Vacuum packaged micromirror arrays and methods of manufacturing the same
First Claim
1. A vacuum packaged array of electromechanical micromirror devices comprising:
- a device substrate having a 1st surface and a 2nd surface;
control circuitry disposed on said 1st surface of said device substrate;
an array of micromirror sections disposed on said 2nd surface of said device substrate, wherein each said micromirror section comprises;
a micromirror;
at least 1 support structure for supporting said micromirror; and
at least 1 addressing electrode for actuating said micromirror;
a plurality of electrically conductive routing lines integral with said device substrate that connects said control circuitry to said at least 1 addressing electrode;
a 1st plurality of metallic terminals disposed on said 1st surface of said device substrate that are electrically connected with said control circuitry;
a 1st packaging substrate having a 1st surface and a 2nd surface;
a 2nd plurality of metallic terminals disposed on said 1st surface of said 1st packaging substrate;
a plurality of solder balls electrically connecting said 1st plurality of metallic terminals to said 2nd plurality of metallic terminals and thereby mounting said device substrate on said 1st packaging substrate;
a 2nd packaging substrate being adhered to said 1st surface of said 1st packaging substrate by a glass frit bonding line that surrounds said device substrate; and
an evacuated region bounded by said packaging substrates and said glass frit bonding line.
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Accused Products
Abstract
A vacuum packaged electromechanical micromirror array comprises a 1st packaging substrate, a 2nd packaging substrate, a device substrate with a 1st surface and a 2nd surface, control circuitry on said 1st surface, and micromirrors on said 2nd surface. The device substrate resides on the 1st packaging substrate with electrical connections between them. The electromechanical micromirror array is sealed in a vacuum package formed by the packaging substrates. The vacuum packaged micromirror array may be used as a spatial light modulator (SLM). Methods of fabricating the vacuum packaged array are disclosed. Such methods generally involve providing a device substrate with a 1st surface and a 2nd surface, fabricating control circuitry on the 1st surface, fabricating micromirrors on the 2nd surface, providing a 1st packaging substrate, mounting the device substrate on the 1st packaging substrate by flip-chip assembly, providing a 2nd packaging substrate, and sealing the packaging substrates by glass frit sealing.
89 Citations
69 Claims
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1. A vacuum packaged array of electromechanical micromirror devices comprising:
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a device substrate having a 1st surface and a 2nd surface;
control circuitry disposed on said 1st surface of said device substrate;
an array of micromirror sections disposed on said 2nd surface of said device substrate, wherein each said micromirror section comprises;
a micromirror;
at least 1 support structure for supporting said micromirror; and
at least 1 addressing electrode for actuating said micromirror;
a plurality of electrically conductive routing lines integral with said device substrate that connects said control circuitry to said at least 1 addressing electrode;
a 1st plurality of metallic terminals disposed on said 1st surface of said device substrate that are electrically connected with said control circuitry;
a 1st packaging substrate having a 1st surface and a 2nd surface;
a 2nd plurality of metallic terminals disposed on said 1st surface of said 1st packaging substrate;
a plurality of solder balls electrically connecting said 1st plurality of metallic terminals to said 2nd plurality of metallic terminals and thereby mounting said device substrate on said 1st packaging substrate;
a 2nd packaging substrate being adhered to said 1st surface of said 1st packaging substrate by a glass frit bonding line that surrounds said device substrate; and
an evacuated region bounded by said packaging substrates and said glass frit bonding line. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of fabricating a vacuum packaged array of electromechanical micromirror devices, comprising the steps of:
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providing a device substrate with a 1st surface and a 2nd surface;
forming control circuitry on said 1st surface of said device substrate;
forming a plurality of micromirror sections on said 2nd surface of said device substrate, comprising the steps of;
forming a plurality of addressing electrodes for actuating micromirrors;
forming a plurality of support structures for supporting said micromirrors; and
forming a plurality of micromirrors such that they are supported by said support structures; and
forming a plurality of electrically conductive routing lines that are integral with said device substrate that connects said control circuitry to said at least 1 addressing electrode;
forming a 1st plurality of metallic terminals disposed on said 1st surface of said device substrate that are electrically connected with said control circuitry;
providing a 1st packaging substrate having a 1st surface and a 2nd surface;
forming a 2nd plurality of metallic terminals on said 1st surface of said 1st packaging substrate;
depositing a plurality of solder balls on either of said plurality of metallic terminals;
electrically connecting said 1st plurality of metallic terminals to said 2nd plurality of metallic terminals and thereby mounting said device substrate on said 1st packaging substrate;
providing a 2nd packaging substrate;
adhering said 2nd packaging substrate to said 1st surface of said 1st packaging substrate by sealing at a glass frit bonding line that surrounds said device substrate (package sealing step); and
forming an evacuated region bounded by said packaging substrates and said glass frit bonding line (evacuation step). - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69)
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Specification