Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit
First Claim
1. An electronic circuit unit comprising:
- an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
a thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and ground electrodes are disposed near corners on a first side of the one surface and on a second side opposing the first side with non-ground electrodes disposed between the ground electrodes, and on the second side a ground electrode is disposed adjacent to one of the other two ground electrodes.
1 Assignment
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Accused Products
Abstract
Thin film circuit elements including capacitors, resistors, and inductance elements are formed on a large substrate, and semiconductor chips are wire bonded to the substrate. The elements and chips are sealed by potting a sealing resin. The large substrate is divided into multiple stripe substrates by dicing and a thin-film conductive layer is sputtered on cut surfaces of the stripe substrates, thereby electrically connecting edges of lower conductive patterns to edges of upper conductive patterns exposed from side surfaces of the sealing resin through the thin-film conductive layer. A Ni foundation layer and Au layer are successively plated on a surface of the thin-film conductive layer to form edge electrodes on side surfaces of the stripe substrates and the stripe substrates are divided finely into individual alumina substrates.
12 Citations
39 Claims
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1. An electronic circuit unit comprising:
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an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
a thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and ground electrodes are disposed near corners on a first side of the one surface and on a second side opposing the first side with non-ground electrodes disposed between the ground electrodes, and on the second side a ground electrode is disposed adjacent to one of the other two ground electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic circuit unit comprising:
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an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
a thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and the thin film circuit elements include at least first and second capacitors, the first capacitor has a concave shape with two rectangles projecting from one side of another rectangle, and the second capacitor has a tri-rectangular shape with three rectangles arranged continuously in a dislocated relation along a long side of the tri-rectangular shape. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. An electronic circuit unit comprising:
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an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
a thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and the thin film circuit elements include at least a pair of resistors and another resistor, the pair of resistors forming a voltage divider and disposed parallel and adjacent to each other, the other resistor separated by relatively large distance compared with a distance separating the pair of resistors, ratios of resistances of the pair of resistors from desired values being equal. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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27. An electronic circuit unit comprising:
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an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
a thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and the thin film circuit elements include a conductive path connected with an end of one of the inductance elements, the conductive path to increase an inductance of the one of the inductance elements and having a width and characteristic impedance equal to that of the one of the inductance elements. - View Dependent Claims (28, 29, 30)
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31. An electronic circuit unit comprising:
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an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
a thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and the semiconductor chip is fixed on a connection land using conductive adhesive, the connection land having an area smaller than that of a lower surface of the semiconductor chip, the area of the conduction land small enough such that extrusion of the conductive adhesive from dimensions corresponding to semiconductor chip and shorting to the surrounding upper conductive pattern is prevented. - View Dependent Claims (32, 33, 34, 35)
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36. An electronic circuit unit comprising:
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an alumina substrate;
thin film circuit elements including at least one capacitor, at least one resistor, and at least one inductance element formed on one surface of the alumina substrate;
an upper conductive pattern and lower conductive pattern formed on the one surface and an opposing surface of the alumina substrate, respectively, the upper and lower conductive patterns being thin films;
at least one semiconductor chip wire bonded to the upper conductive pattern;
thermosetting resin that seals the circuit elements, upper conductive pattern, and semiconductor chip on the alumina substrate; and
an edge electrode sputtered on a side surface of the alumina substrate, wherein an edge of the upper conductive pattern is exposed from a side surface of the thermosetting resin, and the edge electrode provides a connection between respective edges of the upper conductive pattern and the lower conductive pattern, and the substrate is defined by dividing grooves or a larger substrate, the grooves extending lengthwise and crosswise and forming the side surfaces of the substrate. - View Dependent Claims (37, 38, 39)
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Specification