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Polymer film metalization

  • US 6,890,813 B2
  • Filed: 01/06/2003
  • Issued: 05/10/2005
  • Est. Priority Date: 01/06/2003
  • Status: Expired due to Fees
First Claim
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1. A method for forming a conductive layer on a ferroelectric polymer layer, comprising:

  • forming a conductive polymer layer on the ferroelectric polymer layer;

    using conventional lithography and etch processes to pattern the conductive polymer;

    removing the patterning photoresist using etch and clean processes; and

    depositing a conductive layer on the conductive polymer layer using an electroless plating process.

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