×

Method and apparatus for defining vias

  • US 6,898,772 B1
  • Filed: 08/14/2002
  • Issued: 05/24/2005
  • Est. Priority Date: 01/22/2002
  • Status: Active Grant
First Claim
Patent Images

1. A method of identifying locations of a potential via between two layers of a design layout, the method comprising:

  • identifying a first non-rectangular polygonal region on one layer for containing the via;

    identifying a second non-rectangular polygonal region on the other layer for containing the via;

    determining whether an intersection of the first and second regions is sufficiently large to contain a via; and

    if the intersection is sufficiently large, identifying the intersection of the first and second regions as a region for containing a via.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×