Balanced flow cooling

• US 6,900,387 B2
• Filed: 01/30/2003
• Issued: 05/31/2005
• Est. Priority Date: 01/30/2002
• Status: Expired due to Term

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Gravell, Anthony R., Barlow, Richard J.
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): Estrada, Angel R.
• Application Number:
  US10/354,423
• Publication Number:
  US 20030141089A1
• Time in Patent Office: 852 Days
• Field of Search: 174/50, 174/17.VA, 174/16.1, 174/17.R, 174/58, 361/687, 361/694, 361/695, 361/724, 361/725, 361/726, 361/727, 454/184, 312/326, 165/80.3, 165/121, 165/126
• US Class Current: 174/50
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20736 within cabinets for removing heat from server blades

Abstract

There is described a modular electronic circuit wherein a series of electronics modules are penetrated by a passageway having an air-permeable wall, and cooling air is supplied to the passageway at a pressure above that obtaining in the modules, so that each module receives a supply of air passing out through the wall of the passageway. The passageway is constituted by a plurality of aligned tubular sleeves mounted in respective modules. There is also described a ventilation module including blowers to pressurize the passageway. A second passageway may be provided, at a reduced pressure, to extract air from the modules.

Claims

1. A modular electronic circuit comprising:

a number of circuit modules each having a housing containing circuit elements;

a passageway extending through the housings of the modules and having a permeable wall portion through which air may pass to provide communication between the interior of the passageway and the interior of at least one module housing; and

a ventilator operable to cause air to flow through said permeable wall portion.

2. The modular electronic circuit of claim 1 wherein the passageway is formed by a number of aligned tubular elements each positioned within a respective module housing.

3. The modular electronic circuit of claim 1, wherein the ventilator is housed in a ventilation module housing an air supply opening in communication with the passageway.

4. The modular electronic circuit of claim 1, wherein two parallel passageways extend through the module housings.

5. The modular electronic circuit of claim 4, wherein the ventilator is housed in a ventilation module having air supply openings in communication with the two parallel passageways.