Process for producing microelectromechanical components and a housed microelectromechanical component
First Claim
1. A process for producing microelectromechanical components from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the step of providing at least one electrically conductive passage into the substrate, connecting the first side to the second side, wherein the at least one electrically conductive passage comprises a conductive epoxy and is uncovered by thinning the substrate material.
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Accused Products
Abstract
A microelectromechanical component is produced from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, by introducing at least one conductive passage is introduced into the substrate, connecting the first side to the second side.
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Citations
46 Claims
- 1. A process for producing microelectromechanical components from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the step of providing at least one electrically conductive passage into the substrate, connecting the first side to the second side, wherein the at least one electrically conductive passage comprises a conductive epoxy and is uncovered by thinning the substrate material.
- 32. A microelectromechanical component comprising a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side comprising at least one microelectromechanical element, wherein the substrate has at least one electrically conductive passage, comprising a conductive epoxy connecting the first side the second side and wherein the substrate is thinned.
Specification