×

Circuit package and method for making the same

  • US 6,885,562 B2
  • Filed: 12/28/2001
  • Issued: 04/26/2005
  • Est. Priority Date: 12/28/2001
  • Status: Expired due to Fees
First Claim
Patent Images

1. A circuit package for an electronic device, comprising:

  • a first circuit board positioned in a first plane;

    a second circuit board positioned in a second plane;

    at least one brace coupled to the first circuit board and the second circuit board;

    at least two electrically conductive leads extending from at least one surface of the circuit package; and

    a housing formed between the first and second circuit boards that covers at least one surface of each circuit board and leaves another surface of each circuit board substantially uncovered to thereby expose the uncovered surface to an environment exterior of the circuit packages, wherein the housing includes an external surface that is flush with the uncovered surfaces of each circuit board.

View all claims
  • 10 Assignments
Timeline View
Assignment View
    ×
    ×