Process condition sensing wafer and data analysis system
First Claim
Patent Images
1. A system for sensing and recording or transmitting processing conditions comprising:
- a substrate having a surface, the substrate comprising sensors to measure the processing conditions of the substrate at different areas of the substrate;
one or more electronics platforms mounted to the surface of the substrate comprising signal acquisition circuitry coupled to an output of the sensors;
the one or more electronics platforms individually comprising at least one integrated circuit; and
wherein each of the one or more platforms comprise one or more legs and a shelf, the one or more legs elevating the shelf from the surface.
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Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
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Citations
33 Claims
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1. A system for sensing and recording or transmitting processing conditions comprising:
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a substrate having a surface, the substrate comprising sensors to measure the processing conditions of the substrate at different areas of the substrate;
one or more electronics platforms mounted to the surface of the substrate comprising signal acquisition circuitry coupled to an output of the sensors;
the one or more electronics platforms individually comprising at least one integrated circuit; and
wherein each of the one or more platforms comprise one or more legs and a shelf, the one or more legs elevating the shelf from the surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system for sensing and recording or transmitting processing conditions comprising:
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a substrate having a surface, the substrate comprising sensors to measure the processing conditions of the substrate at different areas of the substrate;
one or more electronics platforms mounted to the surface of the substrate comprising signal acquisition circuitry coupled to an output of the sensors;
wherein each of the one more platforms comprise one or more legs and a shelf, the one or more legs elevating the shelf from the surface wherein the electronics platform further comprises data transmission circuitry comprising a transceiver, the data transmission circuitry operable to transmit the processing conditions in real time during measurement of the processing conditions to the data processing module via the transceiver. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A system for sensing and recording or transmitting processing conditions comprising:
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a substrate having a surface, the substrate comprising sensors to measure the processing conditions of the substrate at different areas of the substrate;
one or more electronics platforms mounted to the surface of the substrate comprising signal acquisition circuitry coupled to an output of the sensors; and
wherein the electronics platform is mounted to a recessed portion of the surface of the substrate, wherein the recessed portion and the platform are within a cavity and wherein the platform is substantially equal in mass to the removed cavity.
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21. A system for sensing processing conditions comprising:
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a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform including at least one integrated circuit;
the electronics platform mounted to the substrate by one or more leas that elevate the platform from the substrate; and
a gap between the electronics platform and the substrate wherein the gap is from 1 mm to 5 mm.
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22. A system for sensing processing conditions comprising:
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a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform including at least one integrated circuit; and
the electronics platform mounted to the substrate by one or more legs that elevate the platform from the wherein the one or more legs are between 1 mm to 5 mm in height and between 0.05 mm and 1.0 mm in width.
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23. A system for sensing processing conditions comprising:
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a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform including at least one integrated circuit;
the electronics platform mounted to the substrate by one or more legs that elevate the platform from the substrate; and
an electrical cable between the electronics platform and the substrate.
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24. A system for sensing processing conditions comprising:
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a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform including at least one integrated circuit; and
the electronics platform mounted to the substrate by one or more legs that elevate the platform from the substrate wherein the one or more legs insulate the platform from high temperatures at the substrate.
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25. A system for sensing processing conditions comprising:
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a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform encompassing at least one integrated circuit; and
the electronics platform mounted to the substrate by one or more lees that elevate the platform from the substrate. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33)
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Specification