Semiconductor copper bond pad surface protection
First Claim
Patent Images
1. An electronic package comprising an uninsulated copper surface of a circuit protected with a coating layer consisting essentially of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when being joined to another metal surface to obtain copper-to-metal contact.
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Accused Products
Abstract
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
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Citations
15 Claims
- 1. An electronic package comprising an uninsulated copper surface of a circuit protected with a coating layer consisting essentially of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when being joined to another metal surface to obtain copper-to-metal contact.
- 9. An electronic package comprising an uninsulated copper surface of a circuit coated with a surface layer of a metal hydride compound selected from the group consisting of metal hydrides of copper-rare earth metal complexes and metal hydrides of copper-immiscible metals that form metal hydrides, said surface layer having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when being joined to another metal surface to obtain copper-to-metal contact.
Specification