Light modulator and method of manufacturing the same

• US 6,891,654 B2
• Filed: 06/17/2002
• Issued: 05/10/2005
• Est. Priority Date: 06/26/2001
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kurosawa, Ryuichi, Kamisuki, Shinichi
• Primary Examiner(s): Mack, Ricky
• Assistant Examiner(s): THOMAS, BRANDI N
• Application Number:
  US10/171,620
• Publication Number:
  US 20030161027A1
• Time in Patent Office: 1,058 Days
• Field of Search: 359/291, 359/292, 359/295, 359/298, 359/290, 359/293, 359/223, 359/224, 359/280, 359/281, 359/282, 359/214, 359/236
• US Class Current: 359/291
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A method of manufacturing a light modulator in which micromirrors are tilted by an electrostatic force generated by an electrical potential difference between drive electrodes and the micromirrors. The method includes integrally forming support sections disposed at fulcrum points for tilting the micromirrors and axis portions forming axes for tilting the micromirrors.

Claims

1. A method of manufacturing a light modulator in which micromirrors are tilted by an electrostatic force generated by an electrical potential difference between drive electrodes and the micromirrors, the method comprising:

providing a first layer on a second layer;

integrally forming from the first layer provided on the second layer the micromirrors, support sections disposed at fulcrum points for tilting the micromirrors and axis portions which form axes for tilting the micromirrors; and

removing the second layer from the first layer.

2. The method of manufacturing a light modulator as defined in claim 1,

further comprising bonding a first substrate including the drive electrodes to a second substrate which includes:

the first layer the second layer and a third layer provided between the first and second layers and acting as a stopping layer when the second layer is removed.

3. The method of manufacturing a light modulator as defined in claim 2,

wherein end portions of the support sections of the second substrate are bonded to the first substrate, after the formation of the support sections.

4. The method of manufacturing a light modulator as defined in claim 3,

wherein the end portions of the support sections of the second substrate are bonded to the first substrate with an adhesive interposed.

5. The method of manufacturing a light modulator as defined in claim 4,

wherein the adhesive is provided on the first substrate.

6. The method of manufacturing a light modulator as defined in claim 3,

wherein the second layer is removed using the third layer as a stopping layer after the bonding of the first and second substrates.

7. The method of manufacturing a light modulator as defined in claim 4,

wherein the second layer is removed using the third layer as a stopping layer after the bonding of the first and second substrates.

8. The method of manufacturing a light modulator as defined in claim 5,

wherein the second layer is removed using the third layer as a stopping layer after the bonding of the first and second substrates.

9. The method of manufacturing a light modulator as defined in claim 6,

wherein the micromirrors and the support sections are formed after the removal of the second layer.

10. The method of manufacturing a light modulator as defined in claim 3,

wherein the micromirrors and the support sections are formed before the bonding of the first and second substrates.

11. The method of manufacturing a light modulator as defined in claim 4,

wherein the micromirrors and the support sections are formed before the bonding of the first and second substrates.

12. The method of manufacturing a light modulator as defined in claim 5,

wherein the micromirrors and the support sections are formed before the bonding of the first and second substrates.

13. The method of manufacturing a light modulator as defined in claim 6,

wherein the micromirrors and the support sections are formed before the bonding of the first and second substrates.

14. The method of manufacturing a light modulator as defined in claim 7,

wherein the micromirrors and the support sections are formed before the bonding of the first and second substrates.

15. The method of manufacturing a light modulator as defined in claim 8,

wherein the micromirrors and the support sections are formed before the bonding of the first and second substrates.