Fabrication of on-package and on-chip structure using build-up layer process
First Claim
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1. A process of forming an inductor comprising:
- providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming electrical communication for the at least one microelectronic device, wherein the electrical communication comprises at least two electrically conductive layers;
patterning an inductor on the substrate, wherein patterning an inductor on the substrate comprises;
forming first helical coil; and
forming a second helical coil that is interwound with the first helical coil; and
connecting the inductor to the at least one microelectronic device.
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Abstract
The invention relates to a process of forming an on-chip package inductor. The process includes providing a substrate with at least one microelectronic device packaged therewith. As part of the inventive process, electrical communication is formed for the microelectronic device. The electrical communication includes at least two electrically conductive layers. As part of the inventive technology, the inductor is patterned on the substrate before, during, or after formation of the electrical communication. The inductor is connected to the at least one microelectronic device.
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Citations
25 Claims
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1. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming electrical communication for the at least one microelectronic device, wherein the electrical communication comprises at least two electrically conductive layers;
patterning an inductor on the substrate, wherein patterning an inductor on the substrate comprises;
forming first helical coil; and
forming a second helical coil that is interwound with the first helical coil; and
connecting the inductor to the at least one microelectronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11)
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10. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming electrical communication for the at least one microelectronic device, wherein the electrical communication comprises at least two electrically conductive layers;
patterning an inductor on the substrate, wherein patterning an inductor on the substrate comprises;
forming first spiral coil with a first spiral direction; and
forming a second coil with a second spiral direction that is wound opposite the first spiral direction; and
connecting the inductor to the at least one microelectronic device.
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12. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming a first dielectric layer on the substrate;
patterning a first seed layer on the substrate;
patterning a first conductive trace on the first seed layer;
forming a second dielectric layer over the first conductive trace;
patterning a second seed layer on the second dielectric layer;
patterning a second conductive trace over the second seed layer;
forming first helical coil; and
forming a second helical coil that is interwound with the first helical coil. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 22)
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20. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming a first dielectric layer on the substrate;
patterning a first seed layer on the substrate;
patterning a first conductive trace on the first seed layer;
forming a second dielectric layer over the first conductive trace;
patterning a second seed layer on the second dielectric layer;
patterning a second conductive trace over the second seed layer forming a first spiral coil; and
forming a second spiral coil that winds opposite the first coil.
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21. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming electrical communication for the at least one microelectronic device;
forming a first dielectric layer on the substrate;
patterning a first conductive trace over the first dielectric layer, wherein patterning comprises using lift-off technique;
forming a second dielectric layer over the first conductive trace;
patterning a second conductive trace over the second dielectric layer; and
connecting the inductor to the at least one microelectronic device.
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23. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith;
forming electrical communication for the at least one microelectronic device;
forming a first dielectric layer on the substrate;
patterning a first conductive trace over the first dielectric layer, wherein patterning comprises using lift-off technique;
forming a second dielectric layer over the first conductive trace;
patterning a second conductive trace over the second dielectric layer; and
connecting the inductor to the at least one microelectronic device.
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24. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith, and wherein providing a substrate comprises;
providing the first encapsulated microelectronic device assembly with an active front surface, an inactive front surface, and a back surface, wherein the inductor is disposed at a border of the active front surface and the inactive front surface;
forming electrical communication for the at least one microelectronic device;
forming a first dielectric layer on the substrate;
patterning a first conductive trace over the first dielectric layer;
forming a second dielectric layer over the first conductive trace;
patterning a second conductive trace over the second dielectric layer; and
connecting the inductor to the at least one microelectronic device.
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25. A process of forming an inductor comprising:
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providing a substrate, wherein the substrate comprises at least one microelectronic device packaged therewith, and wherein providing a substrate comprises;
providing the first encapsulated microelectronic device assembly with an active front surface, an inactive front surface, and a back surface, wherein the inductor is disposed at a border of the active front surface and the inactive front surface;
forming electrical communication for the at least one microelectronic device;
forming a first dielectric layer on the substrate;
patterning a first conductive trace over the first dielectric layer;
forming a second dielectric layer over the first conductive trace;
patterning a second conductive trace over the second dielectric layer; and
connecting the inductor to the at least one microelectronic device.
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Specification