Method for making an article having an embedded electronic device

• US 6,886,246 B2
• Filed: 05/07/2002
• Issued: 05/03/2005
• Est. Priority Date: 10/15/1998
• Status: Expired due to Fees

• Current Assignee: Avante International Technology
• Original Assignee: Amerasia International Technology, Inc.
• Inventors: Chung, Kevin Kwong-Tai
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/140,245
• Publication Number:
  US 20020124392A1
• Time in Patent Office: 1,092 Days
• Field of Search: 361/736, 361/737, 361/760, 361/765, 361/777, 361/783, 361/784, 361/793, 257/679, 257/683, 174/52.2, 174/52.3, 298/32, 298/54, 298/40, 298/43, 298/41, 298/55, 264/272.11, 156/305
• US Class Current: 29/832
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/12 Pressure
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: B32B 37/203 One or more of the layers being plastic
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05664 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05669 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 : Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 : TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06582 : Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06586 : Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 23/055 : the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/005 : with variable reactance for tuning the antenna
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/113 : Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/1453 : Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/423 : characterised by electroplating method
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

A method for making an article having an electronic device embedded therein comprises providing a substrate having first and second opposing broad planar surfaces; mounting an electronic device on the first broad planar surface of the substrate; and applying a layer of melt-flowable adhesive of substantially uniform thickness on the first broad planar surface of the substrate to cover the electronic device. The article produced thereby has the electronic device encapsulated by the layer of melt-flowable adhesive.

Claims

1. A method for making an article having an electronic device embedded therein comprising:

providing a substrate having first and second opposing broad planar surfaces;

forming an elongated electrical conductor on the first broad planar surface of the substrate;

attaching an electronic device to the first broad planar surface of the substrate;

providing a layer of melt-flowable adhesive proximate the first broad planar surface of the substrate, wherein the layer of melt-fiowable adhesive has a thickness that is substantially uniform and sufficient to cover the electronic device; and

melt flowing the melt-flowable adhesive to the first broad planar surface of the substrate to encapsulate the electronic device thereto in the substantially uniform thickness layer of melt-flowable adhesive;

wherein said forming an elongated electrical conductor includes depositing a loop antenna pattern of a conductive adhesive on the first broad planar surface of the substrate, and wherein said attaching an electrical device includes attaching at least one contact on the electronic device to one contact of the loop antenna pattern of conductive adhesive.

3. The method of claim 1 or 2 wherein said attaching an electronic device includes forming electrical connections between contact pads on the substrate and corresponding contact pads on the electronic device.

4. The method of claim 3 wherein said forming electrical connections includes at least one of forming a solder connection, forming a conductive adhesive connection and forming a flexible conductive adhesive connection.

5. The method of claim 3 wherein said forming electrical connections includes depositing a pattern of electrically conductive adhesive contact features corresponding to the pattern of contact pads of the electronic device onto the first broad planar surface of the substrate.

6. The method of claim 5 wherein said attaching an electronic device includes placing the contact pads of the electronic device against the corresponding contact features at a time when the conductive adhesive thereof is wet.

7. The method of claim 5 wherein said attaching an electronic device includes placing the contact pads of the electronic device against the corresponding contact features at a time after the conductive adhesive thereof is one of dried and B-staged.

8. The method of claim 1 or 2 wherein said providing a layer of melt-flowable adhesive includes forming the layer of melt-flowable adhesive on the first broad planar surface of the substrate after the electronic device is attached thereto.

9. The method of claim 8 wherein said forming the layer of melt-flowable adhesive includes one of sheet laminating, roll coating, screen printing, stenciling, masking, and ink-jet printing the melt-flowable adhesive.

13. The method of claim 1 or 2 wherein said melt flowing the melt-flowable adhesive comprises:

placing a card blank against the layer of melt-flowable adhesive; and

melt flowing the melt-flowable adhesive to attach the card blank to the substrate with the electronic device therebetween.

14. The method of claim 13 wherein said placing a card blank includes positioning a card blank having a cavity adapted for receiving an electronic device therein in a position with the cavity opposite the electronic device.

15. The method of claim 14 wherein said melt flowing includes pressing the substrate and the card blank together to position the electronic device in the cavity in the card blank.

16. The method of claim 1 or 2 wherein providing a substrate includes providing one of a strip and a panel of a plurality of substrates.

17. The method of claim 16 including separating the one of a strip and a panel of a plurality of substrates into a plurality of separate substrates after said melt flowing the melt-flowable adhesive.

2. A method for making an article having an electronic device embedded therein comprising:

providing a substrate having first and second opposing broad planar surfaces;

attaching an electronic device to the first broad planar surface of the substrate;

providing a layer of melt-flowable adhesive proximate the first broad planar surface of the substrate, wherein the layer of melt-flowable adhesive has a thickness that is substantially uniform and sufficient to cover the electronic device; and

melt flowing the melt-flowable adhesive to the first broad planar surface of the substrate to encapsulate the electronic device thereto in the substantially uniform thickness layer of melt-flowable adhesive,

wherein said melt flowing includes heating the melt-flowable adhesive to a melt-flow temperature, which melt-flow temperature is less than a deformation temperature of the substrate and the card blank.

10. The method of claim 2 further comprising forming an elongated electrical conductor on the first broad planar surface of the substrate.

11. The method of claim 10 wherein said forming an elongated electrical conductor includes depositing a pattern of a conductive adhesive on the first broad planar surface of the substrate.

12. The method of claim 11 wherein said attaching an electrical device includes attaching at least one contact on the electronic device to a location on the pattern of conductive adhesive.

18. A method for making an article having an electronic device embedded therein comprising:

providing a substrate having first and second opposing broad planar surfaces comprising one of a strip and a panel of a plurality of substrates;

attaching an electronic device to the first broad planar surface of the substrate;

providing a layer of melt-flowable adhesive proximate the first broad planar surface of the substrate, wherein the layer of melt-flowable adhesive has a thickness that is substantially uniform and sufficient to cover the electronic device; and

melt flowing the melt-flowable adhesive to the first broad planar surface of the substrate to encapsulate the electronic device thereto in the substantially uniform thickness layer of melt-flowable adhesive;

wherein said providing a layer of melt-flowable adhesive includes forming the layer of melt-flowable adhesive on the first broad planar surface of the provided one of a strip and a panel of substrates after the electronic device is attached thereto, and further including separating the provided one of a strip and a panel of a plurality of substrates into a plurality of separate substrates after said forming the layer of melt-flowable adhesive on the first broad planar surface thereof.

19. A method for making a plurality of articles each having an electronic device embedded therein comprising:

providing substrate material having first and second opposing broad planar surfaces, wherein the substrate material has a plurality of contact patterns on the first broad planar surface thereof;

attaching an electronic device having contacts to each of the plurality of contact patterns on the first broad planar surface of the substrate material;

providing a layer of melt-flowable adhesive proximate the first broad planar surface of the substrate material, wherein the layer of melt-flowable adhesive has a thickness that is substantially uniform and is sufficient to cover the plurality of electronic devices;

melt flowing the layer of melt-flowable adhesive to the first broad planar surface of the substrate material to encapsulate the electronic device thereto in the substantially uniform thickness layer of melt-flowable adhesive; and

after said melt flowing the melt-flowable adhesive, separating the broad planar substrate material into a plurality of separate articles wherein each separate article includes at least one of the plurality of electronic devices encapsulated to a substrate by a portion of the melt-flowed layer of melt-flowable adhesive.

20. The method of claim 19 further comprising:

placing plastic blank material opposing the layer of melt-flowable adhesive and the first surface of the broad planar substrate material with the electronic device between the substrate material and the plastic blank material; and

wherein said melting the melt-flowable adhesive comprises;

attaching the plastic blank material and the broad planar substrate material with the layer of melt-flowable adhesive substantially filling the space therebetween to substantially encapsulate the electronic device,

wherein each separate article incldes at least one of the plurality of electronic devices encasulated on a substrate and a portion of the plastic blank material.

21. The method of claim 19 wherein said attaching an electronic device includes, for each electronic device, at least one of:

making electrical connections of the contacts of the electronic device to a loop antenna disposed on either the first or the second broad planar surface of the substrate material via one of the plurality of contact patterns on the first broad planar surface of the substrate material; and

making electrical connections of the contacts of the electronic device to a pattern of external contacts on the second broad planar surface of the substrate material via one of the plurality of contact patterns on the first broad planar surface of the substrate material.

22. The method of claim 21 wherein said making electrical connections includes at least one of forming a solder connection, forming a conductive adhesive connection and forming a flexible conductive adhesive connection.

23. The method of claim 19 wherein said providing a layer of melt-flowable adhesive includes one of sheet laminating, roll coating, screen printing, stenciling, masking, and ink-jet printing the melt-flowable adhesive on the first broad planar surface of the substrate material.