Socket for use with a micro-component in a light-emitting panel

• US 6,902,456 B2
• Filed: 08/20/2003
• Issued: 06/07/2005
• Est. Priority Date: 10/27/2000
• Status: Expired due to Term

• Current Assignee: Leidos, Inc. (Leidos Holdings, Inc.)
• Original Assignee: Science Applications International Corporation
• Inventors: Johnson, Roger Laverne, Green, Albert Myron, George, Edward Victor, Wyeth, Newell Convers
• Primary Examiner(s): WILLIAMS, JOSEPH L
• Application Number:
  US10/643,608
• Publication Number:
  US 20040051450A1
• Time in Patent Office: 657 Days
• Field of Search: 445/24, 445/25, 445/50, 445/51, 313/484, 313/485, 313/491
• US Class Current: 445/24
• CPC Class Codes: G01J 1/4257 applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam monitoring arrangements for lasers in general H01S3/0014
• CPC Class Codes: G01J 3/443 Emission spectrometry
• CPC Class Codes: G09G 2300/0426 Layout of electrodes and connections
• CPC Class Codes: G09G 2300/0439 Pixel structures
• CPC Class Codes: G09G 2300/08 Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
• CPC Class Codes: G09G 3/288 using AC panels
• CPC Class Codes: H01J 11/18 containing a plurality of independent closed structures for containing the gas, e.g. plasma tube array [PTA] display panels
• CPC Class Codes: H01J 17/49 Display panels, e.g. with crossed electrodes , e.g. making use of direct current display panels making use of alternating current H01J11/00
• CPC Class Codes: H01J 61/30 Vessels; Containers
• CPC Class Codes: H01J 61/305 Flat vessels or containers

Abstract

An improved light-emitting panel having a plurality of micro-components at least partially disposed in a socket and sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes.

Claims

1. A method for forming an emission unit for use in a light emitting panel comprising:

forming a first conductive layer of material on a substrate;

forming a second non-conductive layer of material on the first conductive layer of material;

forming a third conductive layer of material on the second non-conductive layer of material;

forming a fourth non-conductive layer of material on the third conductive layer of material;

removing portions of the first conductive layer, the second non-conductive layer, the third conductive layer and the fourth non-conductive layer, forming a cavity therein;

forming a fifth conductive layer in the cavity; and

inserting at least one micro-component into the cavity, wherein the micro-component is electrically contacted to the first conductive layer, the third conductive layer, and the fifth conductive layer.

2. The method according to claim 1, further comprising coating the cavity with a sixth enhancement layer prior to inserting the at least one micro-component therein.

3. The method according to claim 1, wherein the sixth enhancement layer is selected from the group consisting of an adhesive, a bonding agent, and a reflection filter.

4. The method according to claim 2, further comprising forming a seventh transparent layer on the fourth conductive layer and the micro-component.

5. The method according to claim 1, wherein the first conductive layer is a sustain electrode.

6. The method according to claim 1, wherein the third conductive layer is an address electrode.

7. The method according to claim 1, wherein the fifth conductive layer is a sustain electrode.

8. A method for forming an emission unit for use in a light emitting panel comprising:

forming a cavity in a substrate;

forming a first mechanically flexible conductive layer of material in the cavity;

forming a second mechanically flexible non-conductive layer of material on the first mechanically flexible conductive layer of material;

forming a third mechanically flexible conductive layer of material on the second mechanically flexible non-conductive layer of material;

forming a fourth mechanically flexible non-conductive layer of material on the third mechanically flexible conductive layer of material; and

inserting at least one micro-component into the cavity by flexing the first mechanically flexible conductive layer, the second mechanically flexible non-conductive layer, the third mechanically flexible conductive layer and the fourth mechanically flexible non-conductive layer.

9. The method according to claim 8, wherein the first mechanically flexible conductive layer is an address electrode.

10. The method according to claim 8, wherein the third mechanically flexible conductive layer is a sustain electrode.

11. The method according to claim 8, wherein a fifth enhancement material layer is applied to the micro-component and is selected from the group consisting of an anti-glare coating, a touch sensitive surface, a contrast enhancement coating and a protective coating.