Implantable medical device incorporating miniaturized circuit module

• US 6,889,084 B2
• Filed: 03/31/2003
• Issued: 05/03/2005
• Est. Priority Date: 11/08/2000
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Haubrich, Gregory J., Thompson, David L.
• Primary Examiner(s): LAYNO, CARL HERNANDZ
• Application Number:
  US10/403,742
• Publication Number:
  US 20040015199A1
• Time in Patent Office: 764 Days
• Field of Search: 607/2, 607 4- 5, 607/32, 607 36- 37, 607/60
• US Class Current: 607/36
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: Y10S 977/932 for electronic or optoelectronic application
• CPC Class Codes: Y10S 977/94 in a logic circuit

Abstract

Implantable medical devices (IMDs) having RF telemetry capabilities for uplink transmitting patient data and downlink recieving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof. An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor.

Claims

1. An implantable medical device operable to perform a therapeutic and/or monitoring function comprising:

a housing having a housing side wall and inner and outer wall surfaces of a predetermined contour enclosing a hermetically sealed chamber;

a battery enclosed within said hermetically sealed chamber; and

an electronic module powered by said battery having a volumetric form factor dimensioned to fit within said hermetically sealed chamber along with said battery, said electronic module comprising a module substrate board, a plurality of discrete components and at least one integrated circuit IC chip;

said module substrate having a predetermined module substrate thickness with a well formed in said module substrate extending from a module substrate surface through at least a portion of said module substrate thickness, and at least one module bonding pad formed on the electronic module substrate surface,

said IC chip having a predetermined IC chip substrate thickness, at least one IC bonding pad formed on an exposed IC chip surface, and said IC chip mounted within said well of said electronic module substrate thereby reducing the form factor of the electronic module, and

a conductor extending between said module bonding pad and said IC bonding pad.

2. The implantable medical device of claim 1, wherein said electronic module further comprises an RF module incorporating a telemetry transceiver.

3. The implantable medical device of claim 2, further comprising at least one discrete capacitor mounted to said exposed IC chip surface.

4. The implantable medical device of claim 2, further comprising at least one IC inductor formed integrally with the IC chip substrate thereby reducing the form factor of the RF module.

5. The implantable medical device of claim 4, further comprising at least one discrete capacitor mounted to said exposed IC chip surface.

6. The implantable medical device of claim 1, further comprising at least one IC inductor formed integrally with the IC chip substrate thereby reducing the form factor of the electronic module.

7. An implantable medical device operable to perform a therapeutic and/or monitoring function comprising:

a housing having a housing side wall and inner and outer wall surfaces of a predetermined contour enclosing a hermetically seated chamber;

a battery enclosed within said hermetically sealed chamber; and

an electronic module powered by said battery having a volumetric form factor dimensioned to fit within said hermetically sealed chamber along with said battery, said electronic module comprising a module substrate board, and at least one discrete component and at least one integrated circuit IC chip are mounted to said electronic module, and

wherein at least one discrete capacitor is mounted to said exposed IC chip surface thereby reducing the form factor of the electronic module, said IC chip has at least IC bonding pad formed on an exposed IC chip surface, and said at least one discrete capacitor is electrically connected to said at least one IC bonding pad.

8. The implantable medical device of claim 7, wherein said electronic module further comprises an RF module incorporating a telemetry transceiver.

9. The implantable medical device of claim 8, further comprising at least one IC inductor formed integrally with the IC chip substrate thereby reducing the form factor of the RF module.

10. The implantable medical device of claim 7, further comprising at least one IC inductor formed integrally with the IC chip substrate thereby reducing the form factor of the electronic module.