Integrated sensor and electronics package

• US 6,891,239 B2
• Filed: 02/26/2003
• Issued: 05/10/2005
• Est. Priority Date: 03/06/2002
• Status: Active Grant

• Current Assignee: Charles Stark Draper Laboratory Incorporated
• Original Assignee: Charles Stark Draper Laboratory Incorporated
• Inventors: Hanson, David S., Anderson, Richard S., Marinis, Thomas F., Soucy, Joseph W., Connelly, James H.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): TRAN, MAI HUONG C
• Application Number:
  US10/374,400
• Publication Number:
  US 20040007750A1
• Time in Patent Office: 804 Days
• Field of Search: 257/704, 257/710, 257/774, 737/56, 361/761, 264/161
• US Class Current: 257/414
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.

Claims

1. An integrated sensor and electronics package comprising:

a package substrate;

a micro-electromechanical sensor die bonded to one side of the package substrate;

one or more electronic chips bonded to an opposite side of the package substrate;

internal electrical connections running from the sensor die, through the package substrate, and to the one or more electronic chips; and

input/output connections on the package substrate electrically connected to at least one or more of the electronic chips.

2. The integrated package of claim 1 in which the package substrate is made of a high temperature co-fired ceramic material or a low temperature co-fired ceramic material.

3. The integrated package of claim 1 in which the package substrate is a laminate structure.

4. The integrated package of claim 1 further including a cavity in the substrate, the sensor die located in the cavity.

5. The integrated package of claim 1 in which the sensor die includes:

a sensor substrate,

a microelectromechanical structure machined from the substrate, and

a cap secured to the sensor substrate covering the microelectromechanical structure.

6. The integrated package of claim 5 in which the cap includes electrical connections therethrough.

7. The integrated package of claim 5 in which the cap is attached to the package substrate.

8. The integrated package of claim 5 in which the sensor substrate is bonded to the package substrate.

9. The integrated package of claim 5 in which the microelectromechanical structure is configured as a gyroscope or accelerometer.

10. The integrated package of claim 9 in which there are at least two electronic chips, an application specific integrated circuit chip for controlling the microelectromechanical sensor die and a digital gate array chip for processing the output of the application specific integrated circuit chip.

11. The integrated package of claim 10 in which the application specific integrated circuit chip is bonded to the package substrate and the digital gate array chip is bonded to the application specific integrated circuit chip.

12. The integrated package of claim 11 in which the digital gate array chip is wire bonded to the application specific integrated circuit chip and the application specific integrated circuit chip is wire bonded to the package substrate.

13. The integrated package of claim 10 further including at least one de-coupling capacitor chip mounted on the package substrate for buffering signals to and from the application specific integrated circuit chip.

14. The integrated package of claim 13 in which the de-coupling capacitor chip is a surface mount chip.

15. The integrated package of claim 5 in which the microelectromechanical structure is configured as an optical sensor and the cap includes a window.

16. The integrated package of claim 5 in which the microelectromechanical structure is configured as a pressure sensor and the cap includes an opening therethrough.

17. The integrated package of claim 5 in which the microelectromechanical structure is configured as chemical or biological agent detector and the cap includes an opening therethrough.

18. The integrated package of claim 1 in which the input/output connections are solder balls.

19. The integrated package of claim 1 further including potting material encapsulating the one or more electronic chips.

20. The integrated package of claim 1 further including a cover over the one or more electronic chips.

21. The integrated package of claim 1 further including a shield over the microelectromechanical sensor die.

22. An integrated sensor and electronics package comprising:

a package substrate including a cavity in one surface thereof;

a micro-electromechanical sensor die including a sensor substrate and a cap sealed to the sensor substrate, the cap received in the cavity of the package substrate;

at least two stacked electronic chips bonded to an opposite side of the package substrate;

internal electrical connections running from the sensor die, through the cap, through the package substrate, and to the one or more electronic chips; and

input/output connections adjacent the cavity of the package substrate and electrically connected to one or more of the electronic chips.

23. An integrated sensor and electronics package comprising:

a package substrate including a cavity in one surface thereof;

a micro-electromechanical sensor die including a sensor substrate and a cap sealed to the sensor substrate, the sensor substrate bonded in the cavity of the package substrate;

at least two stacked electronic chips bonded to an opposite side of the package substrate;

internal electrical connections running from the sensor die, through the cap, through the package substrate, and to the one or more electronic chips; and

input/output connections adjacent the cavity package substrate and electrically connected to one or more of the electronic chips.

24. An integrated sensor and electronics package comprising:

a package substrate;

a micro-electromechanical sensor die including a sensor substrate, a microelectromechanical structure configured as an accelerometer or gyroscope machined from the substrate, and a cap covering the microelectromechanical structure;

an application specific integrated circuit chip for controlling the microelectromechanical structure bonded to an opposite side of the package substrate;

a digital gate array chip bonded to the application specific integrated circuit chip;

internal electrical connections running from the sensor die, through the package substrate, and to the application specific integrated circuit chip and running from the application specific integrated circuit chip to the digital gate array chip; and

input/output connections on the package substrate electrically connected to the application specific integrated circuit chip through the package substrate.