Design driven inspection or measurement for semiconductor using recipe
First Claim
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1. For an instrument responsive to recipe parameters, a method for creating a recipe, the method comprising:
- accessing mask set data;
recognizing a target structure in the mask set data;
extracting parameters from the mask set data; and
configuring the recipe based on the extracted parameters responsive to the recognized target structure, wherein the configuration of the recipe is performed before a wafer printed with a mask created from the mask set data is generated.
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Abstract
Design driven inspection/metrology methods and apparatus are provided. A recipe is a set of instructions including wafer processing parameters, inspection parameters, or control parameters for telling an inspection/metrology system how to inspect/measure a wafer. Design data is imported into a recipe extraction system that recognizes instances of target structures and configures recipe parameters accordingly, thereby reducing manual instrument setup time, improving inspection/measurement accuracy, and improving fabrication efficiency.
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Citations
23 Claims
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1. For an instrument responsive to recipe parameters, a method for creating a recipe, the method comprising:
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accessing mask set data;
recognizing a target structure in the mask set data;
extracting parameters from the mask set data; and
configuring the recipe based on the extracted parameters responsive to the recognized target structure, wherein the configuration of the recipe is performed before a wafer printed with a mask created from the mask set data is generated. - View Dependent Claims (2, 3, 4)
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5. For an instrument instructed by a recipe to perform a task on a wafer, a method comprising:
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receiving design data describing a die;
extracting parameters from the design data relevant to the configuration of the instrument; and
creating from the extracted parameters, the recipe for performing the task, wherein the recipe is created before a wafer to which the design data has been applied is generated. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A recipe extraction system using design data specifying one or more die, the system comprising:
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an access module to access the design data describing a die;
an analyzer to extract parameters from the design data; and
a configuration module to produce a recipe for controlling one of an inspection and a metrology instrument, wherein the configuration module produces the recipe before a wafer to which the design data has been applied is generated. - View Dependent Claims (18, 19, 20, 21, 22)
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23. An inspection/metrology instrument using design data specifying one or more die, the instrument comprising:
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an input interface for accessing the design data describing a die;
an analyzer to recognize target structures in the design data and extract parameters from the design data; and
a recipe module creating a recipe based on the extracted parameters responsive to the recognized target structure, wherein the recipe module creates the recipe before a wafer to which the design data has been applied is generated.
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Specification