Circuit board construction for use in small form factor fiber optic communication system transponders

• US 6,903,934 B2
• Filed: 09/06/2002
• Issued: 06/07/2005
• Est. Priority Date: 09/06/2002
• Status: Expired due to Fees

• Current Assignee: Stratos International Incorporated (Emerson Electric Company)
• Original Assignee: Stratos International Incorporated (Emerson Electric Company)
• Inventors: Cheng, Henju, Wang, William, Lo, WeiZen
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): Tran, Thanh Y.
• Application Number:
  US10/237,384
• Publication Number:
  US 20040047570A1
• Time in Patent Office: 1,005 Days
• Field of Search: 361/728, 361/730, 361/749, 361/752, 361/785, 361/803, 361/707, 361/709, 361/748, 361/764, 361/767, 361/789, 361/790, 361/735, 257/98, 257/678, 257/706, 439 66- 67, 385 88- 89, 385 92- 93
• US Class Current: 361/728
• CPC Class Codes: G02B 6/3897 Connectors fixed to housings, casing, frames or circuit boards G02B6/44528 takes precedence
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array

Abstract

A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features separate transmitter and receiver ports and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A Flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board using ball grid arrays having overlapping attachment structures.

Claims

1. An apparatus comprising:

a transmitter module having a first support frame, a first edge connector, a first heat sink, a first lens array, and twelve photoactive transmitting devices, wherein the first heat sink is mountable to the first support frame, the twelve photoactive transmitting devices are optically aligned with the first lens array, the first edge connector is electrically associated with the twelve photoactive transmitting devices, and the first edge connector defines a first plane;

a receiver module having a second support frame, a second edge connector, a second heat sink, a second lens array, and twelve photoactive receiving devices, wherein the second heat sink is mountable to the second support frame, the twelve photoactive receiving devices are optically aligned with the second lens array, the second edge connector is electrically associated with the twelve photoactive receiving devices, and the second edge connector defines a second plane;

a circuit board having a first side and a second side, and wherein the circuit board defines a third plane, and wherein the first plane is not co-planar with the third plane, and the second plane is not co-planar with the third plane;

a semiconductor chip electrically connected to the first side of the circuit board;

a pin-array connector electrically connected to the second side of the circuit board;

a flex circuit electrically connected to the circuit board, the first edge connector, and the second edge connector; and

a housing mechanically securing the transmitter module, the receiver module, and the circuit board, and wherein the housing includes a third heat sink.

2. An apparatus according to claim 1 wherein the pin-array connector is adapted to connect to a computer.

3. An apparatus according to claim 1 wherein the transmitter module includes a receptacle adapted to receive an MTP connector.

4. An apparatus according to claim 1 wherein the semiconductor chip is a Serializer/Deserializer semiconductor chip.

5. An apparatus according to claim 1 wherein the twelve photoactive transmitting devices are VCSELs.

6. An apparatus according to claim 1 wherein the twelve photoactive receiving devices are PIN diodes.

7. An apparatus according to claim 1 wherein the circuit board includes vies which electrically associate the semiconductor chip to the pin-array connector.