LED package die having a small footprint
First Claim
Patent Images
1. A light emitting die package comprising:
- a stem substrate having a first end surface and a second end surface, said stem substrate defining at least one groove;
a wire lead running along the groove of said stem substrate, the wire lead terminating at the first end surface; and
a light emitting diode (LED) mounted on the first end surface, the LED making electrical and thermal contact with said stem substrate, the LED also connected to the wire lead.
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Abstract
A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.
132 Citations
21 Claims
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1. A light emitting die package comprising:
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a stem substrate having a first end surface and a second end surface, said stem substrate defining at least one groove;
a wire lead running along the groove of said stem substrate, the wire lead terminating at the first end surface; and
a light emitting diode (LED) mounted on the first end surface, the LED making electrical and thermal contact with said stem substrate, the LED also connected to the wire lead. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A light emitting die package array comprising:
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an array housing including an external heatsink and reflector bowl, said array housing defining die package spaces;
a plurality of light emitting die packages mounted in the die package spaces, each light emitting die comprising;
a stem substrate having a first end surface and a second end surface, said stem substrate defining at least one groove;
a wire lead mounted on the groove of said stem substrate, the wire lead terminating at the first end surface; and
a light emitting diode (LED) mounted on the first end surface making electrical and thermal contact with said stem substrate, the LED also connected to the wire lead. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification