Elastomeric heat sink with a pressure sensitive adhesive backing

• US 6,886,625 B1
• Filed: 08/16/2002
• Issued: 05/03/2005
• Est. Priority Date: 08/23/2001
• Status: Expired due to Fees

• Current Assignee: Ticona Polymers, Inc. (Celanese Corporation)
• Original Assignee: Cool Options, Inc.
• Inventors: Sagal, E. Mikhail, McCullough, Kevin A., Panek, Jeffrey
• Primary Examiner(s): Flanigan, Allen J.
• Application Number:
  US10/222,574
• Time in Patent Office: 991 Days
• Field of Search: 165/46, 165/80.3, 165/185, 361/704, 361/710
• US Class Current: 165/46
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties. In addition, the present invention provides a method of manufacturing an elastomeric heat sink device as described above.

Claims

1. A heat dissipating device, comprising:

a flexible base member having a top surface, surface area enhancements adjacent to and integrally molded with said top surface, a deformable bottom surface and a thickness, said base member and said surface area enhancements molded from an elastomeric polymer base matrix and a thermally conductive filler loaded in said polymer base matrix; and

an adhesive layer on said bottom surface of said base member.

2. The heat dissipating device of claim 1, wherein said thermally conductive filler is selected from the group consisting of carbon fiber, carbon flakes, carbon powder, boron nitride, metallic flakes and crushed glass.

3. The heat dissipating device of claim 1, wherein said adhesive layer is a pressure sensitive adhesive.

4. A heat dissipating assembly, comprising:

a heat sink, said heat sink having a flexible base member having a top surface, surface area enhancements adjacent to and integrally molded with said top surface, a bottom surface and a thickness, said base member and said surface area enhancements molded from an elastomeric polymer base matrix and a thermally conductive filler loaded in said polymer base matrix and an adhesive layer on said bottom surface of said base member; and

a heat generating surface having surface irregularities, said bottom surface of said base member being received on said heat generating surface wherein said bottom surface of said base member conforms to said surface irregularities and is retained in contact with said heat generating surface by said adhesive layer.

5. The heat dissipating assembly of claim 4, wherein said thermally conductive filler is selected from the group consisting of carbon fiber, carbon flakes, carbon powder, boron nitride, metallic flakes and crushed glass.

6. The heat dissipating assembly of claim 4, wherein said adhesive layer is a pressure sensitive adhesive.