Method for producing an electrical circuit

• US 6,900,536 B1
• Filed: 04/26/2002
• Issued: 05/31/2005
• Est. Priority Date: 04/26/2002
• Status: Expired due to Fees

• Current Assignee: Celis Semiconductor Corp.
• Original Assignee: Celis Semiconductor Corp.
• Inventors: DeVilbiss, Alan D., Derbenwick, Gary F.
• Primary Examiner(s): THAI, LUAN C
• Application Number:
  US10/132,939
• Time in Patent Office: 1,131 Days
• Field of Search: 257723-724, 257737-738, 257782-783
• US Class Current: 257/724
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/055 Folded back on itself

Abstract

An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at least a portion of one of conductive layers, mounting an integrated circuit (IC) between the substrates, coupling the IC to the conductive layers, and affixing the substrates together with the conductive layers between the substrates. These are either separate substrates or a unitary substrate. The IC is mounted either to a substrate, a conductive layer, or a dielectric layer. The IC is coupled to the conductive layers either directly or through openings formed in the dielectric layer. An interior conductive layer may be used to couple the IC to the conductive layers.

Claims

1. An electrical circuit comprising:

(a) first and second substrates,

(b) a first conductive layer formed and patterned on the first substrate, between the first and second substrates, wherein the pattern of the first conductive layer includes a selection from the group of an inductor coil having inner and outer terminals, a dipole antenna, and a fractal antenna,

(c) a second conductive layer formed and patterned on the second substrate, between the first and second substrates,

(d) a dielectric layer separating at least a portion of the first conductive layer from at least a portion of the second conductive layer, and

(e) at least one integrated circuit (IC), each IC mounted between the first and second substrates and each IC coupled to at least one of the first and second conductive layers.

2. The electrical circuit of claim 1 wherein the substrate includes a flexible substrate.

3. The electrical circuit of claim 1 wherein the substrate is selected from the group consisting of paper, plastic, polypropylene and polyolefin.

4. The electrical circuit of claim 1 wherein the conductive layer is formed from the group consisting of printed conductive ink, a chemically etched deposited conductive layer, and a stamped metal adhered to the substrate.

5. The electrical circuit of claim 1 wherein the first and second substrates are joined and comprise a unitary substrate.

6. The electrical circuit of claim 1 wherein the first and second conductive layers comprise a unitary conductive layer.

7. The electrical circuit of claim 1 wherein each IC mounted between the first and second substrates includes each IC mounted to at least one of the first and second conductive layers.

8. The electrical circuit of claim 1 wherein each IC mounted, between the first and second substrates includes each IC mounted to at least one of the first and second substrates.

9. The electrical circuit of claim 8 further including conductive adhesive fastening each IC to at least one of the first and second substrates.

10. The electrical circuit of claim 1 wherein the dielectric layer includes nonconductive tape.

11. The electrical circuit of claim 1 wherein each IC coupled to at least one of the first and second conductive layers includes at least one of the first and second dielectric layers having at least one opening formed therein permitting coupling between each IC and at least one of the first and second conductive layers.

12. The electrical circuit of claim 1 wherein each IC coupled to at least one of the first and second conductive layers includes each IC mounted to at least one of the first and second conductive layers.

13. The electrical circuit of claim 1 wherein the dielectric layer further separates each IC from at least one of the first and second conductive layers.

14. The electrical circuit of claim 1 further including an interior conductive layer coupled to at least one IC and at least one of the first and second conductive layers.

15. The electrical circuit of claim 1 further including an interior conductive layer coupled to the first and second conductive layers.

16. An electrical circuit comprising:

(a) a substrate having at least one fold formed therein,

(b) a conductive layer formed and patterned on the substrate, wherein the pattern of the conductive layer includes a selection from the group of an inductor coil having inner and outer terminals, a dipole antenna, and a fractal antenna,

(c) a dielectric layer formed on at least a portion of the conductive layer, and

(d) at least one integrated circuit (IC), each IC mounted within the fold of the substrate and each IC coupled to the conductive layer.

17. The electrical circuit of claim 16 wherein each IC mounted within the fold of the substrate includes each IC mounted to the dielectric layer.

18. The electrical circuit of claim 16 wherein each IC mounted within the fold of the substrate includes each IC mounted to the conductive layer.

19. The electrical circuit of claim 16 wherein each IC mounted within the fold of the substrate includes each IC mounted to the substrate.

20. The electrical circuit of claim 16 wherein each IC coupled to the conductive layer includes the dielectric layer having at least one opening formed therein permitting coupling between each IC and the conductive layer.

21. The electrical circuit of claim 16 wherein each IC coupled to the conductive layer includes each IC mounted to the conductive layer.

22. The electrical circuit of claim 16 wherein the dielectric layer further separates each IC from the conductive layer.

23. The electrical circuit of claim 16 further including an interior conductive layer coupled to at least one IC and the conductive layer.

24. The electrical circuit of claim 16 further including an interior conductive layer coupled to the conductive layer.

25. An electrical circuit comprising:

a substrate having first and second surfaces, the substrate being folded along a fold line so that the first surface comprises opposite facing portions;

a conductive layer formed and patterned on both opposite facing portions of the first surface to include overlapping conductive elements, wherein the pattern of the conductive layer includes a selection from the group of an inductor coil having inner and outer terminals, a dipole antenna, and a fractal antenna;

a dielectric layer separating at least a portion of the conductive layer formed and patterned on both opposite facing portions of the first surface; and

an integrated circuit mounted to the substrate between the opposite facing portions and being coupled to the conductive layer.

26. The electrical circuit of claim 25 wherein the conductive layer comprises a spiral design on one of the facing portions to define a coil including a center contact pad at one end and a conductive trace at another end connected to a second contact pad on the other facing portion, the second contact pad overlapping the center pad.

27. The electrical circuit of claim 26 wherein the integrated circuit is connected between the center contact pad and the second contact pad.

28. The electrical circuit of claim 25 wherein the conductive layer comprises a first conductive region on one facing portion overlapping a second conductive region on the other facing portion, the first and second conductive regions separated by the dielectric layer to define a capacitor element.