Method of embedding optical fiber in multilayer printed circuit board

• US 6,905,569 B2
• Filed: 04/16/2003
• Issued: 06/14/2005
• Est. Priority Date: 08/16/2002
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Young-Woo, Yang, Dek-Gin, Cho, Young-Sang, Yim, Kyu-Hyok
• Primary Examiner(s): Haran, John T.
• Application Number:
  US10/414,688
• Publication Number:
  US 20040031555A1
• Time in Patent Office: 790 Days
• Field of Search: 156/153, 156/272.2, 156/275.5, 156/275.7, 156/293, 156/298, 385/14, 298/25, 298/29, 298/30, 298/31, 298/32, 174/250, 361/748, 361/761
• US Class Current: 156/293
• CPC Class Codes: G02B 6/3608 Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets optical ribbon cables in support members G02B6/4401
• CPC Class Codes: G02B 6/3612 Wiring methods or machines
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3676 Stacked arrangement
• CPC Class Codes: G02B 6/3684 characterised by the manufacturing process of surface profiling of the supporting carrier manufacturing microsystems per se B81C1/00015
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate

Abstract

There is disclosed a method of embedding an optical fiber in the miltilayer printed circuit board without causing chemical or thermal damage to the optical fiber, in which a groove is formed on a substrate consisting of a dielectric substrate layer having a conductive layer formed on one side thereof, for example by a router bit process, the optical fiber is embedded in the groove using an adhesive liquid to give a optical substrate, and then at least one printed circuit board is laminated on and under the single optical substrate or the layered structure of two or more of the optical substrate.

Claims

1. A method of embedding at least one optical fiber in a multilayer printed circuit board, comprising the following steps of:

a) providing a substrate consisting of a dielectric substrate layer having a conductive layer formed on one side thereof;

b) forming at least one groove for receiving the optical fiber on the dielectric substrate layer of the substrate;

c) coating an adhesive liquid at least on an inner surface of the groove;

d) inserting the optical fiber in the coated groove;

e) hardening the adhesive liquid coated on the inner surface of the groove, thereby securing the optical fiber into the groove to form an optical substrate; and

f) laminating at least one printed circuit board on each side of the optical substrate.

2. The method as defined in claim 1, wherein said at least one printed circuit board is a single side printed circuit board having a circuit layer formed on one side thereof, or a double side printed circuit board having circuit layers formed on both sides thereof.

3. The method as defined in claim 2, wherein the step f) is conducted with a dielectric adhesive layer being interposed between the printed circuit board and optical substrate, with proviso that the double side printed circuit board is laminated on the side of the optical substrate.

4. The method as defined in claim 1, wherein the adhesive liquid is hardened by heat or ultraviolet light.

5. The method as defined in claim 1, wherein the adhesive liquid is an epoxy-based adhesive liquid.

6. The method as defined in claim 1, wherein the optical fiber consists of a core and a cladding layer surrounding the core, the core and the cladding layer being made of glass.

7. The method as defined in claim 1, wherein the dielectric substrate layer is made of material selected from the group consisting of resin impregnated fiber glass cloth, polyimide, FR-4, resincyanate ester, teflon (PTFE), polyethylene ether, and a combination thereof.

8. The method as defined in claim 3, wherein the dielectric adhesive layer is a prepreg.

9. The method as defined in claim 1, wherein the adhesive liquid is selectively coated on an inner surface of the groove during the step c).

10. The method as defined in claim 1, further comprising, between the steps d) and e), the following steps of:

i) firmly contacting the inserted optical fiber with the inner surface of the groove using a squeegee, and

ii) scraping off the adhesive liquid coated on a portion other than the groove,

with proviso that the adhesive liquid is coated on the dielectric substrate layer in which the groove is formed during the step c).

11. The method as defined in claim 1, wherein the step b) is carried out by a router bit process.

12. A method of embedding at least one optical fiber in a multilayer printed circuit board, comprising the following steps of:

a) providing a substrate consisting of a dielectric substrate layer having a conductive layer formed on one side thereof;

b) forming at least one groove for receiving the optical fiber on the dielectric substrate layer of the substrate;

c) coating an adhesive liquid at least on an inner surface of the groove;

d) inserting the optical fiber in the coated groove;

e) hardening the adhesive liquid coated on the inner surface of the groove, thereby securing the optical fiber into the groove to form an optical substrate;

f) layering two or more of the optical substrate by use of a dielectric adhesive layer, said dielectric adhesive layer being interposed between said optical substrates to give a layered structure of the optical substrates; and

g) laminating at least one printed circuit board on each side of the resulting layered structure.

13. The method as defined in claim 12, wherein the dielectric adhesive layer is a prepreg.

14. The method as defined in claim 12, wherein said at least one printed circuit board is a single side printed circuit board having a circuit layer formed on one side thereof, or a double side printed circuit board having circuit layers formed on both sides thereof.

15. The method as defined in claim 14, wherein the step g) is conducted with a dielectric adhesive layer being interposed between the printed circuit board and optical substrate, with proviso that the double side printed circuit board is laminated on the side of the optical substrate.

16. The method as defined in claim 12, wherein the adhesive liquid is hardened by heat or ultraviolet light.

17. The method as defined in claim 12, wherein the adhesive liquid is an epoxy-based adhesive liquid.

18. The method as defined in claim 12, wherein the step b) is carried out by a router bit process.

19. The method as defined in claim 12, wherein the adhesive liquid is selectively coated on an inner surface of the groove during the step c).

20. The method as defined in claim 12, further comprising, between the steps d) and e), the following steps of:

i) firmly contacting the inserted optical fiber with the inner surface of the groove using a squeegee, and

ii) scraping off the adhesive liquid coated on a portion other than the groove,

with proviso that the adhesive liquid is coated on the dielectric substrate layer in which the groove is formed during the step c).

21. The method as defined in claim 12, wherein the optical fiber consists of a core and a cladding layer surrounding the core, the core and the cladding layer being made of glass.

22. The method as defined in claim 12, wherein the dielectric substrate layer is made of material selected from the group consisting of resin impregnated fiber glass cloth, polyimide, FR-4, resincyanate ester, teflon (PTFE), polyethylene ether, and a combination thereof.