Pressure sensing device for rheometers

• US 6,892,583 B2
• Filed: 10/31/2002
• Issued: 05/17/2005
• Est. Priority Date: 10/31/2001
• Status: Active Grant

• Current Assignee: RheoSense, Inc.
• Original Assignee: RheoSense, Inc.
• Inventors: Baek, Seong-Gi
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): ALLEN, ANDRE J
• Application Number:
  US10/286,602
• Publication Number:
  US 20030079547A1
• Time in Patent Office: 929 Days
• Field of Search: 737/15, 737/00, 737/16, 737/18, 361/283.4, 361/283.1, 361/283.3
• US Class Current: 73/715
• CPC Class Codes: G01L 15/00 Devices or apparatus for measuring two or more fluid pressure values simultaneously
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01L 9/0079 with Fabry-Perot arrangements
• CPC Class Codes: G01M 13/022 Power-transmitting couplings or clutches
• CPC Class Codes: G01N 11/08 by measuring pressure required to produce a known flow

Abstract

An improved rheometer plate includes a smooth sensing surface with monolithically integrated miniature pressure sensors which do not interfere with the smooth surface. Pressure sensing diaphragms formed by the smooth surface deflect in response to local pressures against the surface to enable the measurement of unperturbed local pressures of materials sheared between plates. The pressure sensors are sufficiently small that measured pressures are considered to be significantly local properties compared to the size of the plate. Normal stress differences and viscosity of fluid are measured accordingly. The membrane covers a plurality of wells or recesses with pressure sensors located in the wells to measure the deflection of the membrane over the wells. Capacitive or other sensors may be used. The rheometer plate can be used as part of a slit rheometer with a slit of varying dimensions.

Claims

1. A plate having a plurality of pressure sensors at spaced locations therein to measure pressure exerted against a substantially smooth measuring surface of the plate at the locations of the pressure sensors, comprising:

a plate having a substantially smooth measuring surface against which a liquid can act;

a plurality of cavities in the plate under the measuring surface;

deformable portions of the measuring surface of the plate extending over each of the plurality of cavities and resiliently deformable into the cavities in response to pressure applied to the deformable portions of the measuring surface; and

a single sensor in each of the plurality of cavities, each sensor cooperable with the deformable portion of the measuring surface extending over that cavity to sense the deformation of such deformable portion and provide a signal indicative of a single deformation sensed, the deformation of the deformable portions being indicative of the pressure applied to such deformable portions.

2. A plate having a plurality of pressure sensors according to claim 1, wherein the measuring surface is formed by a wafer secured to a substrate.

3. A plate having a plurality of pressure sensors according to claim 2, wherein the cavities are created by wells formed in the wafer, the wells resulting in thin portions of the wafer that extend over the wells and form the deformable portions of the measuring surface.

4. A plate having a plurality of pressure sensors according to claim 2, wherein the cavities are created by wells formed in the substrate, wherein portions of the wafer extend over the wells in the substrate, the portions of the wafer which extend over the wells forming the deformable portions of the measuring surface.

5. A plate having a plurality of pressure sensors according to claim 2, additionally including a spacer positioned between the wafer and the substrate, wherein the cavities are created by openings extending through the spacer, wherein portions of the wafer extend over the openings in the spacer, the portions of the wafer which extend over the openings in the spacer forming the deformable portions of the measuring surface.

6. A plate having a plurality of pressure sensors according to claim 2, wherein a deformable portion of the measuring surface forms a side of each cavity and the substrate forms an opposite side of each cavity, and wherein the sensors are capacitive sensors formed by a capacitor plate on the deformable portion of the measuring surface in each cavity and a capacitor plate on the substrate on the opposite side of the each cavity.

7. A plate having a plurality of pressure sensors according to claim 6, wherein the capacitor plates are formed by conductive layers deposited on the opposite sides of the cavities.

8. A plate having a plurality of pressure sensors according to claim 7, additionally including conductive leads extending from each capacitor plate to a contact pad for connection to a sensor circuit.

9. A plate having a plurality of pressure sensors according to claim 2, wherein a deformable portion of the measuring surface forms a side of each cavity and the substrate forms an opposite side of each cavity, and wherein the sensors are optical sensors formed by a reflective mirror on the deformable portion of the measuring surface in each cavity, a partially transparent layer on the substrate on the opposite side of each cavity, a light source to direct light to the partially transparent layer so a portion of the light is passed through the partially transparent layer to the reflecting mirror and a portion of the light is reflected back from the partially transparent layer, whereby at least a portion of the light passed to the reflective mirror is reflected back through the partially transparent layer and interacts with the light reflected from the partially transparent layer to create an interference pattern, and a sensor to sense the intensity of the light at a fixed location in the interference pattern, the intensity of the light sensed being an indication of the deformation of the deformable portion.

10. A plate having a plurality of pressure sensors according to claim 1, additionally including a protective layer on the measuring surface.

11. A plate having a plurality of pressure sensors according to claim 1, additionally including an air passage connecting each cavity with the atmosphere.

12. A plate having a plurality of pressure sensors according to claim 1, additionally including a proximity sensor in the plate to measure the distance of a sensed object from the measuring surface.

13. A plate having a plurality of pressure sensors according to claim 12, wherein the proximity sensor is a capacitive sensor.

14. A plate having a plurality of pressure sensors according to claim 1, wherein the length of each deformable portion is less than one-quarter of the length of the plate.

15. A plate having a plurality of pressure sensors according to claim 1, wherein different sensors of the plurality of sensors vary in their measurement sensitivity.

16. A plate having a plurality of pressure sensors according to claim 1, wherein the plate forms one side of a flow passage through a body having a plurality of recesses, each recess of the plurality of recesses in the body having different dimensions and being connected together in series to form the flow passage through the body;

means for causing flow of fluid through the recesses; and

wherein a plurality of the plurality of pressure sensors are associated with each recess to provide indications of pressure exerted by fluid in the recess against the recess at the location of each of the pressure sensors associated with the recess to thereby form a slit rheometer.

17. A plate having a plurality of pressure sensors according to claim 16, wherein there are at least two recesses.

18. A plate having a plurality of pressure sensors according to claim 16, wherein there are at least two pressure sensors associated with each recess.

19. A plate having a plurality of pressure sensors according to claim 1, additionally including at least one temperature sensor to sense the temperature of the measuring surface of the plate.

20. A plate having a plurality of pressure sensors according to claim 1, additionally including a plurality of temperature sensors to sense the temperature of the measuring surface of the plate at the location of the temperature sensors.

21. A pressure sensor, comprising:

a wafer having opposite sides, one side forming a smooth measuring surface against which a liquid may exert pressure;

a plurality of wells extending into the wafer from the side opposite the measuring side, said wells forming thin deformable portions of the wafer between ends of individual wells and the smooth measuring surface, said thin deformable portions deformable with respect to an individual well in response to pressure applied to the smooth measuring surface over said individual well; and

detectors associated with individual wells of the plurality of wells to detect the deformation of the thin portion of the wafer with respect to individual wells and to provide an output indicative of the pressure applied to that thin section.

22. A pressure sensor according to claim 21, additionally including a substrate mounted on the side of the wafer opposite the measuring side and extending over the plurality of wells, and wherein the detectors for the wells include an electrically conductive material on the thin sections within the wells and electrically conductive material within the wells on the substrate extending over the wells, the electrically conductive material within the wells forming capacitors whose capacitance varies with the deformation of the thin sections.

23. A pressure sensor according to claim 21, wherein the wafer is made up of a spacer having a plurality of openings extending therethrough, and a thin wafer joined to the spacer and extending over the openings therethrough, said thin wafer forming the smooth measuring surface and the thin portions where the wafer extends over an opening in the spacer, and the openings in the spacer forming the wells.

24. A pressure sensor, comprising:

a substrate;

a plurality of wells extending into the substrate from a joining surface of the substrate;

a wafer having opposite sides, one side forming a smooth measuring surface against which a liquid may exert pressure and an opposite side joined to the joining side of the substrate, the wafer forming thin deformable portions of the wafer where the wafer extends over a well, said thin deformable portions deformable with respect to an individual well in response to pressure applied to the smooth measuring surface over said individual well; and

detectors associated with individual wells of the plurality of wells to detect the deformation of the thin portion of the wafer with respect to individual wells and to provide an output indicative of the pressure applied to that thin section.

25. A pressure sensor according to claim 24, wherein the detectors for the wells include an electrically conductive material within the wells on the thin sections extending over the wells, and electrically conductive material within the wells on the substrate, the electrically conductive material within the wells forming capacitors whose capacitance varies with the deformation of the thin sections.

26. A method of producing a plate with a plurality of pressure sensors, comprising the steps of:

obtaining a wafer and a substrate;

forming a plurality of wells in one of the wafer or the substrate;

forming sensor components in the wells;

joining the wafer and substrate to form the plate in a manner so that the wells form cavities in the plate with thin deformable portions of the wafer forming a part of each cavity, the thin deformable portions of the wafer deforming with respect to the cavities in response to liquid pressure applied to the plate, and the sensor components being arranged in the wells to measure the deformation of respective thin sections.