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Apparatus and method for packaging circuits

  • US 6,894,386 B2
  • Filed: 04/08/2002
  • Issued: 05/17/2005
  • Est. Priority Date: 10/08/2001
  • Status: Expired due to Fees
First Claim
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1. An integrated circuit die, comprising:

  • a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;

    a bond pad on the main body;

    an edge contact at the peripheral edge surface;

    a line connecting the bond pad to the edge contact; and

    wherein the edge contact is beneath the top layer.

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