Radiating enclosure

• US 6,897,373 B2
• Filed: 12/11/2002
• Issued: 05/24/2005
• Est. Priority Date: 05/21/1999
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Barabash, Darrell W.
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): LEE, JINHEE J
• Application Number:
  US10/316,706
• Publication Number:
  US 20030121686A1
• Time in Patent Office: 895 Days
• Field of Search: 174/35.R, 174/35.MS, 174/35.CG, 174/35.C, 174/52.1, 361/816, 361/818, 343/700, 343/702, 343/895
• US Class Current: 174/377
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H04B 1/38 Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
• CPC Class Codes: H05K 9/006 specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier

Abstract

An integrated radiating enclosure is disclosed. The enclosure housing is formed from a dielectric material with a radiating element formed on the exterior surface of the housing and a groundplane material formed on the interior of the housing. The groundplane provides EMI shielding for the enclosed electronics. The three antenna elements are directly connected to the circuitry of a transceiver system, thereby integrating the transceiver antenna components directly into the transceiver enclosure.

Claims

1. A radiating enclosure, comprising:

a dielectric housing having first and second detachable housing portion, each of said first and second housing portions having an inner surface and an outer surface, the dielectric housing capable of receiving a transceiver system when mouted in the dielectric housing;

at least one radiating element disposed on the exterior surface of said first housing portion;

a connection device to establish an electrical connection between said at least one radiating element and the transceiver systems; and

ground plane material distributed substantially on the entirety of the interior surface of said first housing portion, said ground plane material to be electrically coupled to the transceiver system.

2. The radiating enclosure of claim 1, wherein said ground plane material is configured to prevent lectromagnetic interference from substantially escaping said dielectric housing.

3. The radiating enclosure of claim 1, wherein said at least one radiating element is formed from a thin sheet of conductive material adhesively applied to the exterior surface of said first housing portion.

4. The radiating enclosure of claim 1, wherein said at least one radiating element is formed on the exterior surface of said first housing portion by an electro-deposition process.

5. The radiating enclosure of claim 1, wherein said at least one radiating element is printed on the exterior surface of said first housing portion.

6. The radiating enclosure of claim 1, further comprising a protective covering over said at least one radiating element.

7. The radiating enclosure of claim 1, wherein said dielectric housing is formed through an injection molding process.

8. The radiating enclosure of claim 1, wherein the dielectric housing is further capable of receiving a plurality of transceiver systems, said ground plane material to be electrically coupled to said plurality of transceiver systems.

9. The radiating enclosure of claim 1, wherein said dielectric housing is essentially in th shape of a rectangular box.

10. The radiating enclosure of claim 1, wherein said at a least one radiating element has an essentially planar shape.

11. The radiating enclosure of claim 1, wherein said at least one radiating element has a curved shape.

12. A radiating enclosure, comprising:

a dielectric housing having first and second detachable housing portions, each of said first and second housing portions having an inner surface and an outer surface, the dielectric housing capable of receiving a plurality of transceiver systems when mounted in the dielectric housing;

a plurality of radiating elements disposed on the exterior surface of said first housing portion;

a plurality of connection devices to establish a plurality of electrical connections between said plurality of radiating elements and the plurality of transceiver systems; and

ground plane material distributed substantially on the entirety of the interior surface of said housing portion, said ground plane material to be electrically coupled to the plurality of transceiver systems.

13. The radiating enclosure of claim 12, wherein said ground plane material is configured to prevent electromagnetic interference from substantially escaping said dielectric housing.

14. The radiating enclosure of claim 12, wherein each of said plurality of radiating elements is formed from a thin sheet of conductive material adhesively applied to the exterior surface of said first housing portion.

15. The radiating enclosure of claim 12, wherein each of said plurality of radiating elements is formed on the exterior surface of said first housing portion by an electro-deposition process.

16. The radiating enclosure of claim 12, wherein each of said plurality of radiating elements is printed on the exterior surface of said first housing portion.

17. The radiating enclosure of claim 12, further comprising a protective covering over said plurality of radiating elements.

18. The radiating enclosure of claim 12, wherein said dielectric housing is formed through an injection molding process.

19. The radiating enclosure of claim 12, wherein said dielectric housing is essentially in the shape of a rectangular box.

20. The radiating enclosure of claim 12, wherein each of said plurality of radiating elements has an essentially planar shape.

21. The radiating enclosure of claim 12, wherein each of said plurality of radiating elements has a curved shape.