Intravascular ultrasound transducer assembly having a flexible substrate and method for manufacturing such assembly

• US 6,899,682 B2
• Filed: 09/12/2003
• Issued: 05/31/2005
• Est. Priority Date: 01/08/1997
• Status: Expired due to Term

• Current Assignee: Volcano Corporation (Koninklijke Philips N.V.)
• Original Assignee: Volcano Therapeutics, Inc. (Koninklijke Philips N.V.)
• Inventors: Finsterwald, P. Michael, Eberle, Michael J.
• Primary Examiner(s): IMAM, ALI M
• Application Number:
  US10/661,269
• Publication Number:
  US 20040054289A1
• Time in Patent Office: 627 Days
• Field of Search: 600437-472, 29/253.5, 295/94, 310333-336
• US Class Current: 600/459
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: A61B 8/445 Details of catheter construction
• CPC Class Codes: A61B 8/4488 the transducer being a phased array
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: B06B 1/0633 Cylindrical array
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The present invention comprises methods for fabricating an ultrasound transducer assembly having a flexible circuit. Preferably, the method comprises attaching an ultrasound transducer array and integrated circuitry to the flexible circuit during fabrication of the ultrasound transducer assembly while the flexible circuit is in a substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes.

Claims

1. An ultrasound transducer assembly comprising:

integrated circuitry;

an ultrasound transducer array including a set of ultrasound transducer elements, each transducer element comprising transducer material;

a flexible circuit to which the ultrasound transducer array and the integrated circuitry are attached during fabrication of the ultrasound transducer assembly, the flexible circuit comprising a flexible substrate that provides a re-shapeable platform to which the integrated circuitry and transducer elements arc attached, wherein the flexible substrate comprises surface discontinuities, and ones of the surface discontinuities are disposed between adjacent pairs of transducer elements of the ultrasound transducer array.

2. The ultrasound transducer assembly of claim 1 wherein a first transducer element of the set of transducer elements has a first lengthwise axis and a second transducer element of the set of transducer elements has a second lengthwise axis, and wherein the first lengthwise axis and the second lengthwise axis are substantially parallel.

3. The ultrasound transducer assembly of claim 2 wherein ones of the surface discontinuities extend lengthwise substantially parallel to the first lengthwise axis.

4. The ultrasound transducer assembly of claim 3 wherein the first transducer element has a first transducer element length along the first lengthwise axis, and a one of the surface discontinuities has a discontinuity length, the first transducer element length being less than the discontinuity length.

5. The ultrasound transducer assembly of claim 1 wherein ones of the surface discontinuities are formed by cutting completely through the flexible substrate.

6. The ultrasound transducer assembly of claim 1 wherein the flexible substrate has a first thickness, wherein individual ones of the surface discontinuities are formed by a groove within the flexible substrate, and wherein the groove has a depth that is less than the first thickness.

7. A method for fabricating an intravascular ultrasound transducer assembly comprising a flexible circuit, integrated circuitry, and a set of transducer elements, the method comprising the steps:

fabricating the flexible circuit comprising a flexible substrate and a set of electrically conductive lines formed on the flexible substrate;

fabricating a transducer sheet comprising a transducer material;

attaching the transducer sheet to the flexible circuit while the flexible circuit is in a substantially flat shape;

dicing the transducer sheet into a set of discrete transducer elements, wherein the dicing step also includes the step of forming surface discontinuities having a depth of at least 3 μ

m from a surface of the flexible substrate, and wherein ones of the surface discontinuities are disposed between adjacent transducer elements of the set of discrete transducer elements.

8. The method of claim 7 wherein the forming surface discontinuities step comprises forming discontinuities that extend completely through the flexible substrate.

9. The method of claim 7 wherein the dicing step is performed using a saw.

10. The method of claim 7 wherein the dicing step is performed using a laser.