Method of manufacturing a membrane sensor

• US 6,901,804 B2
• Filed: 03/20/2001
• Issued: 06/07/2005
• Est. Priority Date: 03/21/2000
• Status: Expired due to Fees

• Current Assignee: Nokia Corporation, VTI Hamlin Oy
• Original Assignee: Nokia Corporation, VTI Hamlin Oy
• Inventors: Torkkeli, Altti
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US10/239,320
• Publication Number:
  US 20030094047A1
• Time in Patent Office: 1,540 Days
• Field of Search: 73700-756, 361/283.1, 361/283.4
• US Class Current: 73/716
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

This invention relates to a differential pressure sensor, one embodiment of which is a microphone. The differential pressure sensor comprises: a flexible membrane (7) made of conductive material, which membrane forms a first electrode of the differential pressure sensor, and a perforated plate (6) made of conductive material, which plate is essentially more rigid than said membrane (7), which plate is arranged at a distance from the membrane, and which plate forms a second electrode of the differential pressure sensor. In order to provide a differential pressure sensor with as good properties as possible, the differential pressure sensor comprises a substrate (4), a cavity (10) extending through the substrate, the walls of which cavity are formed of said substrate (4). The membrane (7) is closely connected to the walls of the cavity (10), whereby the membrane forms a dense wall in said cavity, and said perforated plate (6, 6′) has been attached to the substrate with an insulating layer (5).

Claims

1. A method of manufacturing a membrane sensor, comprising

selecting into use a layer-structured preform comprising a first layer, a second layer made of conductive material, and an insulating layer between the first and second layers;

removing material from the first layer by etching a cavity in the first layer, the cavity extending through the first layer as far as to the insulating layer;

growing a membrane of conductive material on the insulating layer through the cavity formed in the first layer, the membrane joining to the walls of the cavity, forming a dense wall in the cavity;

removing material from the second conductive layer by etching perforations in the second conductive layer, the perforations extending through the second conductive layer as far as to the insulating layer and being situated in a finished membrane sensor at the point of the cavity but on the side opposite to the insulating layer; and

removing the insulating layer from the area between the perforations and the cavity.

2. The method of claim 1, wherein the first layer being of conductive material and by further metallizing in the method an area in the first and second layers to form contact pads enabling electrical connections.

3. The method of claim 1, further comprising selecting in the method a layer-structured SOI preform into use, the first layer of which preform is formed of a silicon substrate upon which an insulating layer has been arranged and the second conductive layer of which is formed of a silicon layer.

4. The method of claim 1, further comprising growing said membrane of polycrystalline silicon.

5. The method of claim 1, further comprising enclosing the membrane sensor in the enclosure of an integrated circuit.

6. The method of claim 1, further comprising making the insulating layer rougher in the method by etching through the cavity prior to the growing of the membrane.

7. The method of claim 1, wherein:

the etching of the perforations in the second layer is performed prior to the removal of material from the first layer, whereby an armature area separated with grooves from the other parts of the second layer is formed in the middle part of the second layer;

growing a second insulating layer upon the second layer when the second layer has been perforated; and

after the formation of the cavity, a second conductive membrane is grown upon the second insulating layer in connection with the growing of the conductive membrane, and openings are etched in said second membrane which extend through the second membrane to the second insulating layer, whereby in connection with the removal of the insulating layer, also the second insulating layer is removed in such a way that a differential pressure sensor is provided having two flexible membranes connected to each other via the armature area.

8. A differential pressure sensor comprising

a flexible membrane made of conductive material, which membrane forms a first electrode of the differential pressure sensor;

and

a perforated plate made of conductive material, which plate is essentially more rigid than said membrane, which plate is arranged at a distance from the membrane, and which plate forms a second electrode of the differential pressure sensor, wherein

the differential pressure sensor also comprises a substrate, a cavity extending through the substrate, the walls of which cavity are formed of said substrate;

the membrane is closely joined to the walls of the cavity, whereby the membrane forms a dense wall in said cavity, and

said perforated plate is attached to the substrate with an insulating layer.

9. The differential pressure sensor of claim 8, wherein the differential pressure sensor is made of a layer-structured SOI preform, whereby the substrate is formed of a silicon substrate of the SOI preform;

the insulating layer is made of an insulating layer of the SOI preform; and

the perforated plate is made of a silicon layer of the SOI preform.

10. The differential pressure sensor of claim 8, wherein said membrane is made of polycrystalline silicon.

11. The differential pressure sensor of claim 8, wherein

the area of the perforated plate is essentially smaller than the area of the cross-section of the cavity;

and

when the differential pressure sensor is seen from the direction of the perforated plate, the perforated area of the perforated plate is situated above the middle part of the moving area of the flexible membrane, and from said perforated area, only arms supporting said perforated area extend past imaginary extensions of the side walls of the cavity.

12. The differential pressure sensor of claim 8, wherein

a second flexible membrane, which is perforated, has been attached to the perforated plate on the side opposite relative to the substrate with a second insulating layer, and

an armature area separated from the other parts of the perforated plate with a groove has been formed in the middle part of the perforated plate, which armature area is connected to the flexible membrane and to the second flexible membrane in such a way that the movement of the flexible membrane is transmitted through the armature area to the second flexible membrane, which moves with the membrane.

13. A microphone comprising:

a flexible membrane made of conductive material, which membrane forms a first electrode of the microphone; and

a perforated plate made of conductive material, which plate is essentially more rigid than said membrane, which plate is arranged at a distance from the membrane, and which plate forms a second electrode of the microphone, wherein

the microphone further comprises a substrate, a cavity extending through the substrate, the walls of which cavity are formed of said substrate;

the membrane is closely joined to the walls of the cavity, whereby the membrane forms a wall in said cavity; and

said perforated plate has been attached to the substrate with an insulating layer.

14. The microphone of claim 13, wherein the microphone is made of a layer-structured SOI preform, whereby the substrate is formed of a silicon substrate of the SOI preform;

the insulating layer is made of an insulating layer of the SOI preform, and the perforated plate is made of the silicon layer of the SOI preform.

15. The microphone of claim 13, wherein said membrane is made of polycrystalline silicon.

16. The microphone of claim 13, wherein

the area of the perforated plate is essentially smaller than the area of the cross-section of the cavity;

and

when the microphone is seen from the direction of the perforated plate, the perforated area of the perforated plate is situated above the middle part of the moving area of the flexible membrane, and from said perforated area, only arms supporting said perforated area extend past the imaginary extensions of the side walls of the cavity.

17. The microphone of claim 13, wherein a pressure-balancing opening opens to the cavity, which pressure-balancing opening extends from the cavity through the substrate to the outer wall of the substrate, or which pressure-balancing opening is formed of a perforation in the membrane, the perforation connecting the space above the membrane to the space below the membrane.

18. The microphone of claim 13, wherein

a second flexible membrane, which is perforated, has been attached to the perforated plate on the side opposite relative to the substrate with a second insulating layer, and

an armature area separated from the other parts of the perforated plate with a groove has been formed in the middle part of the perforated plate, which area is connected to the flexible membrane and to the second flexible membrane in such a way that the movement of the flexible membrane is transmitted through the armature area to the second flexible membrane, which moves with the membrane.