 20040207504A1
• Time in Patent Office: 341 Days
• Field of Search: 336/200, 336/223, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 19/04 Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range resonant circuits H03H
• CPC Class Codes: H01F 2021/125 Printed variable inductor with taps, e.g. for VCO
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03H 7/42 Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.

Abstract

A transformer balun is obtained that is symmetrical in structure, provides high current, or high voltage, amplification and has high coupling coefficients while maintaining minimal overall size. The balun structure includes primary and secondary metal windings at separate layer interfaces. The primary and secondary metal windings are symmetrical and can have any number of turns, which is only limited by integrated circuit area and capacitance. Accordingly, the, primary and secondary windings may be on as many layers as needed. Further, the primary and/or secondary may include a center tap ground, which enables the winding to be used as a differential port.

Claims

1. An on-chip transformer balun comprises:

primary winding having at least one primary turn, a first port and a second port operably coupled for a single-ended signal, wherein the at least one primary turn is substantially symmetrical with respect to the first and second ports, and wherein the primary winding is on at least one dielectric layer; and

secondary winding having at least one secondary turn, a third port, a center tap, and a fourth port operably coupled for a differential signal, wherein the differential signal corresponds to the single-ended signal, wherein the at least one secondary turn is substantially symmetrical about the center tap with respect to the third and fourth ports, and wherein the secondary winding is on at least one other dielectric layer and is magnetically coupled to the primary winding.

2. The on-chip transformer balun of claim 1, wherein the at least one primary turn further comprises:

a plurality of turns on a first one of the at least one dielectric layer; and

a plurality of metal bridges on a second one of the at least one dielectric layer, wherein the plurality of metal bridges are operably connected to the plurality of turns to provide the primary winding.

3. The on-chip transformer balun of claim 1, wherein the at least one secondary turn further comprises:

a plurality of turns on a first one of the at least one other dielectric layer; and

a plurality of metal bridges on a second one of the at least one other dielectric layer, wherein the plurality of metal bridges are operably connected to the plurality of turns to provide the secondary winding.

4. The on-chip transformer balun of claim 1 further comprises:

the primary winding including an interwoven spiral-type primary inductor; and

the secondary winding including an interwoven spiral-type secondary inductor that is substantially symmetrical to the primary winding.

5. The on-chip transformer balun of claim 4 further comprises:

the interwoven spiral-type primary inductor including a first number of multiple turns; and

the interwoven spiral-type secondary inductor including a second number of multiple turns.

6. The on-chip transformer balun of claim 1, wherein the at least one primary turn further comprises:

at least one turn on a first one of the at least one dielectric layer;

at least one other turn on a second one of the at least one dielectric layer; and

a plurality of vias operably connecting the at least one turn on the first one of the at least one dielectric layer in parallel to the at least one other turn on the second one of the at least one dielectric layer to provide the primary winding.

7. The on-chip transformer balun of claim 1, wherein the at least one secondary turn further comprises:

at least one turn on a first one of the at least one other dielectric layer;

at least one other turn on a second one of the at least one other dielectric layer; and

a plurality of vias operably connecting the at least one turn on the first one of the at least one other dielectric layer in parallel to the at least one other turn on the second one of the at least one other dielectric layer to provide the secondary winding.

8. An on-chip transformer balun of claim 1 comprises:

a substrate, wherein the at least one dielectric layer of the primary winding is on the substrate, wherein the at least one other dielectric layer of the secondary winding is on the substrate such that the primary winding is magnetically and capacitively coupled to the secondary winding.