Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same

• US 6,902,099 B2
• Filed: 04/10/2002
• Issued: 06/07/2005
• Est. Priority Date: 08/02/1999
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Motonishi, Michiharu, Moroe, Michiaki
• Primary Examiner(s): EDMONDSON, LYNNE RENEE
• Application Number:
  US10/119,447
• Publication Number:
  US 20020149888A1
• Time in Patent Office: 1,154 Days
• Field of Search: 228/191, 228/245, 228/246, 228/180.21, 228/180.22, 360/245.4, 360/245.8, 360/323
• US Class Current: 228/180.22
• CPC Class Codes: G11B 5/3103 Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
• CPC Class Codes: G11B 5/3903 using magnetic thin film layers or their effects, the films being part of integrated structures
• CPC Class Codes: G11B 5/40 Protective measures on heads, e.g. against excessive temperature G11B5/31 takes precedence; protection against wear G11B5/255 ; protective structure of the head: see under structures, e.g. G11B5/3106
• CPC Class Codes: G11B 5/4833 Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head G11B5/484 takes precedence
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof

Abstract

The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.

Claims

1. A circuit shorting method for a circuit board comprising at least a pair of leads for constructing a circuit, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump using a means for crushing such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump using the means for crushing such that a peripheral portion of the second solder bump is spread outward in a radial direction to contact with the peripheral portion of the first solder bump, the means for crushing being removed subsequent to the crushing of the first and second bumps.

whereby said pair of leads are shorted.

2. A circuit shorting method according to claim 1, wherein said step of crushing the second solder bump is performed until a part of the peripheral portion of the second solder bump overlaps the peripheral portion of the first solder bump.

3. A circuit shorting method according to claim 1, wherein the means for crushing includes heating and rubbing.

4. A circuit shorting method according to claim 2, wherein the means for crushing includes heating and rubbing.

11. A circuit shorting method according to claim 1, wherein the means for crushing includes heating.

12. A circuit shorting method according to claim 2, wherein the means for crushing includes heating.

16. A circuit shorting method according to claim 1, wherein, the second solder bump is crushed so that it overlaps the first solder bump.

5. A method of manufacturing a magnetic head in which a slider including an MR magnetic head device is attached to a fore end of a load beam and a circuit board is attached to an opposite end of said load beam,

said circuit board comprising at least a pair of leads connected to said MR magnetic head device, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump using a means for crushing such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump using the means for crushing such that a peripheral portion of the second solder bump is spread outward in a radial direction to contact with the peripheral portion of the first solder bump, the means for crushing being removed subsequent to the crushing of the first and second bumps,

whereby said pair of leads are shorted.

6. A method of manufacturing a magnetic head according to claim 5, wherein said step of crushing the second solder bump is performed until a part of the peripheral portion of the second solder bump overlaps the peripheral portion of the first solder bump.

7. A method of manufacturing a magnetic head according to claim 5, wherein the means for crushing includes heating and rubbing.

8. A method of manufacturing a magnetic head according to claim 6, wherein the means for crushing includes heating and rubbing.

13. A circuit shorting method according to claim 5, wherein the means for crushing includes heating.

14. A circuit shorting method according to claim 6, wherein the means for crushing includes heating.

9. A circuit shorting method for a circuit board comprising at least a pair of leads for constructing a circuit, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump such that a peripheral portion of the second solder bump is spread outward in a radial direction to contact with the peripheral portion of the first solder bump,

wherein said first and said second solder bumps are each crushed under heating and rubbing, whereby said pair of leads are shorted.

10. A method of manufacturing a magnetic head in which a slider including an MR magnetic head device is attached to a fore end of a load beam and a circuit board is attached to an opposite end of said load beam,

said circuit board comprising at least a pair of leads connected to said MR magnetic head device, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump such that a peripheral portion of the second solder bump is spread outward in a radial direction to contact with the peripheral portion of the first solder bump,

wherein said first and said second solder bumps are each crushed under heating and rubbing, whereby said pair of leads are shorted.

15. A circuit shorting method for a circuit board comprising at least a pair of leads for constructing a circuit, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump subsequent to crushing the first solder bump such that a peripheral portion of the second solder bump is spread outward in a radial direction to contact with the peripheral portion of the first solder bump,

whereby said pair of leads are shorted.

17. A circuit shorting method according to claim 15, wherein the second solder bump is crushed so that it overlaps the first solder bump.