Nanomagnetic shielding assembly

• US 6,906,256 B1
• Filed: 10/18/2002
• Issued: 06/14/2005
• Est. Priority Date: 01/22/2002
• Status: Expired due to Fees

• Current Assignee: Biophan Technologies Incorporated
• Original Assignee: Nanoset LLC
• Inventors: Wang, Xingwu
• Primary Examiner(s): Nguyen, Chau N.
• Application Number:
  US10/273,738
• Time in Patent Office: 970 Days
• Field of Search: 174/36, 174/102.SC, 174/255, 333/12, 333/243
• US Class Current: 174/36
• CPC Class Codes: A61N 1/16 Screening or neutralising undesirable influences from or using, atmospheric or terrestrial radiation or fields using atmospheric electricity or earth currents H05F3/00
• CPC Class Codes: B82Y 25/00 Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
• CPC Class Codes: H01B 11/10 Screens specially adapted for reducing interference from external sources
• CPC Class Codes: H01B 11/1083 the coating containing magnetic material
• CPC Class Codes: H01F 1/0063 in a non-magnetic matrix, e.g. granular solids granular films H01F10/007
• CPC Class Codes: H01F 10/007 ultrathin or granular films H01F10/005 and H01F10/3227 take precedence; applying ultrathin or granular layers to substrates H01F41/301
• CPC Class Codes: H01F 10/324 Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
• CPC Class Codes: Y10T 428/24983 Hardness
• CPC Class Codes: Y10T 428/24992 Density or compression of components

Abstract

An assembly that contains a substrate, nanomagnetic material, and a device for cooling the substrate. The nanomagnetic material has a mass density of at least about 0.01 grams per cubic centimeter, a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5,000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 100 nanometers.

Claims

1. An assembly comprised of a substrate, nanomagnetic material, and means for cooling said substrate, wherein said nanomagnetic material has a mass density of at least about 0.01 grams per cubic centimeter, a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5,000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 100 nanometers.

2. The assembly as recited in claim 1, wherein said nanomagnetic material is disposed over said substrate.

3. The assembly as recited in claim 2, wherein a layer of said nanomagnetic material is disposed over said substrate.

4. The assembly as recited in claim 3, wherein said assembly is implantable within a living biological organism.

5. The assembly as recited in claim 3, wherein said substrate is contiguous with a first layer of thermoelectric material.

6. The assembly as recited in claim 5, wherein said first layer of thermoelectric material is contiguous with a second layer of thermoelectric material.

7. The assembly as recited in claim 6, wherein said second layer of thermoelectric material is contiguous with said layer of said nanomagnetic material.

8. The assembly as recited in claim 1, wherein said nanomagnetic material has an average particle size of from about 2 to about 50 nanometers.

9. The assembly as recited in claim 1, wherein said nanomagnetic material is comprised of nano-sized ferrites.

10. The assembly as recited in claim 3, wherein said layer of nanomagnetic material has a thickness of from about 0.1 to about 3 microns.

11. The assembly as recited in claim 10, wherein said nanomagnetic material has an average particle size of from about 2 to about 50 nanometers.

12. The assembly as recited in claim 11, wherein said nanomagnetic material is comprised of nano-sized ferrites.

13. The assembly as recited in claim 1, wherein said means for cooling said substrate is activated when the temperature of said substrate exceeds a first temperature.

14. The assembly as recited in claim 13, wherein said means for cooling said substrate is deactivated when the temperature of said substrate drops below a second temperature.

15. The assembly as recited in claim 14, wherein said means for cooling said substrate is comprised of means for conducting electricity from a first layer of thermoelectric material to a second layer of thermoelectric material.

16. The assembly as recited in claim 15, wherein said means for cooling said substrate is comprised of means for conducting heat from said substrate to said second layer of thermoelectric material.