Intelligent power module

• US 6,882,538 B1
• Filed: 05/31/2000
• Issued: 04/19/2005
• Est. Priority Date: 05/31/1999
• Status: Expired due to Term

• Current Assignee: EM Holdings (Luxembourg) S.a.r.l.
• Original Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Inventors: Frisch, Michael
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Levi, Dameon E.
• Application Number:
  US09/980,384
• Time in Patent Office: 1,784 Days
• Field of Search: 361/728, 361/730, 361/749, 361/761, 361/795, 361/792, 361/707, 361/726, 361/719, 361/715, 361/720, 361/704, 361/760, 361/752, 174/250, 174/254, 174/255, 174/260, 174/261, 174/252, 257/678
• US Class Current: 361/728
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

The power part and the logic part of the module are arranged on different substrates. The circuit board (5) of the logic part has a recess (6) in which the power substrate (2) is located and electrically connected to the logic part by wire bonding techniques (7).

Claims

1. An intelligent power module comprising a power part of the electronic components of which are arranged on a power substrate, and a logic part of the components of which are arranged on a circuit board having a recess in which said power part is located and electrically connected to the logic part by means of wire bonding techniques, said power substrate being mounted on a cooling plate, wherein a first portion of said circuit board is mounted on and in thermal connection with the cooling plate, the first portion surrounding said power substrate and a second portion of said circuit board supporting at least one component forming said logic part which is not mounted on the cooling plate.

2. An intelligent power module according to claim 1, wherein at least a strip portion along a side of the circuit board is left free and is not mounted on said cooling plate.

3. An intelligent power module according to claim 1, wherein the circuit board has contact pads on said side by means of which the module can be soldered directly in the slot-like opening of a system circuit board.

4. An intelligent power module according to claim 1, wherein the components of the logic part are arranged on a multilayer circuit board having a recess in which said power part is located and electrically connected to said logic part, and characterized in that the multilayer circuit board has a laminate structure of conductively coated layers whose carrier material consists of a glass fiber resin fabric each, and in that the multilayer circuit board consists of two parts connected by a thin intermediate section in which all lower layers of the multilayer circuit board are not present and only the component-side uppermost layer is present as a bendable continuation in the form of a flexible, electrical and mechanical connecting layer between said two parts.

5. An intelligent power module according to claim 4, characterized in that the flexible connecting layer is bent by 180°

so that said two parts continue in bendable manner.

6. An intelligent power module according to claim 5, characterized in that the first part of the multilayer circuit board, which has the recess, as well as the second, folded up part are approximately of equal size, that said first part is mounted on a cooling plate that is larger than the power substrate area, and in that the electrical connections between said power substrate and the first part of the multilayer circuit board are established by means of wire bonding techniques.