Covering element for subassemblies

• US 6,903,932 B2
• Filed: 08/01/2002
• Issued: 06/07/2005
• Est. Priority Date: 08/01/2001
• Status: Expired due to Term

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Infineon Technologies AG
• Inventors: Strutz, Volker, Wennemuth, Ingo, Gebauer, Uta
• Primary Examiner(s): Gibson, Randy W.
• Assistant Examiner(s): Bui, Hung S.
• Application Number:
  US10/210,602
• Publication Number:
  US 20030026077A1
• Time in Patent Office: 1,041 Days
• Field of Search: 361/714, 361/760, 361/752, 361/724, 361/816, 361/818, 361/797, 257/704, 257/728, 174/35.R, 174/51.2, 174/52.2
• US Class Current: 361/714
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]

Abstract

A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.

Claims

1. A subassembly comprising:

a substrate having a supporting element and at least one component disposed on said substrate;

a covering element covering the subassembly and protecting said at least one component, the covering element including a body having;

at least one substantially planar area for covering said at least one component;

mechanical support moldings, at least one of said moldings adapted to be in contact with at least one of said substrate and said supporting element disposed on the substrate after said body is mounted on the at least one subassembly;

said moldings including reinforcing moldings disposed at said planar area; and

said reinforcing moldings not contacting said components following mounting of said body and reducing compliance of said planar area; and

said planar area and said moldings being shaped and positioned to prevent displacement of said at least one component and of the covering element toward said at least one component when pressure is exerted on said body.

2. The covering element according to claim 1, wherein said at least one component is a circuit component connected to electrical contacts, in particular, a semiconductor component.

3. The covering element according to claim 2, wherein said circuit component is a semiconductor component.

4. The covering element according to claim 1, wherein at least one of said moldings is an indentation.

5. The covering element according to claim 4, wherein said indentation has an elongate flute shape.

6. The covering element according to claim 4, wherein said indentation is a hollow.

7. The covering element according to claim 1, wherein:

at least one of said moldings is an opening in said body; and

said opening has an edge at least partly contacting at least one of said substrate and said supporting element after said body is mounted on the subassembly.

8. The covering element according to claim 1, wherein said at least one molding is a thickening in said body.

9. The covering element according to claim 8, wherein said thickening is a web.

10. The covering element according to claim 1, wherein said supporting element disposed on the substrate is a pressure-insensitive component.

11. The covering element according to claim 1, wherein said reinforcing moldings form one of a configuration of ribs and a configuration of flutes.

12. The covering element according to claim 1, wherein said body is formed of metal.

13. The covering element according to claim 1, wherein said body is formed of a polymer.

14. The covering element according to claim 1, including fixing elements for fixing said body to said substrate.

15. The covering element according to claim 14, wherein said fixing elements are rivets.