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Semiconductor copper bond pad surface protection

  • US 6,885,104 B2
  • Filed: 05/22/2002
  • Issued: 04/26/2005
  • Est. Priority Date: 10/05/1998
  • Status: Expired due to Fees
First Claim
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1. An electronic package comprising an uninsulated copper surface of a circuit protected with a coating layer consisting essentially of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when being joined to another metal surface to obtain copper-to-metal contact.

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