Method for heat absorption using polyoxymethylene polymer compositions

• US 6,899,161 B2
• Filed: 04/03/2003
• Issued: 05/31/2005
• Est. Priority Date: 11/04/1997
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Olzak, Richard A., Ren, Jane, Osuch, Christopher E.
• Primary Examiner(s): DUONG, THO V
• Application Number:
  US10/408,051
• Publication Number:
  US 20050006621A1
• Time in Patent Office: 789 Days
• Field of Search: 165/104.21, 165/104.24, 165/10, 165/104.27, 165/905, 165/104.17, 165/185, 361/700, 361/704, 361/705, 361/708, 257/715, 174/16.3, 174/50, 174/52.1, 174/52.2, 428/36.1, 428/35.2, 428/35.7, 206/521, 206/524.1, 206/524.3, 206/524.4, 206/701, 206/722, 220/88.1
• US Class Current: 165/10
• CPC Class Codes: C09K 5/16 Materials undergoing chemical reactions when used
• CPC Class Codes: G11B 33/14 Reducing influence of physical parameters, e.g. temperature change, moisture, dust
• CPC Class Codes: H05K 5/021 specially adapted for data recorders, e.g. for flight recorders
• CPC Class Codes: H05K 5/0213 Venting apertures; Constructional details thereof
• CPC Class Codes: Y10T 428/13 Hollow or container type article [e.g., tube, vase, etc.]
• CPC Class Codes: Y10T 428/1334 Nonself-supporting tubular film or bag [e.g., pouch, envelope, packet, etc.]
• CPC Class Codes: Y10T 428/1352 Polymer or resin containing [i.e., natural or synthetic]

Abstract

The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.

Claims

1. A method for dissipating heat away from a heat sensitive device exposed to a high temperature environment, the method comprising:

surrounding the heat sensitive device with a solid heat absorption composition comprising polyoxymethylene polymerand and a catalyst, wherein the polyoxymethylene polymer undergoes endothermic decomposition directly from solid to gas when exposed to the high temperature environment, wherein said catalyst establishes an initiation temperature of said endothermic descomposition and wherein said composition absorbs heat from the high temperature environment during the endothermic decomposition of the polyoxymethylene polymer while remaining in a solid state and thereby dissipates heat away from the heat sensitive device.

2. The method of claim 1, wherein said catalyst is selected from the group consisting of benzoic acid, diphenyliodonium triflate and triphenylsulfonium triflate.

3. The method of claim 1, wherein said heat absorption composition further comprises a binder.

4. The method of claim 1, wherein said catalyst is applied to the surface of the heat absorption composition.

5. The method of claim 4, wherein said catalyst is applied as a dry power to the surface of the heat absorption composition.

6. The method of claim 1, wherein said catalyst is dispersed throughout the heat absorption composition.

7. The method of claim 1, wherein said catalyst further comprises a catalyst that generates acid upon exposure to heat.