Optical device package for flip-chip mounting

• US 6,883,977 B2
• Filed: 12/10/2001
• Issued: 04/26/2005
• Est. Priority Date: 12/14/2000
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Sherrer, David W., Steinberg, Dan A., Dautartas, Mindaugas F., Ricks, Neal
• Primary Examiner(s): Healy, Brian
• Assistant Examiner(s): Petkovsek, Daniel
• Application Number:
  US10/013,084
• Publication Number:
  US 20030095759A1
• Time in Patent Office: 1,233 Days
• Field of Search: 250/227.11, 250/227.24, 250/227.28, 250/239, 385/49, 385/52, 385/14, 385 88- 94, 257/433, 257/678, 257/703, 257/704, 257/778, 438/108
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Claims

1. An optical device package which comprises:

a) a substrate comprising an upper surface;

b) an optical fiber mounted to the substrate;

c) an optical semiconductor component on the substrate;

d) a frame mounted to the upper surface of the substrate, the frame comprising conductive pathways extending between a top surface of the frame and a bottom surface of the frame, wherein the frame defines an opening from the top surface to the bottom surface, and the optical semiconductor component is disposed in the opening; and

e) contact means disposed on the top surface of the frame for flip mounting the optical device package to a platform.

2. The optical device package of claim 1 wherein the conductive pathways comprise at least one conductive via which extends through the frame.

3. The optical device package of claim 1 wherein the conductive pathways comprise at least one conductive path which extends along a side surface of the frame.

4. The optical device package of claim 1 wherein the optical fiber is disposed between the substrate and the frame.

5. The optical device package of claim 4 wherein the frame has a recess for accommodating the optical fiber.

6. The optical device package of claim 4 wherein the optical fiber is disposed through a ferrule.

7. The optical device package of claim 2 wherein the contact means comprises at least one solder ball and the at least one conductive via terminates at one end at the solder ball.

8. The optical device package of claim 7 further comprising a conductive trace on the upper surface of the substrate in electrical communication with the conductive pathway of the frame.

9. The optical device package of claim 1 wherein the optical semiconductor component is selected from the group consisting of a laser diode, light emitting diode and photodetector.

10. The optical device package of claim 1 wherein the frame comprises an interior ledge.

11. The optical device package of claim 10 wherein a lid comprising a top surface is mounted to the ledge of the frame such that the top surface of the lid is positioned below the level of the top surface of the frame

12. The optical device package of claim 10 wherein a lid comprising a top surface is mounted to the ledge such that the top surface of the lid is positioned above the level of the top surface of the frame.

13. The optical device package of claim 12 wherein the contact means comprises at least one solder ball comprising a top surface and wherein the top surface of the solder ball is positioned above the level of the top surface of the lid.

14. The optical device package of claim 1 wherein the substrate further comprises a lateral groove defining a distal facing stop surface, and the optical fiber comprises a proximal end abutting the distal facing stop surface.

15. The optical device package of claim 1 wherein the frame comprises a band-like shape circumscribing an open area and comprises a ledge onto which a lid is mounted.

16. The optical device package of claim 1 where the frame comprises a U-shaped configuration and the optical device package comprises a lid mounted to the upper surface of the substrate, the lid comprising a recess.

17. The optical device package of claim 1 wherein the frame is fabricated from a sintered ceramic material.

22. The optical device package of claim 1 wherein the optical fiber lies in a groove in the substrate upper surface.

23. The optical device package of claim 1 wherein the package is hermetically sealed.

28. The device package of claim 1 where the frame has a U-shaped configuration.

18. A method for making an optical device package comprising:

a) mounting an optical fiber to a substrate comprising an upper surface;

b) forming a conductive trace on the upper surface of the substrate;

c) mounting a frame to the substrate, the frame comprising a frame top surface with at least one solder pad thereon and a bottom surface, and a conductive via extending from the solder pad to the conductive trace, the frame defining an opening from the top surface to the bottom surface; and

d) mounting an optical semiconductor component on the substrate in the opening in contact with the conductive trace and in alignment with the optical fiber.

19. The method of claim 18 further comprising mounting a lid to the flame.

20. The method of claim 18 further comprising mounting a lid to the substrate.

24. The method of claim 18 wherein the optical fiber lies in a groove in the substrate upper surface.

25. The method of claim 18 wherein the package is hermetically sealed.

21. A method for assembling an electronic circuit comprising:

a) providing an optical device package which comprises

i) a substrate comprising an upper surface;

ii) an optical semiconductor component mounted to the substrate;

iii) an optical fiber mounted to the substrate in alignment with the optical semiconductor component;

iv) a frame mounted to the upper surface of the substrate, the frame comprising a top surface with a patterned array of solder balls thereon and a bottom surface, and at least one conductive pathway extending from each solder ball to the upper surface of the substrate, wherein the frame defines an opening from the top surface to the bottom surface, and the optical semiconductor component is disposed in the opening; and

v) at least one conductive trace electrically connecting the at least one conductive pathway and the optical semiconductor component;

b) providing a circuit board comprising a patterned array of bonding pads which is a mirror image of the patterned array of solder balls on the frame;

c) inverting and positioning the optical device package such that individual solder balls of the patterned array solder balls of the optical device package are in contact with corresponding individual bonding pads of the patterned array of bonding pads on the circuit board; and

d) fusing the solder balls to the corresponding bonding pads.

26. The method of claim 21 wherein the optical fiber lies in a groove in the substrate upper surface.

27. The method of claim 21 wherein the package is hermetically sealed.