Aligning apparatus in semiconductor device test handler

• US 6,891,341 B2
• Filed: 12/09/2002
• Issued: 05/10/2005
• Est. Priority Date: 12/17/2001
• Status: Expired due to Fees

• Current Assignee: Mirae Corporation
• Original Assignee: Mirae Corporation
• Inventors: Cho, Jae Hyuk
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): MILLER, PATRICK L
• Application Number:
  US10/314,388
• Publication Number:
  US 20030111970A1
• Time in Patent Office: 883 Days
• Field of Search: 414/331.14, 414/749.6, 414935- 41, 29739-741, 269/42, 269/43, 269/45, 269/56, 269/60, 318/625, 318/628, 318/687, 318/649, 318/67, 318/135, 355/52, 355/53, 355/72, 355/74, 355/75, 310/10, 310/12
• US Class Current: 318/34
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling

Abstract

An aligning apparatus for a semiconductor device test handler is provided which reduces semiconductor device loading and unloading time. An exchange unit of the handler includes a pair of aligners which operate independently to continuously transfer devices to a test site of the handler for test, and then away from the handler upon completion of the test. Both horizontal and vertical movement of each of the aligners facilitates the loading and unloading of semiconductor devices. This aligning apparatus provides for simplified design and operation of the aligners, and improves loading and unloading speed, thereby enhancing test efficiency.

Claims

1. An aligning apparatus in a semiconductor device handler, comprising:

first and second guide members installed parallel to each other on a handler body;

third and fourth guide members installed parallel to each other and under the first and second guide members, respectively;

a first aligner with a first end thereof coupled to the first guide member, and a second end thereof coupled to the second guide member so as to move along the first and second guide members, respectively, wherein a first plurality of device landing recesses are arranged at a first predetermined interval from each other on the first aligner;

a second aligner with a first end thereof coupled to the third guide member, and a second end thereof coupled to the fourth guide member so as to be installed at a level lower than that of the first aligner, wherein a second plurality of device landing recesses are arranged at a second predetermined interval from each other on the second aligner;

a first driving means for driving the first aligner along the first and second guide members; and

a second driving means for driving the second aligner along the third and fourth guide members separately from the first aligner.

2. The aligning apparatus of claim 1, wherein the first driving means comprises:

a first driving motor installed at one side of the first or second guide member;

a first driving shaft installed so as to connect first ends of the first and second guide members and coupled with the first driving motor so as to revolve in response to a driving of the first driving motor;

a first pair of driving pulleys, wherein one of the first pair of driving pulleys is installed at each end of the first driving shaft;

a first pair of driven pulleys rotatably installed at second ends of the first and second guide members; and

first and second driving belts each connecting respective first driving and first driven pulleys and each coupled with a respective end of the first aligner.

3. The aligning apparatus of claim 2, wherein the second driving means comprises:

a second driving motor installed at one side of the third or fourth guide member;

a second driving shaft installed so as to connect first ends of the third and fourth guide members and coupled with the second driving motor so as to revolve;

a pair of second driving pulleys, wherein one of the second pair of driving pulleys is installed at each of the second driving shaft;

a pair of second driven pulleys rotatably installed at second ends of the third and fourth guide members; and

third and fourth driving belts each connecting respective second driving and second driven pulleys and each coupled to a respective end of the second aligner.

4. The aligning apparatus of claim 1, wherein the second driving means comprises:

a second driving motor installed at one side of the third or fourth guide member;

a second driving shaft installed so as to connect first ends of the third and fourth guide members and coupled with the second driving motor so as to revolve in response to a driving of the first driving motor;

a pair of second driving pulleys, wherein one of the second pair of driving pulleys is installed at each end of the second driving shaft;

a pair of second driven pulleys rotatably installed at second ends of the third and fourth guide members; and

third and fourth driving belts each connecting respective second driving and second driven pulleys and each coupled to a respective end of the second aligner.

5. The aligning apparatus of claim 1, wherein the second aligner is configured to move upward and downward at front and rear ends of the third and fourth guide members so as to be disposed at the same level as the first aligner, and wherein an elevating means for elevating the second aligner to a predetermined level is installed under both ends of the second aligner.

6. The aligning apparatus of claim 5, wherein the elevating means comprises:

a pair of movable blocks coupled to the third and fourth guide members, wherein each of the pair of moveable blocks is configured to move along one of the third and fourth guide members, and wherein both of the ends of the second aligner are coupled to the movable blocks and configured to be elevated; and

a pair of cylinders provided at both ends of the second aligner at one side of a respective movable block.

7. A semiconductor device handler comprising the aligning apparatus of claim 1.

8. An aligning apparatus for a semiconductor device handler, comprising:

a first guide member;

a second guide member positioned parallel to the first guide member;

a third guide member positioned beneath the first guide member;

a fourth guide member positioned beneath the second guide member and parallel to the third guide member;

a first aligner configured to be movably coupled to the first and second guide members;

a second aligner provided at a different level than that of the first aligner and configured to be movably coupled to the third and fourth guide members;

a first driver configured to drive the first aligner along the first and second guide members;

a second driver configured to drive the second aligner along the third and fourth guide members; and

an elevating device configured to elevate the second aligner to a position level with the first aligner, and to return the second aligner to a position lower than the first aligner.

9. The aligning apparatus of claim 8, wherein the second driver is configured to drive the second aligner independent of the first aligner.

10. The apparatus of claim 8, wherein the first driver comprises:

a first driving motor provided proximate the first or second guide member;

a first driving shaft rotatably coupled to the first driving motor, wherein each end of the first driving shaft is configured to be coupled to a corresponding end of the first and second guide members;

a pair of first driving pulleys, wherein a first driving pulley is configured to be fixed to each end of the first driving shaft;

a pair of first driven pulleys, wherein a first driven pulley is configured to be rotatably installed at an end of each of the first and second guide members opposite the first driving shaft;

a pair of first driving belts, wherein each first driving belt is configured to connect a respective pair of first driving and first driven pulleys.

11. The apparatus of claim 10, wherein the second driver comprises:

a second driving motor provided proximate the third or fourth guide member;

a second driving shaft rotatably coupled to the second driving motor, wherein each end of the second driving shaft is configured to be coupled to a corresponding end of the third and fourth guide members;

a pair of second driving pulleys, wherein a second driving pulley is configured to be fixed to each end of the second driving shaft;

a pair of second driven pulleys, wherein a second driven pulley is configured to be rotatably installed at an end of each of the third and fourth guide members opposite the second driving shaft;

a pair of second driving belts, wherein each second driving belt is configured to connect a respective pair of second driving and second driven pulleys.

12. The apparatus of claim 8, wherein an end of the first aligner is configured to be movably coupled to the first guide member, and an opposite end of the first aligner is configured to be movably coupled to the second guide member.

13. The apparatus of claim 12, wherein an end of the second aligner is configured to be movably coupled to the third guide member, and an opposite end of the second aligner is configured to be movably coupled to the fourth guide member so as to position the second aligner at a lower level than the first aligner.

14. The apparatus of claim 8, wherein the elevating device is configured to elevate and to lower the second aligner when the second aligner is positioned at a front end portion and a rear end portion of the third and fourth guide members.

15. The apparatus of claim 14, wherein the elevating device comprises:

a pair of moveable blocks configured to be moveably coupled to the third and fourth guide members, respectively, so as to move along a length of the third and fourth guide members;

a pair of elevating blocks configured to be moveably coupled to the pair of moveable blocks, and to be elevated and lowered with respect to the pair of moveable blocks; and

a pair of cylinders configured to elevate and lower the pair of elevating blocks.

16. The apparatus of claim 15, wherein opposite ends of the second aligner are configured to be fixed to a respective moveable block of the pair of moveable blocks so as to move along the third and fourth guide members.

17. The apparatus of claim 16, wherein opposite ends of the second aligner are configured to be fixed to a respective elevating block of the pair of elevating blocks so as to be elevated and lowered through the action of the pair of cylinders.

18. The apparatus of claim 8, wherein the first aligner comprises a first plurality of landing recesses configured to receive a corresponding plurality of semiconductor devices.

19. The apparatus of claim 18, wherein the first plurality of landing recesses are formed at a first predetermined interval from each other on the first aligner.

20. The apparatus of claim 18, wherein the second aligner comprises a second plurality of landing recesses configured to receive a corresponding plurality of semiconductor devices.

21. The apparatus of claim 20, wherein the second plurality of landing recesses are formed at a second predetermined interval from each other on the second aligner.

22. The apparatus of claim 21, further comprising a lower pushing unit positioned below the first and second aligners and configured to unload semiconductor devices from the first and second aligners through passing holes formed in the first and second plurality of landing recesses formed in the first and second aligners, respectively, and to load the semiconductor devices onto test trays for testing.

23. The apparatus of claim 22, further comprising an upper pushing unit positioned above the first and second aligners and configured to load tested semiconductor devices from the test trays onto the first and second aligners.

24. A semiconductor device handler comprising the apparatus of claim 8.