Method for processing multiple semiconductor devices for test

• US 6,905,891 B2
• Filed: 02/28/2002
• Issued: 06/14/2005
• Est. Priority Date: 02/28/2002
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Cochran, Patrick B., Kovar, Gary J., Pham, Tim V.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Andujar, Leonardo
• Application Number:
  US10/085,694
• Publication Number:
  US 20030160315A1
• Time in Patent Office: 1,202 Days
• Field of Search: 438 14- 18, 257/655
• US Class Current: 438/14
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A packaged array (10) having a temporary substrate (20) is used to test a plurality of semiconductor devices (14). In one embodiment, the temporary substrate (20) is an adhesive substrate, such as tape. A support structure (18) may lie over the temporary substrate (20) or be within the temporary substrate (20). The plurality of semiconductor devices (14) lie within an array (16, 6, or 8) and may be tested in parallel. One array or a multiple number of arrays may lie on the packaged array (10).

Claims

1. A method for testing a plurality of semiconductor die, wherein the method comprises:

providing a semiconductor wafer having a plurality of semiconductor die;

singulating the semiconductor wafer;

placing the plurality of semiconductor die directly on a temporary adhesive substrate;

placing the plurality of semiconductor die with the temporary adhesive substrate on a testing platform;

testing in parallel at least two of the plurality of semiconductor die; and

removing the temporary adhesive substrate after testing.

2. The method of claim 1, further comprising:

attaching the plurality of semiconductor die to a package substrate; and

electrically connecting at least one of the plurality of semiconductor die to the package substrate.

3. The method of claim 1, wherein singulating comprises electrically isolating the plurality of semiconductor die.

4. The method of claim 3, further comprising singulating the plurality of semiconductor die to physically separate at least two semiconductor die of the plurality of semiconductor die from each other.

5. The method of claim 1, further comprising providing a support structure in contact with the temporary adhesive substrate.

6. The method of claim 1, further comprising sorting the plurality of semiconductor die, wherein removing the temporary adhesive substrate is performed while sorting the plurality of semiconductor die.

7. The method of claim 1, further comprising forming an array using the plurality of semiconductor die prior to placing the plurality of semiconductor die on the temporary adhesive substrate.

8. The method of claim 1, wherein placing the plurality of semiconductor die on the temporary adhesive substrate forms an array.

9. The method of claim 1, wherein singulating the semiconductor wafer is performed prior to placing the plurality of semiconductor die directly on the temporary adhesive substrate, wherein placing the plurality of semiconductor die directly on the temporary adhesive substrate comprises:

placing the plurality of singulated semiconductor die directly on the temporary adhesive substrate.

10. The method of claim 1, wherein singulating the semiconductor wafer is performed after placing the plurality of semiconductor die directly on the temporary adhesive substrate, wherein placing the plurality of semiconductor die directly on the temporary adhesive substrate comprises:

placing the semiconductor wafer directly on the temporary adhesive substrate.

11. The method of claim 10, wherein singulating the semiconductor wafer is performed using a partial saw process.

12. The method of claim 10, wherein singulating is performed while the semiconductor wafer is directly on the temporary adhesive substrate.

13. A method for testing a plurality of semiconductor die, wherein the method comprises:

providing a plurality of semiconductor die;

encapsulating the plurality of semiconductor die to form an array, wherein the array has a perimeter;

placing the array on a temporary substrate;

electrically isolating the plurality of semiconductor die in the array using a partial saw process, the partial saw process leaving at least a portion of the encapsulation between at least two of the plurality of semiconductor devices;

placing the array with the temporary substrate on a testing platform;

testing at least one of the plurality of semiconductor die in the array while the array is on the temporary substrate and the testing platform; and

removing the temporary substrate.

14. The method of claim 13, wherein testing at least one of the plurality of semiconductor die in the array further comprises testing in parallel at least two of the plurality of the semiconductor die.

15. The method of claim 13, further comprising:

attaching the plurality of semiconductor die to a package substrate; and

electrically connecting at least one of the plurality of semiconductor die to the package substrate.

16. The method of claim 13, wherein electrically isolating is performed by using one of a saw and a laser.

17. The method of claim 13, further comprising, after testing, fully singulating the plurality of semiconductor die in the array to physically separate at least two semiconductor die of the plurality of semiconductor die from each other.

18. The method of claim 17, wherein singulating is performed by sawing.

19. The method of claim 13, wherein the temporary substrate is a temporary adhesive substrate.