Stripline parallel-series-fed proximity-coupled cavity backed patch antenna array

• US 6,885,343 B2
• Filed: 09/26/2002
• Issued: 04/26/2005
• Est. Priority Date: 09/26/2002
• Status: Expired due to Fees

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: Andrew Corporation (CommScope Holding Company, Inc.)
• Inventors: Roper, Joel C.
• Primary Examiner(s): CHEN, SHIH CHAO
• Application Number:
  US10/255,305
• Publication Number:
  US 20040061647A1
• Time in Patent Office: 943 Days
• Field of Search: 343/700.MS, 343/824, 343/846, 343/776, 343/893
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 21/0075 Stripline fed arrays H01Q21/065 takes precedence
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0457 electromagnetically coupled to the feed line

Abstract

An antenna array having one or more multi-layer substrates each including top and bottom ground planes and an inner conductive layer, a plurality of proximity coupled cavity backed patch antenna elements formed by each multi-layer substrate, and distribution traces extending along the inner conductive layer of the substrates and coupling with the proximity coupled cavity backed patch antenna elements.

Claims

1. An antenna array comprising:

a plurality of multi-layer substrates coupled to one another in a co-planar array, each including top and bottom ground planes and an inner conductive layer;

a plurality of proximity coupled cavity backed patch antenna elements disposed on the plurality of multi-layer substates, each proximity coupled cavity back patch antenna element including plated through holes connecting the top and bottom ground planes of a multi-layer substrate around an element perimeter; and

a plurality of distribution traces extending along the inner conductive layer of the substrates and coupling with the proximity coupled cavity backed patch antenna elements.

2. The antenna array of claim 1, wherein the plurality of multi-layer substrates includes four multi-layer substrates arranged in two columns and two rows.

3. The antenna array of claim 1, wherein the distribution traces comprise stripline traces.

4. The antenna array of claim 1, wherein the distribution traces comprise a first portion coupling proximity coupled cavity back patch antenna elements in parallel and a second portion coupling proximity coupled cavity backed patch antenna elements in series.

5. The antenna array of claim 1, wherein the proximity coupled cavity backed patch antenna elements comprise three quarter wavelength dual stubs.

6. The antenna array of claim 1, further comprising a feed combiner electrically coupling the distribution traces of the plurality of multi-layer substrates.

7. The antenna array of claim 1, further comprising at least two couplers coupled to the distribution traces of at least two of the multi-layer substrates.

8. The antenna array of claim 7, wherein the couplers comprise traces extending along the inner conductive layer proximate the distribution traces.

9. The antenna array of claim 7, wherein the proximity coupled cavity backed patch antenna elements are formed in columns and the couplers are located proximate a respective column and configured for at least one of beamforming, beamsteering and null forming.

10. The antenna array of claim 7, wherein the couplers are terminated with a load.

11. The antenna array of claim 7, further comprising at least one coupling combiner configured to couple the at least two couplers.

12. An antenna array comprising:

multi-layer substrate, including top and bottom ground planes and an inner conductive layer;

a plurality of proximity coupled cavity backed patch antenna elements disposed on the multi-layer substrate, each proximity coupled cavity back patch antenna element including plated through holes connecting the top and bottom ground planes around an element perimeter; and

at least one distribution trace extending along the inner conductive layer of the substrate and coupling with the proximity coupled cavity backed patch antenna elements.

13. The antenna array of claim 12, further comprises a second multi-layer substrate coupled to the first multi-layer substrate to forma coplanar array.

14. The antenna array of claim 12, wherein the at least one distribution trace comprises a stripline trace.

15. The antenna array of claim 12, wherein the distribution trace comprises a first portion coupling proximity coupled cavity back patch antenna elements in parallel and a second portion coupling proximity coupled cavity backed patch antenna elements in series.

16. The antenna array of claim 12, wherein the proximity coupled cavity backed patch antenna elements comprise three quarter wavelength dual stubs.

17. The antenna array of claim 12, further comprising at least one coupler coupled to the distribution trace of the multi-layer substrate.

18. The antenna array of claim 17, wherein the coupler comprises a trace extending along the inner conductive layer proximate the distribution trace.

19. The antenna array of claim 17, wherein the proximity coupled cavity backed patch antenna elements are formed in columns and the coupler is located proximate a respective column and configured for at least one of beamforming, beamsteering and null forming.

20. The antenna array of claim 17, wherein the coupler is terminated with a load.

21. A multi-layer substrate, comprising:

a top ground plane;

a bottom ground plane;

an inner conductive layer;

a plurality of proximity coupled cavity backed patch antenna elements, each proximity coupled cavity backed patch antenna element including plated through holes connecting the top and bottom ground planes around an element perimeter; and

a distribution trace extending along the inner conductive layer of the substrate and coupling with the antenna elements.

22. The multi-layer substrate of claim 21, wherein the distribution trace comprises a stripline trace.

23. The multi-layer substrate of claim 21, wherein the distribution trace comprises a first portion coupling proximity coupled cavity backed patch antenna elements in parallel and a second portion coupling proximity coupled cavity backed patch elements in series.

24. The multi-layer substrate of claim 21, wherein the proximity coupled cavity backed patch antenna elements comprise three quarter wavelength dual stubs.

25. The multi-layer substrate of claim 21, further comprising at least one coupler coupled to the distribution trace of the inner conductive layer.

26. The multi-layer substrate of claim 25, wherein the at least one coupler comprises a trace extending along the inner conductive layer proximate the distribution trace.

27. The multi-layer substrate of claim 25, wherein the proximity coupled cavity backed patch antenna elements are formed in columns and the at least one coupler is configured for at least one of beamforming, beamsteering, and null forming.

28. The multi-layer substrate of claim 25, wherein the at least one coupler is terminated in a load.

29. A method of forming a multi-layer substrate for use in an antenna array, the method comprising:

forming a top ground plane;

etching patch radiating elements from the top ground plane;

forming a bottom ground plane;

connecting the top and bottom ground planes around a plurality of element perimeters to form a plurality of proximity coupled cavity backed patch antenna elements; and

forming distribution traces extending along an inner conductive layer and coupling with the antenna elements.

30. The method of claim 29, further comprising coupling the multi-layer substrate with another multi-layer substrate to form a co-planar array.

31. The method of claim 29, wherein the distribution traces comprise stripline traces.

32. The method of claim 29, wherein the distribution traces comprise a first portion coupling proximity coupled cavity back patch antenna elements in parallel and a second portion coupling proximity coupled cavity backed patch antenna elements in series.

33. The method of claim 29, wherein the proximity coupled cavity backed patch antenna elements comprise three quarter wavelength dual stubs.

34. The method of claim 29, further comprising forming a feed combiner proximate to and electrically coupling to the distribution trace.

35. The method of claim 29, wherein the couplers are formed with a load.

36. A method of forming an antenna array, the method comprising:

forming a plurality of multi-layer substrates, including, for each multi-layer substrate;

forming a top ground plane;

etching patch radiating elements from the top ground plane;

forming a bottom ground plane;

connecting the top and bottom ground planes around a plurality of element perimeters to form a plurality of proximity coupled cavity backed patch antenna elements; and

forming distribution traces extending along an inner conductive layer and coupling with the antenna elements; and

,

electrically coupling the plurality of multi-layer substrates to one another.

37. The method of claim 36, wherein the distribution traces comprise stripline traces.

38. The method of claim 36, wherein the distribution traces comprise a first portion coupling proximity coupled cavity back patch antenna elements in parallel and a second portion coupling proximity coupled cavity backed patch antenna elements in series.

39. The method of claim 36, wherein the proximity coupled cavity backed patch antenna elements comprise three quarter wavelength dual stubs.

40. The method of claim 36, further comprising forming a feed combiner proximate to and electrically coupling to the distribution trace.

41. The method of claim 36, wherein the couplers are formed with a load.