×

Method and apparatus for monitoring integrated circuit fabrication

  • US 6,892,156 B2
  • Filed: 06/22/2004
  • Issued: 05/10/2005
  • Est. Priority Date: 11/04/2002
  • Status: Active Grant
First Claim
Patent Images

1. A sensor unit for sensing at least one process parameter of a process to manufacture an integrated circuit using integrated circuit processing equipment that includes a wafer handling apparatus, the sensor unit comprising:

  • a substrate that is capable of being disposed on the wafer handling apparatus;

    a first sensor, disposed on or in the substrate, to sample a first parameter of the process;

    a second sensor, disposed on or in the substrate, to sample a second parameter of the process, wherein the second sensor is a different type of sensor from the first sensor.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×