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MEMS capping method and apparatus

  • US 6,893,574 B2
  • Filed: 10/23/2001
  • Issued: 05/17/2005
  • Est. Priority Date: 10/23/2001
  • Status: Active Grant
First Claim
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1. A method for capping a Micro-Electromechanical System (MEMS) device, the method comprising:

  • forming a cap structure having a bottom side with at least a MEMS cavity, a cut capture cavity surrounding the MEMS cavity, and a cap wall, the cap wall forming an outer wall of the MEMS cavity and an inner wall of the cut capture cavity;

    bonding the cap wall onto a MEMS structure;

    filling the cut capture cavity with a protective material; and

    cutting through to the cut capture cavity from a top side of the cap structure to form a cap.

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