Semiconductor device and manufacturing method thereof

• US 6,900,462 B2
• Filed: 10/10/2003
• Issued: 05/31/2005
• Est. Priority Date: 03/29/1999
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Kusuyama, Yoshihiro, Suzawa, Hideomi
• Primary Examiner(s): Nhu, David
• Application Number:
  US10/683,545
• Publication Number:
  US 20040140471A1
• Time in Patent Office: 599 Days
• Field of Search: 257/59, 257/60, 257/330, 257/368, 257/365, 257/366, 257/347
• US Class Current: 257/59
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31138 by dry-etching
• CPC Class Codes: H01L 21/76801 characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
• CPC Class Codes: H01L 21/76804 by forming tapered via holes
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1244 for preventing breakage, peeling or short circuiting
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

It is an object of the present invention to provide a manufacturing method of semiconductor device whereby the number of processes is decreased due to simultaneously forming a contact hole in a lamination film of different material and film thickness (inorganic insulating film and organic resin film) by conducting etching once. By setting the selective ratio of dry etching (etching rate of organic resin film 503/etching rate of inorganic insulating film 502 containing nitrogen) from 1.6 to 2.9, preferably 1.9, the shape and the size of the contact holes to be formed even in a film of different material and film thickness can be nearly the same in both of the contact holes.

Claims

1. A semiconductor device comprising:

a first conductive film formed over an insulating substrate;

an inorganic insulating film covering said first conductive film;

an organic resin film covering said inorganic insulating film;

a contact hole that goes through said inorganic insulating film and said organic resin film;

an edge portion of said inorganic insulating film that comes in contact with a bottom surface of said contact hole is taper like having an angle range of 30 degrees to 80 degrees from a horizontal surface; and

a second conductive film formed over said organic resin film and connected to said first conductive film at a bottom surface of said contact hole.

2. A semiconductor device according to claim 1, wherein said contact hole is formed by performing one etching.

3. A semiconductor device according to claim 1, further comprising a thin film transistor electrically connected to said first conductive film.

4. A semiconductor device according to claim 1, wherein said second conductive film is a pixel electrode.

5. A semiconductor device according to claim 1, wherein said inorganic insulating film is a silicon nitride film or a silicon oxide nitride film.

6. A semiconductor device according to claim 1, wherein said semiconductor device includes an active matrix liquid crystal display device, an active matrix EL display device or an active matrix EC display device.

19. An electronic device having the semiconductor device according to claim 1.

23. A semiconductor device according to claim 19, wherein said semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a projector, a goggle-type display, a navigation system for automobiles, a personal computer, and a mobile information terminal.

7. A semiconductor device comprising:

a substrate;

a source region and a drain region which are provided over said substrate with a channel region provided over said substrate between said source region and said drain region;

a gate electrode provided over said substrate and provided adjacent to said channel region with a gate insulating film between said gate electrode and said channel region;

a wiring provided over and connected with one of said source region and said drain region;

an inorganic insulating film provided over said wiring;

an organic resin film provided over said inorganic insulating film;

a contact hole provided through said inorganic insulating film and said organic resin film;

an edge portion of said inorganic insulating film that comes in contact with a bottom surface of said contact hole is taper like having an angle range of 30 degrees to 80 degrees from a horizontal

a pixel electrode provided over said organic resin film and connected with said wiring through said contact hole.

8. A semiconductor device according to claim 7, wherein said inorganic insulating film is a silicon nitride film or a silicon oxide nitride film.

9. A semiconductor device according to claim 7, wherein said semiconductor device includes an active matrix liquid crystal display device, an active matrix EL display device or an active matrix EC display device.

20. An electronic device having the semiconductor device according to claim 7.

24. A semiconductor device according to claim 20, wherein said semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a projector, a goggle-type display, a navigation system for automobiles, a personal computer, and a mobile information terminal.

10. A semiconductor device comprising:

a first conductive film formed over an insulating substrate;

an inorganic insulating film covering said first conductive film;

an organic resin film covering said inorganic insulating film;

a contact hole that goes through said inorganic insulating film and said organic resin film;

an edge portion of said organic resin film that comes in contact with said inorganic insulating film has an angle range of 50 degrees to 90 degrees from a horizontal surface; and

a second conductive film formed over said organic resin film and connected to said first conductive film at a bottom surface of said contact hole.

11. A semiconductor device according to claim 10, wherein said contact hole is formed by performing one etching.

12. A semiconductor device according to claim 10, further comprising a thin film transistor electrically connected to said first conductive film.

13. A semiconductor device according to claim 10, wherein said second conductive film is a pixel electrode.

14. A semiconductor device according to claim 10, wherein said inorganic insulating film is a silicon nitride film or a silicon oxide nitride film.

15. A semiconductor device according to claim 10, wherein said semiconductor device includes an active matrix liquid crystal display device, an active matrix EL display device or an active matrix EC display device.

21. An electronic device having the semiconductor device according to claim 10.

25. A semiconductor device according to claim 21, wherein said semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a projector, a goggle-type display, a navigation system for automobiles, a personal computer, and a mobile information terminal.

16. A semiconductor device comprising:

a substrate;

a source region and a drain region which are provided over said substrate with a channel region provided over said substrate between said source region and said drain region;

a gate electrode provided over said substrate and provided adjacent to said channel region with a gate insulating film between said gate electrode and said channel region;

a wiring provided over and connected with one of said source region and said drain region;

an inorganic insulating film provided over said wiring;

an organic resin film provided over said inorganic insulating film;

a contact hole provided through said inorganic insulating film and said organic resin film;

an edge portion of said organic resin film that comes in contact with said inorganic insulating film has an angle range of 50 degrees to 90 degrees from a horizontal surface; and

a pixel electrode provided over said organic resin film and connected with said wiring through said contact hole.

17. A semiconductor device according to claim 16, wherein said inorganic insulating film is a silicon nitride film or a silicon oxide nitride film.

18. A semiconductor device according to claim 16, wherein said semiconductor device includes an active matrix liquid crystal display device, an active matrix EL display device or an active matrix EC display device.

22. An electronic device having the semiconductor device according to claim 16.

26. A semiconductor device according to claim 22, wherein said semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a projector, a goggle-type display, a navigation system for automobiles, a personal computer, and a mobile information terminal.